Flash, 1MX16, 150ns, PBGA60, FBGA-60
| Parameter Name | Attribute value |
| Maker | SHARP |
| package instruction | FBGA-60 |
| Reach Compliance Code | unknown |
| Maximum access time | 150 ns |
| Other features | TOP BOOT BLOCK |
| startup block | TOP |
| JESD-30 code | R-PBGA-B60 |
| length | 11 mm |
| memory density | 16777216 bit |
| Memory IC Type | FLASH |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 60 |
| word count | 1048576 words |
| character code | 1000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Programming voltage | 2.7 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Nominal supply voltage (Vsup) | 2.7 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| type | NOR TYPE |
| width | 8 mm |
京公网安备 11010802033920号
EEWORLD
