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MT36JBZS51272PDY-1G0XX

Description
DDR DRAM Module, 512MX8, CMOS, LEAD FREE, RDIMM-240
Categorystorage    storage   
File Size769KB,22 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT36JBZS51272PDY-1G0XX Overview

DDR DRAM Module, 512MX8, CMOS, LEAD FREE, RDIMM-240

MT36JBZS51272PDY-1G0XX Parametric

Parameter NameAttribute value
MakerMicron Technology
Parts packaging codeDIMM
package instructionLEAD FREE, RDIMM-240
Contacts240
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Other featuresSELF CONTAINED REFRESH; WD-MAX
JESD-30 codeR-XDMA-N240
length133.35 mm
memory density4294967296 bit
Memory IC TypeDDR DRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals240
word count536870912 words
character code512000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512MX8
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Maximum seat height18 mm
self refreshYES
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1 mm
Terminal locationDUAL
width4 mm
4GB (x72, ECC, QR) 240-Pin DDR3 SDRAM VLP RDIMM
Features
DDR3 SDRAM RDIMM
MT36JBZS51272PD – 4GB
For component data sheets, refer to Micron’s Web site:
www.micron.com
Features
• DDR3 functionality and operations supported as
defined in the component data sheet
• 240-pin, very low profile registered dual in-line
memory module (VLP RDIMM)
• Compatible with ATCA form factors
• Fast data transfer rates: PC3-10600, PC3-8500,
or PC3-6400
• 4GB (512 Meg x 72)
• V
DD
= 1.5V ±0.075V
• V
DDSPD
= +3.0V to +3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data and strobe signals
• Quad rank, using 2Gb TwinDie™ devices
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• Gold edge contacts
• Pb-free
• Fly-by topology
• Terminated control, command, and address bus
Figure 1:
240-Pin VLP RDIMM
(ATCA-Compatible R/C V)
PCB height: 17.9mm (0.705in)
U1
U2
U3
U4
U5
U6
U7
U8
U9
U10
Options
• Operating temperature
1
Commercial (0°C
T
A
+70°C)
Industrial (–40°C
T
A
+85°C)
• Package
240-pin DIMM (lead-free)
• Frequency/CAS latency
1.5ns @ CL = 9 (DDR3-1333)
1.5ns @ CL = 10 (DDR3-1333)
2
1.87ns @ CL = 7 (DDR3-1066)
1.87ns @ CL = 8 (DDR3-1066)
2
2.5ns @ CL = 5 (DDR3-800)
2
2.5ns @ CL = 6 (DDR3-800)
2
Marking
None
I
Y
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. Not recommended for new designs.
Table 1:
Speed
Grade
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Key Timing Parameters
Data Rate (MT/s)
Industry
Nomenclature
PC3-10600
PC3-10600
PC3-8500
PC3-8500
PC3-6400
PC3-6400
CL = 10 CL = 9
1333
1333
1333
CL = 8
1066
1066
1066
1066
CL = 7
1066
1066
CL = 6
800
800
800
800
800
800
CL = 5
800
t
RCD
(ns)
13.5
15
RP
(ns)
13.5
15
13.125
15
12.5
15
t
RC
(ns)
49.5
51
50.625
52.5
50
52.5
t
13.125
15
12.5
15
PDF: 09005aef834f3419/Source: 09005aef834f34e0
JBZS36C512x72PD.fm - Rev. A 7/08 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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