Standard SRAM, 32KX8, 15ns, BICMOS, CQCC32, LCC-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | QFJ |
| package instruction | LCC-32 |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 15 ns |
| Other features | AUTOMATIC POWER-DOWN |
| I/O type | COMMON |
| JESD-30 code | R-CQCC-N32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 32 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.286 mm |
| Maximum slew rate | 0.155 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.43 mm |
| CY7B198-15LC | CY7B199-20VCT | CY7B199-20VCR | CY7B199-20VC | CY7B198-20LMB | CY7B199-20DC | CY7B198-20LC | CY7B198-12LC | CY7B198-15LMB | CY7B199-20PC | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 32KX8, 15ns, BICMOS, CQCC32, LCC-32 | Standard SRAM, 32KX8, 20ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | Standard SRAM, 32KX8, 20ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | Standard SRAM, 32KX8, 20ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | Standard SRAM, 32KX8, 20ns, BICMOS, CQCC32, LCC-32 | Standard SRAM, 32KX8, 20ns, BICMOS, CDIP28, 0.300 INCH, CERDIP-28 | Standard SRAM, 32KX8, 20ns, BICMOS, CQCC32, LCC-32 | Standard SRAM, 32KX8, 12ns, BICMOS, CQCC32, LCC-32 | Standard SRAM, 32KX8, 15ns, BICMOS, CQCC32, LCC-32 | Standard SRAM, 32KX8, 20ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
| Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
| Parts packaging code | QFJ | SOJ | SOJ | SOJ | QFJ | DIP | QFJ | QFJ | QFJ | DIP |
| package instruction | LCC-32 | SOJ, | SOJ, | 0.300 INCH, PLASTIC, SOJ-28 | LCC-32 | 0.300 INCH, CERDIP-28 | LCC-32 | LCC-32 | LCC-32 | 0.300 INCH, PLASTIC, DIP-28 |
| Contacts | 32 | 28 | 28 | 28 | 32 | 28 | 32 | 32 | 32 | 28 |
| Reach Compliance Code | compliant | unknown | unknown | not_compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 |
| Maximum access time | 15 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 12 ns | 15 ns | 20 ns |
| Other features | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN |
| JESD-30 code | R-CQCC-N32 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-CQCC-N32 | R-GDIP-T28 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-PDIP-T28 |
| length | 13.97 mm | 17.907 mm | 17.907 mm | 17.907 mm | 13.97 mm | 37.0205 mm | 13.97 mm | 13.97 mm | 13.97 mm | 35.941 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 28 | 28 | 28 | 32 | 28 | 32 | 32 | 32 | 28 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | QCCN | SOJ | SOJ | SOJ | QCCN | DIP | QCCN | QCCN | QCCN | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.286 mm | 3.556 mm | 3.556 mm | 3.556 mm | 2.286 mm | 5.08 mm | 2.286 mm | 2.286 mm | 2.286 mm | 4.826 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | NO | YES | YES | YES | NO |
| technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal form | NO LEAD | J BEND | J BEND | J BEND | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | QUAD | DUAL |
| width | 11.43 mm | 7.5 mm | 7.5 mm | 7.5 mm | 11.43 mm | 7.62 mm | 11.43 mm | 11.43 mm | 11.43 mm | 7.62 mm |
| Is it lead-free? | Contains lead | - | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | - | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| I/O type | COMMON | - | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-609 code | e0 | - | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Encapsulate equivalent code | LCC32,.45X.55 | - | - | SOJ28,.34 | LCC32,.45X.55 | DIP28,.3 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | DIP28,.3 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | 220 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum slew rate | 0.155 mA | - | - | 0.155 mA | 0.17 mA | 0.155 mA | 0.155 mA | 0.155 mA | 0.17 mA | 0.155 mA |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |