CY7B199-20DC datasheet, PDF - EEWORLD Datasheet

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CY7B199-20DC: DescriptionStandard SRAM, 32KX8, 20ns, BICMOS, CDIP28, 0.300 INCH, CERDIP-28; Categorystorage storage; File Size165KB，7 Pages; ManufacturerCypress Semiconductor

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CY7B199-20DC Overview

Standard SRAM, 32KX8, 20ns, BICMOS, CDIP28, 0.300 INCH, CERDIP-28

CY7B199-20DC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	0.300 INCH, CERDIP-28
Contacts	28
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	20 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.0205 mm
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.155 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BICMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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Description	Standard SRAM, 32KX8, 20ns, BICMOS, CDIP28, 0.300 INCH, CERDIP-28	Standard SRAM, 32KX8, 20ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 32KX8, 20ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 32KX8, 20ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 32KX8, 20ns, BICMOS, CQCC32, LCC-32	Standard SRAM, 32KX8, 20ns, BICMOS, CQCC32, LCC-32	Standard SRAM, 32KX8, 12ns, BICMOS, CQCC32, LCC-32	Standard SRAM, 32KX8, 15ns, BICMOS, CQCC32, LCC-32	Standard SRAM, 32KX8, 15ns, BICMOS, CQCC32, LCC-32	Standard SRAM, 32KX8, 20ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Parts packaging code	DIP	SOJ	SOJ	SOJ	QFJ	QFJ	QFJ	QFJ	QFJ	DIP
package instruction	0.300 INCH, CERDIP-28	SOJ,	SOJ,	0.300 INCH, PLASTIC, SOJ-28	LCC-32	LCC-32	LCC-32	LCC-32	LCC-32	0.300 INCH, PLASTIC, DIP-28
Contacts	28	28	28	28	32	32	32	32	32	28
Reach Compliance Code	compliant	unknown	unknown	not_compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	3A001.A.2.C	EAR99	EAR99	EAR99	3A001.A.2.C	EAR99
Maximum access time	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns	12 ns	15 ns	15 ns	20 ns
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
JESD-30 code	R-GDIP-T28	R-PDSO-J28	R-PDSO-J28	R-PDSO-J28	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-PDIP-T28
length	37.0205 mm	17.907 mm	17.907 mm	17.907 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm	35.941 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	32	32	32	32	32	28
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	125 °C	70 °C	70 °C	70 °C	125 °C	70 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	DIP	SOJ	SOJ	SOJ	QCCN	QCCN	QCCN	QCCN	QCCN	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	3.556 mm	3.556 mm	3.556 mm	2.286 mm	2.286 mm	2.286 mm	2.286 mm	2.286 mm	4.826 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES	YES	YES	YES	YES	NO
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	J BEND	J BEND	J BEND	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	QUAD	QUAD	DUAL
width	7.62 mm	7.5 mm	7.5 mm	7.5 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	7.62 mm
Is it lead-free?	Contains lead	-	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	-	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
I/O type	COMMON	-	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-609 code	e0	-	-	e0	e0	e0	e0	e0	e0	e0
Encapsulate equivalent code	DIP28,.3	-	-	SOJ28,.34	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	DIP28,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	-	220	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	-	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Maximum slew rate	0.155 mA	-	-	0.155 mA	0.17 mA	0.155 mA	0.155 mA	0.155 mA	0.17 mA	0.155 mA
Terminal surface	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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