ICS83023I
D
UAL
, 1-
TO
-1
D
IFFERENTIAL
-
TO
-LVCMOS T
RANSLATOR
/B
UFFER
G
ENERAL
D
ESCRIPTION
The ICS83023I is a dual, 1-to-1 Differential-to-LVCMOS
Translator/Fanout Buffer. The differential inputs can accept
most differential signal types (LVDS, LVHSTL, LVPECL, SSTL,
and HCSL) and translate into two single-ended LVCMOS
outputs. The small 8-lead SOIC footprint makes this device
ideal for use in applications with limited board space.
Features
•
Two LVCMOS / LVTTL outputs
•
Two differential CLKx, nCLKx input pairs
•
CLK, nCLK pairs can accept the following differential
input levels: LVDS, LVPECL, LVHSTL, SSTL, HCSL
•
Maximum output frequency: 350MHz (typical)
•
Output skew: 60ps (maximum)
•
Part-to-part skew: 500ps (maximum)
•
Additive phase jitter, RMS: 0.14ps (typical)
•
Small 8 lead SOIC package saves board space
•
3.3V operating supply
•
-40°C to 85°C ambient operating temperature
•
Available in both standard and lead-free RoHS-compliant
packages
B
LOCK
D
IAGRAM
CLK0
nCLK0
CLK1
nCLK1
Q0
P
IN
A
SSIGNMENT
CLK0
nCLK0
nCLK1
CLK1
1
2
3
4
8
7
6
5
V
DD
Q0
Q1
GND
Q1
ICS83023I
8-Lead SOIC
3.8mm x 4.8mm x 1.47mm package body
M Package
Top View
83023AMI
www.idt.com
1
REV. B JULY 29, 2010
ICS83023I
D
UAL
, 1-
TO
-1
D
IFFERENTIAL
-
TO
-LVCMOS T
RANSLATOR
/B
UFFER
T
ABLE
1. P
IN
D
ESCRIPTIONS
Number
1
2
3
4
5
6
7
8
Name
CLK0
nCLK0
nCLK1
CLK1
GND
Q1
Q0
V
DD
Input
Input
Input
Input
Power
Output
Output
Power
Type
Pullup
Pullup
Description
Inver ting differential clock input.
Inver ting differential clock input.
Power supply ground.
Single clock output. LVCMOS / LVTTL interface levels.
Single clock output. LVCMOS / LVTTL interface levels.
Positive supply pin.
Pulldown Non-inver ting differential clock input.
Pulldown Non-inver ting differential clock input.
NOTE:
Pullup
and
Pulldown
refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
T
ABLE
2. P
IN
C
HARACTERISTICS
Symbol
C
IN
C
PD
R
PULLUP
R
PULLDOWN
R
OUT
Parameter
Input Capacitance
Power Dissipation Capacitance
(per output)
Input Pullup Resistor
Input Pulldown Resistor
Output Impedance
Test Conditions
Minimum
Typical
4
V
DD
= 3.6V
23
51
51
7
Maximum
Units
pF
pF
kΩ
kΩ
Ω
83023AMI
www.idt.com
2
REV. B JULY 29, 2010
ICS83023I
D
UAL
, 1-
TO
-1
D
IFFERENTIAL
-
TO
-LVCMOS T
RANSLATOR
/B
UFFER
A
BSOLUTE
M
AXIMUM
R
ATINGS
Supply Voltage, V
DD
Inputs, V
I
Outputs, V
O
4.6V
-0.5V to V
DD
+ 0.5 V
-0.5V to V
DD
+ 0.5V
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Func-
tional operation of product at these conditions or any condi-
tions beyond those listed in the
DC Characteristics
or
AC
Characteristics
is not implied. Exposure to absolute maxi-
mum rating conditions for extended periods may affect prod-
uct reliability.
Package Thermal Impedance,
θ
JA
112.7°C/W (0 lfpm)
Storage Temperature, T
STG
-65°C to 150°C
T
ABLE
3A. P
OWER
S
UPPLY
DC C
HARACTERISTICS
,
V
DD
= 3.3V±0.3V, T
A
= -40°C
TO
85°C
Symbol
V
DD
I
DD
Parameter
Positive Supply Voltage
Positive Supply Current
Test Conditions
Minimum
3.0
Typical
3.3
Maximum
3.6
20
Units
V
mA
T
ABLE
3B. LVCMOS / LVTTL DC C
HARACTERISTICS
,
V
DD
= 3.3V±0.3V, T
A
= -40°C
TO
85°C
Symbol
V
OH
V
OL
Parameter
Output High Voltage; NOTE 1
Output Low Voltage; NOTE 1
Test Conditions
Minimum
2.6
0.5
Typical
Maximum
Units
V
V
NOTE 1: Outputs terminated with 50
Ω
to V
DD
/2. See Parameter Measurement Section, 3.3V Output Load Test Circuit.
T
ABLE
3C. D
IFFERENTIAL
DC C
HARACTERISTICS
,
V
DD
= 3.3V±0.3V, T
A
= -40°C
TO
85°C
Symbol
I
IH
I
IL
V
PP
Parameter
Input High Current
Input Low Current
nCLK0, nCLK1
CLK0, CLK1
nCLK0, nCLK1
CLK0, CLK1
Test Conditions
V
IN
= V
DD
= 3.6V
V
IN
= V
DD
= 3.6V
V
IN
= 0V, V
DD
= 3.6V
V
IN
= 0V, V
DD
= 3.6V
-150
-5
1.3
V
DD
- 0.85
Minimum
Typical
Maximum
5
150
Units
µA
µA
µA
µA
V
V
Peak-to-Peak Input Voltage
0.15
Common Mode Input Voltage;
V
CMR
GND + 0.5
NOTE 1, 2
NOTE 1: For single-ended applications
,
the maximum input voltage for CLKx, nCLKx is V
DD
+ 0.3V.
NOTE 2: Common mode voltage is defined as V
IH
.
83023AMI
www.idt.com
3
REV. B JULY 29, 2010
ICS83023I
D
UAL
, 1-
TO
-1
D
IFFERENTIAL
-
TO
-LVCMOS T
RANSLATOR
/B
UFFER
T
ABLE
4. AC C
HARACTERISTICS
,
V
DD
= 3.3V±0.3V, T
A
= -40°C
TO
85°C
Symbol Parameter
f
MAX
t
PD
Maximum Output Frequency
Propagation Delay; NOTE 1
Output Skew; NOTE 2, 4
Par t-to-Par t Skew; NOTE 3, 4
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section
Output Rise Time
Output Fall Time
Output Duty Cycle
100MHz, Integration Range
(637kHz-10MHz)
0.8V to 2V
0.8V to 2V
f
≤
166MHz
1.8
Test Conditions
Minimum
Typical
350
2.1
2.4
60
500
0.14
100
100
45
250
250
50
400
400
55
57
Maximum
Units
MHz
ns
ps
ps
ps
ps
ps
%
%
t
sk(o)
t
sk(pp)
t
jit
t
R
t
F
odc
f > 166MHz
43
50
All parameters measured at f
MAX
unless noted otherwise. See Parameter Measurement Information.
NOTE 1: Measured from the differential input crossing point to V
DD
/2 of the output.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at V
DD
/2. Input clocks are phase aligned.
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured
at V
DD
/2.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
83023AMI
www.idt.com
4
REV. B JULY 29, 2010
ICS83023I
D
UAL
, 1-
TO
-1
D
IFFERENTIAL
-
TO
-LVCMOS T
RANSLATOR
/B
UFFER
A
DDITIVE
P
HASE
J
ITTER
The spectral purity in a band at a specific offset from the
fundamental compared to the power of the fundamental is
called the
dBc Phase Noise.
This value is normally expressed
using a Phase noise plot and is most often the specified plot
in many applications. Phase noise is defined as the ratio of
the noise power present in a 1Hz band at a specified offset
from the fundamental frequency to the power value of the
fundamental. This ratio is expressed in decibels (dBm) or a
0
-10
-20
-30
-40
-50
-60
ratio of the power in the 1Hz band to the power in the funda-
mental. When the required offset is specified, the phase noise
is called a
dBc
value, which simply means dBm at a specified
offset from the fundamental. By investigating jitter in the fre-
quency domain, we get a better understanding of its effects
on the desired application over the entire time record of the
signal. It is mathematically possible to calculate an expected
bit error rate given a phase noise plot.
Additive Phase Jitter
@ 100MHz
(12kHz to 20MHz)
= 0.14ps typical
SSB P
HASE
N
OISE
dBc/H
Z
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
-190
1k
10k
100k
1M
10M
100M
O
FFSET
F
ROM
C
ARRIER
F
REQUENCY
(H
Z
)
As with most timing specifications, phase noise measure-
ments have issues. The primary issue relates to the limita-
tions of the equipment. Often the noise floor of the equipment
is higher than the noise floor of the device. This is illustrated
above. The device meets the noise floor of what is shown, but
can actually be lower. The phase noise is dependant on the
input source and measurement equipment.
83023AMI
www.idt.com
5
REV. B JULY 29, 2010