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89HPES12NT3ZABCG8

Description
Bus Controller, PBGA324
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size495KB,29 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89HPES12NT3ZABCG8 Overview

Bus Controller, PBGA324

89HPES12NT3ZABCG8 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
package instructionBGA, BGA324,18X18,40
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B324
JESD-609 codee1
Humidity sensitivity level3
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
power supply1,3.3 V
Certification statusNot Qualified
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM

89HPES12NT3ZABCG8 Preview

12-lane 3-Port Non-Transparent
PCI Express® Switch
®
89HPES12NT3
Data Sheet
Preliminary Information*
Device Overview
The 89HPES12NT3 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions offering the next-generation I/O inter-
connect standard. The PES12NT3 is a 12-lane, 3-port peripheral chip
that performs PCI Express Base switching with a feature set optimized
for high performance applications such as servers, storage, and commu-
nications/networking. It provides high-performance I/O connectivity and
switching functions between a PCIe® upstream port, a transparent
downstream port, and a non-transparent downstream port.
With non-transparent bridging (NTB) functionality, the PES12NT3
can be used standalone or as a chipset with IDT PCIe System Intercon-
nect Switches in multi-host and intelligent I/O applications such as
communications, storage, and blade servers where inter-domain
communication is required.
Features
High Performance PCI Express Switch
Twelve PCI Express lanes (2.5Gbps), three switch ports
Delivers 48 Gbps (6 GBps) of aggregate switching capacity
Low latency cut-through switch architecture
Support for Max Payload size up to 2048 bytes
Supports one virtual channel and eight traffic classes
PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
Port arbitration schemes utilizing round robin
Supports automatic per port link width negotiation (x4, x2, or
x1)
Static lane reversal on all ports
Automatic polarity inversion on all lanes
Supports locked transactions, allowing use with legacy soft-
ware
Ability to load device configuration from serial EEPROM
Ability to control device via SMBus
Non-Transparent Port
Crosslink support on NTB port
Four mapping windows supported
Each may be configured as a 32-bit memory or I/O window
May be paired to form a 64-bit memory window
Interprocessor communication
Thirty-two inbound and outbound doorbells
Four inbound and outbound message registers
Two shared scratchpad registers
Allows up to sixteen masters to communicate through the non-
transparent port
No limit on the number of supported outstanding transactions
through the non-transparent bridge
Completely symmetric non-transparent bridge operation
allows similar/same configuration software to be run
Supports direct connection to a transparent or non-transparent
port of another switch
Block Diagram
3-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Non-
Transparent
Bridge
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
12 PCI Express Lanes
x4 Upstream Port and Two x4 Downstream Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
Inc.
1 of 29
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
April 11, 2007
DSC 6929
IDT 89HPES12NT3 Data Sheet
Highly Integrated Solution
Requires no external components
Incorporates on-chip internal memory for packet buffering and
queueing
Integrates twelve 2.5 Gbps embedded full duplex SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
Upstream port can be dynamically swapped with non-trans-
parent downstream port to support failover applications
Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
Supports ECRC pass-through in transparent and non-trans-
parent ports
Supports Hot-Swap
Power Management
Supports PCI Power Management Interface specification,
Revision 1.1 (PCI-PM)
Unused SerDes are disabled
Testability and Debug Features
Built in SerDes Pseudo-Random Bit Stream (PRBS) generator
Ability to read and write any internal register via the SMBus
Ability to bypass link training and force any link into any mode
Provides statistics and performance counters
Two SMBus Interfaces
Slave interface provides full access to all software-visible
registers by an external SMBus master
Master interface provides connection for an optional serial
EEPROM used for initialization
Master interface is also used by an external Hot-Plug I/O
expander
Master and slave interfaces may be tied together so the switch
can act as both master and slave
Eight General Purpose Input/Output pins
Packaged in 19x19mm 324-ball BGA with 1mm ball spacing
management. This includes round robin port arbitration, guaranteeing
bandwidth allocation and/or latency for critical traffic classes in applica-
tions such as high throughput 10 GbE I/Os, SATA controllers, and Fibre
Channel HBAs.
Switch Configuration
The PES12NT3 is a three port switch that contains 12 PCI Express
lanes. Each of the three ports is statically allocated 4 lanes with ports
labeled as A, B and C. Port A is the upstream port, port B is the trans-
parent downstream port, and port C is the non-transparent downstream
port.
During link training, link width is automatically negotiated. Each
PES12NT3 port is capable of independently negotiating to a x4, x2 or x1
width. Thus, the PES12NT3 may be used in virtually any three port
switch configuration (e.g., {x4, x4, x4}, {x4, x2, x2}, {x4, x2, x1}, etc.).
The PES12NT3 supports static lane reversal. For example, lane
reversal for upstream port A may be configured by asserting the PCI
Express Port A Lane Reverse (PEALREV) input signal or through serial
EEPROM or SMBus initialization. Lane reversal for ports B and C may
be enabled via a configuration space register, serial EEPROM, or the
SMBus.
Product Description
Utilizing standard PCI Express interconnect, the PES12NT3 provides
the most efficient high-performance I/O connectivity solution for applica-
tions requiring high throughput, low latency, and simple board layout
with a minimum number of board layers. With support for non-trans-
parent bridging, the PES12NT3, as a standalone switch or as a chipset
with IDT PCIe System Interconnect Switches, enables multi-host and
intelligent I/O applications requiring inter-domain communication. The
PES12NT3 provides 48 Gbps (6 GBps) of aggregated, full-duplex
switching capacity through 12 integrated serial lanes, using proven and
robust IDT technology. Each lane provides 2.5 Gbps of bandwidth in
both directions and is fully compliant with PCI Express Base specifica-
tion 1.0a.
The PES12NT3 is based on a flexible and efficient layered architec-
ture. The PCI Express layer consists of SerDes, Physical, Data Link and
Transaction layers in compliance with PCI Express Base specification
Revision 1.0a. The PES12NT3 can operate either as a store and
forward or cut-through switch depending on the packet size and is
designed to switch memory and I/O transactions. It supports eight Traffic
Classes (TCs) and one Virtual Channel (VC) with sophisticated resource
2 of 29
*Notice: The information in this document is subject to change without notice
April 11, 2007
IDT 89HPES12NT3 Data Sheet
CPU
PES12NT3
CPU
PES12NT3
CPU
PES12NT3
PCIe System Interconnect Switch
PCIe System Interconnect Switch
Embedded
CPU
Embedded
CPU
SATA / SAS
Embedded
CPU
GbE / 10GigE
FC
Figure 2 PCIe System Interconnect Architecture Block Diagram
Controller 1
CPU
Controller 2
CPU
PES12N3
Cache Maint. &
Possible Data Flow
x4 PCIe
x4 PCIe
PES12N3
x4 PCIe
FC
Controller
FC
Controller
Storage
To Server
FC 2Gb/s and
4Gb/s
FC 2Gb/s and
4Gb/s
To Server
Figure 3 Dual Host Storage System
3 of 29
April 11, 2007
IDT 89HPES12NT3 Data Sheet
Pin Description
The following tables list the functions of the pins provided on the PES12NT3. Some of the functions listed may be multiplexed onto the same pin.
The active polarity of a signal is defined using a suffix. Signals ending with an “N” are defined as being active, or asserted, when at a logic zero (low)
level. All other signals (including clocks, buses, and select lines) will be interpreted as being active, or asserted, when at a logic one (high) level.
Signal
PEALREV
Type
I
Name/Description
PCI Express Port A Lane Reverse.
When this bit is asserted, the lanes of
PCI Express Port A are reversed. This value may be overridden by modify-
ing the value of the PALREV bit in the PA_SWCTL register.
PCI Express Port A Serial Data Receive.
Differential PCI Express receive
pairs for port A.
PCI Express Port A Serial Data Transmit.
Differential PCI Express trans-
mit pairs for port A
PCI Express Port B Lane Reverse.
When this bit is asserted, the lanes of
PCI Express Port B are reversed. This value may be overridden by modify-
ing the value of the PBLREV bit in the PA_SWCTL register.
PCI Express Port B Serial Data Receive.
Differential PCI Express receive
pairs for port B.
PCI Express Port B Serial Data Transmit.
Differential PCI Express trans-
mit pairs for port B
PCI Express Port C Lane Reverse.
When this bit is asserted, the lanes of
PCI Express Port C are reversed. This value may be overridden by modify-
ing the value of the PCLREV bit in the PA_SWCTL register.
PCI Express Port C Serial Data Receive.
Differential PCI Express receive
pairs for port C.
PCI Express Port C Serial Data Transmit.
Differential PCI Express trans-
mit pairs for port C
PCI Express Reference Clock.
Differential reference clock pair input. This
clock is used as the reference clock by on-chip PLLs to generate the clocks
required for the system logic and on-chip SerDes. The frequency of the dif-
ferential reference clock is determined by the REFCLKM signal.
PCI Express Reference Clock Mode Select.
These signals select the fre-
quency of the reference clock input.
0x0 - 100 MHz
0x1 - 125 MHz
Table 1 PCI Express Interface Pins
PEARP[3:0]
PEARN[3:0]
PEATP[3:0]
PEATN[3:0]
PEBLREV
I
O
I
PEBRP[3:0]
PEBRN[3:0]
PEBTP[3:0]
PEBTN[3:0]
PECLREV
I
O
I
PECRP[3:0]
PECRN[3:0]
PECTP[3:0]
PECTN[3:0]
PEREFCLKP[1:0]
PEREFCLKN[1:0]
I
O
I
REFCLKM
I
Signal
MSMBADDR[4:1]
MSMBCLK
Type
I
I/O
Name/Description
Master SMBus Address.
These pins determine the SMBus address of the
serial EEPROM from which configuration information is loaded.
Master SMBus Clock.
This bidirectional signal is used to synchronize
transfers on the master SMBus. It is active and generating the clock only
when the EEPROM or I/O Expanders are being accessed.
Master SMBus Data.
This bidirectional signal is used for data on the mas-
ter SMBus.
Table 2 SMBus Interface Pins (Part 1 of 2)
MSMBDAT
I/O
4 of 29
April 11, 2007
IDT 89HPES12NT3 Data Sheet
Signal
SSMBADDR[5,3:1]
SSMBCLK
SSMBDAT
Type
I
I/O
I/O
Name/Description
Slave SMBus Address.
These pins determine the SMBus address to
which the slave SMBus interface responds.
Slave SMBus Clock.
This bidirectional signal is used to synchronize trans-
fers on the slave SMBus.
Slave SMBus Data.
This bidirectional signal is used for data on the slave
SMBus.
Table 2 SMBus Interface Pins (Part 2 of 2)
Signal
GPIO[0]
Type
I/O
Name/Description
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PEBRSTN
Alternate function pin type: Output
Alternate function: Reset output for downstream port B
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PECRSTN
Alternate function pin type: Output
Alternate function: Reset output for downstream port C
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PALINKUPN
Alternate function pin type: Output
Alternate function: Port A link up status output
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PBLINKUPN
Alternate function pin type: Output
Alternate function: Port B link up status output
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PCLINKUPN
Alternate function pin type: Output
Alternate function: Port C link up status output
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: FAILOVERP
Alternate function pin type: Input
Alternate function: NTB upstream port failover
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Table 3 General Purpose I/O Pins
GPIO[1]
I/O
GPIO[2]
I/O
GPIO[3]
I/O
GPIO[4]
I/O
GPIO[5]
I/O
GPIO[6]
GPIO[7]
I/O
I/O
5 of 29
April 11, 2007

89HPES12NT3ZABCG8 Related Products

89HPES12NT3ZABCG8 89HPES12NT3ZABC8
Description Bus Controller, PBGA324 Bus Controller, PBGA324
Is it Rohs certified? conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
package instruction BGA, BGA324,18X18,40 BGA, BGA324,18X18,40
Reach Compliance Code compliant compliant
JESD-30 code S-PBGA-B324 S-PBGA-B324
Number of terminals 324 324
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
power supply 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified
surface mount YES YES
Temperature level COMMERCIAL COMMERCIAL
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM

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