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ES51F3D30N-12.800M

Description
TCXO, CLIPPED SINE OUTPUT, 12.8 MHz, METAL, DIP-14/4
CategoryPassive components    oscillator   
File Size114KB,4 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Download Datasheet Parametric View All

ES51F3D30N-12.800M Overview

TCXO, CLIPPED SINE OUTPUT, 12.8 MHz, METAL, DIP-14/4

ES51F3D30N-12.800M Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerECLIPTEK
Reach Compliance Codeunknown
Ageing1 PPM/YEAR
Frequency Adjustment - MechanicalYES
frequency stability3%
Manufacturer's serial numberES51F3
Installation featuresTHROUGH HOLE MOUNT
Nominal operating frequency12.8 MHz
Maximum operating temperature75 °C
Minimum operating temperature-30 °C
Oscillator typeCLIPPED SINE
Output impedance10000 Ω
Output level1 V
physical size18.3mm x 11.7mm x 4.8mm
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountNO

ES51F3D30N-12.800M Preview

ES51F3D30N-12.800M
ES51F3 D 30 N -12.800M
Series
5.0Vdc 14-Pin DIP Clipped Sinewave TCXO
Operating Temperature Range
-30°C to +75°C
Frequency Stability
±3.0ppm Maximum
Nominal Frequency
12.800MHz
Control Voltage
None (No Connect on Pin 1)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Stability
Frequency Stability vs. Input Voltage
Aging at 25°C
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage
Load Drive Capability
Output Logic Type
Control Voltage
Internal Trim
Modulation Bandwidth
Input Impedance
Phase Noise
Storage Temperature Range
12.800MHz
±3.0ppm Maximum (Inclusive of Operating Temperature Range)
±0.3ppm Maximum (±5%)
±1ppm/Year Maximum
±0.2ppm Maximum (±2pF)
-30°C to +75°C
5.0Vdc ±5%
1.5mA Maximum
1.0Vp-p Minimum
10kOhms//10pF
Clipped Sinewave
None (No Connect on Pin 1)
±3ppm Minimum (Top of Can)
10kHz Minimum (Measured at -3dB with a Control Voltage of 2.5Vdc)
10kOhms Typical
-70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -
145dBc at 100kHz Offset
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)
MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)
MIL-STD-883, Method 2004
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 1 of 4
ES51F3D30N-12.800M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
2
Internal Trim Access
Hole Ø3.5 ±0.5
3
4.8 ±0.3
5.0 ±1.0
4.0 ±0.3
11.7
±0.5
MARKING
ORIENTATION
2.5 ±0.3
7.62
±0.30
1.2 +0/-0.5
Ø0.50
±0.05
(x4)
3
4.0 ±0.3
4
4
CONNECTION
No Connect
Case/Ground
Output
Supply Voltage
LINE MARKING
1
2
3
15.24 ±0.40
1
ECLIPTEK
12.800M
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
18.3 ±0.5
2
OUTPUT WAVEFORM
CLOCK OUTPUT
0V
DC
V
P-P
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 2 of 4
ES51F3D30N-12.800M
Test Circuit for No Connect Option
Oscilloscope
Frequency
Counter
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.1µF
(Note 1)
Ground
R
L
= 10kOhms
C
L
= 10pF
(Note 3)
No Connect
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 3 of 4
ES51F3D30N-12.800M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
Low Temperature Solder Bath (Wave Solder) Note 1
Device is non-hermetic; Post reflow aqueous wash is not recommended
Low Temperature Solder Bath (Wave Solder) Note 2
Temperatures shown are applied to back of PCB board and device leads only.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 4 of 4
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