Agilent HCPL-0708
High Speed
CMOS Optocoupler
Data Sheet
Features
• +5 V CMOS compatibility
• 15 ns typical pulse width distortion
• 30 ns max. pulse width distortion
Description
Available in SO-8 package, the
HCPL-0708 optocoupler utilizes the
latest CMOS IC technology to
achieve outstanding performance
with very low power consumption.
Basic building blocks of the HCPL-
0708 are a high speed LED and a
CMOS detector IC. The detector
incorporates an integrated
photodiode, a high-speed trans-
impedance amplifier, and a voltage
comparator with an output driver.
• 40 ns max. propagation delay
skew
• High speed: 15 MBd
• 60 ns max. propagation delay
• 10 kV/µs minimum common mode
rejection
• –40 to 100°C temperature range
• Safety and regulatory approvals
pending
– UL recognized
2500 V rms for 1 min. per
UL 1577 for HCPL-0708
– CSA component acceptance
Notice #5
– VDE 0884 (TUV) approved for
HCPL-0708 Option 060
Applications
• Scan drive in PDP
• Digital field bus isolation:
DeviceNet, SDS, Profibus
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
• DC/DC converter
Functional Diagram
NC
1
8
V
DD
ANODE
2
7
NC
CATHODE
3
6
V
O
NC
4
5
GND
TRUTH TABLE
LED
OFF
ON
V
O
, OUTPUT
H
L
*A 0.1
µF
bypass capacitor
must be connected between
pins 5 and 8.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
Specify Part Number followed by Option Number (if desired)
Example
HCPL-0708#XXX
060 = VDE0884 Option.
500 = Tape and Reel Packaging Option.
Package Outline Drawing
HCPL-0708 (Small Outline SO-8 Package)
8
7
6
XXX
YWW
5
5.842 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER (LAST 3 DIGITS)
2
3
4
1.270 BSG
(0.050)
DATE CODE
PIN 1
ONE
0.381 ± 0.076
(0.016 ± 0.003)
5.080 ± 0.005
(0.200 ± 0.005)
7°
45° X 0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0.152 ± 0.051
(0.006 ± 0.002)
0.305
MIN.
(0.012)
0.228 ± 0.025
(0.009 ± 0.001)
DIMENSIONS IN MILLIMETERS AND (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
*OPTION 500 NOT MARKED.
2
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Regulatory Information
The HCPL-0708 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
VDE
Approved according to
VDE 0884/06.92,
File 6591-23-4880-1005.
TUV
Approved according to
VDE 0884/06.92, Certificate
R9650938.
Insulation and Safety Related Specifications
Parameter
Symbol
Minimum External Air
L(I01)
Gap (Clearance)
Minimum External
L(I02)
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
3
CTI
Value
4.9
4.8
0.08
Units
mm
mm
mm
≥175
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
VDE 0884 Insulation Related Characteristics (Option 060)
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤150
V rms
for rated mains voltage
≤300
V rms
for rated mains voltage
≤450
V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b†
V
IORM
x 1.875 = V
PR
, 100% Production
Test with t
m
= 1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a†
V
IORM
x 1.5 = V
PR
, Type and Sample Test,
t
m
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage†
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Thermal Derating curve, Figure 11.)
Case Temperature
Input Current
Output Power
Insulation Resistance at T
S
, V
10
= 500 V
Symbol
HCPL-0708 Option 060
I-IV
I-III
55/85/21
2
560
1050
Units
V
IORM
V
PR
V peak
V peak
V
PR
840
V peak
V
IOTM
4000
V peak
T
S
I
S,INPUT
P
S,OUTPUT
R
IO
150
150
600
≥10
9
°C
mA
mW
Ω
†Refer to the front of the optocoupler section of the
Isolation and Control Component Designer’s Catalog,
under Product Safety Regulations section
(VDE 0884), for a detailed description.
Note: These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data shall be
ensured by means of protective circuits.
Note: The surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
[1]
Supply Voltages
Output Voltage
Average Output Current
Average Forward Input Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
S
T
A
V
DD
V
O
I
O
I
F
Max.
Units
125
°C
+100
°C
6
Volts
V
DD2
+0.5
Volts
2
mA
20
mA
260°C for 10 sec., 1.6 mm below seating plane
See
Solder Reflow Temperature Profile
Section
Min.
–55
–40
0
–0.5
Figure
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Current (ON)
4
Symbol
T
A
V
DD
I
F
Min.
–40
4.5
10
Max.
+100
5.5
16
Units
°C
V
mA
Figure
1, 2
Electrical Specifications
Over recommended temperature (T
A
= –40°C to +100°C) and 4.5 V
≤
V
DD
≤
5.5 V.
All typical specifications are at T
A
= 25°C, V
DD
= +5 V.
Parameter
Input Forward Voltage
Input Reverse
Breakdown Voltage
Logic High Output
Voltage
Logic Low Output
Voltage
Input Threshold Current
Logic Low Output
Supply Current
Logic High Output
Supply Current
Symbol
V
F
BV
R
V
OH
V
OL
I
TH
I
DDL
I
DDH
Min.
1.3
5
4.0
Typ.
1.5
Max.
1.8
Units
V
V
V
0.1
8.2
14.0
11.0
V
mA
mA
mA
Test Conditions
I
F
= 12 mA
I
R
= 10
µA
I
F
= 0, I
O
= –20
µA
I
F
= 12 mA, I
O
= 20
µA
I
OL
= 20
µA
I
F
= 12 mA
I
F
= 0
2
4
3
Fig.
1
Notes
4.8
0.01
6.0
4.5
Switching Specifications
Over recommended temperature (T
A
= –40°C to +100°C) and 4.5 V
≤
V
DD
≤
5.5 V.
All typical specifications are at T
A
= 25°C, V
DD
= +5 V.
Parameter
Propagation Delay Time
to Logic Low Output
Propagation Delay Time
to Logic High Output
Pulse Width
Pulse Width Distortion
Propagation Delay Skew
Output Rise Time
(10 - 90%)
Output Fall Time
(90 - 10%)
Common Mode
Transient Immunity at
Logic High Output
Common Mode
Transient Immunity at
Logic Low Output
Symbol
t
PHL
t
PLH
PW
|PWD|
t
PSK
t
R
t
F
|CM
H
|
10
20
25
15
Min.
20
13
100
0
Typ.
35
21
Max.
60
60
Units
ns
ns
ns
ns
ns
ns
ns
kV/µs
Test Conditions
I
F
= 12 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 12 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 12 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 12 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 12 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 12 mA, C
L
= 15 pF
CMOS Signal Levels
V
CM
= 1000 V, T
A
= 25°C,
I
F
= 0 mA
V
CM
= 1000 V, T
A
= 25°C,
I
F
= 12 mA
Fig.
5
5
Notes
1
1
14
30
40
2
3
2
3
4
4
|CM
L
|
10
15
kV/µs
5
5
5
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