S6A thru S6M
S6A thru S6M
SMC/DO-214AB
®
Pb
Pb Free Plating Product
6.0 Ampere Surface Mount Glass Passivated General Purpose Rectifier
Features
¬
Low forward voltage drop
¬
High current capability
¬
Low reverse leakage current
¬
High surge current capability
¬
Glass passivated chip junction
Unit: inch (mm)
.128(3.25)
.108(2.75)
Mechanical Data
¬
¬
¬
¬
¬
¬
Case: Molded plastic SMC/DO-214AB
Epoxy: UL 94V-0 rate flame retardant
Terminals: Solderable per MIL-STD-750
method 2026
Polarity:Color band denotes cathode end
Mounting position: Any
Weight: 0.21 gram approximately
.103(2.62)
.079(2.00)
.280(7.11)
.260(6.60)
.012(.305)
.006(.152)
.050(1.27)
.030(0.76)
.320(8.13)
.305(7.75)
.008(.203)
.002(.051)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25
o
C
ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
SYMBOL
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified
Current T
A
=75
C
Peak Forward Surge Current, 8.3ms single
Half sine-wave superimposed on rated load
(JEDEC method)
Maximum Instantaneous Forward Voltage
@ 6.0 A
Maximum DC Reverse Current @T
J
=25
C
o
At Rated DC Blocking Voltage @T
J
=125
C
Typical junction Capacitance (Note 1)
Typical Thermal Resistance (Note 2)
Operating Junction and Storage
Temperature Range
NOTES : (1) Thermal Resistance junction to ambient.
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts DC.
o
o
.245(6.22)
.220(5.59)
S6A
50
35
50
S6B
100
70
100
S6D
200
140
200
S6G
400
280
400
6.0
S6J
600
420
600
S6K
800
560
800
S6M
1000
700
1000
UNIT
V
V
V
A
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
150
A
V
F
I
R
C
J
R
JA
1.1
10.0
250
50
20
-65 to +150
o
V
uA
uA
pF
C/W
o
T
J
,T
STG
C
Rev.02
© 2006 Thinki Semiconductor Co.,Ltd.
Page 1/2
http://www.thinkisemi.com/
S6A thru S6M
®
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
6.5
AVERAGE FORWARD CURRENT AMPERES
FIG.2 - MAXIMUM NON-REPETITIVE
PEAK FORWARD SURGE CURRENT
100
6
5
PEAK FORWARD SURGE CURRENT,
AMPERES
4
3
Single PhaseHalf Wave 60Hz
Resistive of Inductive Load
Ground plane
1" x 1" Copper
surface area
PC BOARD
Recommanded
PC Board
Pulse Width 8.3ms
Single Half-Sire-Wave
(JEDEC Method)
80
60
2
PC Board
Mounting
40
1
Standard PC Board
Mounting
0
0
20
40
60
80
100
120
140
o
160
180
200
20
AMBIENT TEMPERATURE. ( C)
0
1
10
100
NUMBER OF CYCLES AT 60Hz
FIG.3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
IINSTANTANEOUS FORWARD CURRENT,
AMPERES
10
FIG.4 - TYPICAL REVERSE CHARACTERISTICS
100
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
T
J
=125 C
10
o
1.0
1
0.1
0.1
T
J
=25 C
o
0.01
0.2
0.4
0.6
0.8
T
J
=25 C
PULSE WIDTH=300uS
1% DUTY CYCLE
1.0
1.2
1.4
1.6
o
0.01
0
20
40
60
80
100
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
PERCENT OF RATED PEAK REVERSE VOLTAGE,%
FIG.5 - TYPICAL JUNCTION CAPACITANCE
1000
JUNCTION CAPACITANCE, pF
T
J
= 25 C
f = 1.0 MHZ
Vsig = 50mVp-p
o
100
10
0.1
1.0
4.0
10
100
REVERSE VOLTAGE, VOLTS
Rev.02
© 2006 Thinki Semiconductor Co.,Ltd.
Page 2/2
http://www.thinkisemi.com/
PCB Design
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