USB2231-NE-03 datasheet, PDF - EEWORLD Datasheet

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USB2231-NE-03: Description5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs; CategoryThe embedded processor and controller Microcontrollers and processors; File Size735KB，26 Pages; ManufacturerSMSC; Websitehttp://www.smsc.com/

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USB2231-NE-03 Overview

5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs

USB2231-NE-03 Parametric

Parameter Name	Attribute value
Maker	SMSC
package instruction	TFQFP, TQFP128,.63SQ,16
Reach Compliance Code	compli
Other features	ALSO OPERATES AT 3.3 V NOM
maximum clock frequency	48 MHz
External data bus width	8
Host interface standard	USB
JESD-30 code	S-PQFP-G128
length	14 mm
Number of terminals	128
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Encapsulate equivalent code	TQFP128,.63SQ,16
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
Maximum seat height	1.2 mm
Maximum slew rate	70 mA
Maximum supply voltage	1.98 V
Minimum supply voltage	1.62 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.4 mm
Terminal location	QUAD
width	14 mm
uPs/uCs/peripheral integrated circuit type	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

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USB2231/USB2232

5th Generation Hi-Speed

USB Flash Media and

CIR Controller with

Integrated Card Power

FETs

PRODUCT FEATURES

CIR Controller

■

Consumer IR (CIR) Controller with support for all

popular CIR formats.

Flash Media Controller

■

Complete System Solution for interfacing

SmartMedia

(SM) or xD Picture Card

(xD)

Memory Stick

(MS), High Speed Memory Stick

(HSMS), Memory Stick PRO (MSPRO), MS Duo

Secure Digital (SD), High Speed SD, Mini-Secure

Digital (Mini-SD), TransFlash (SD),

MultiMediaCard

(MMC), Reduced Size

MultiMediaCard (RS-MMC), NAND Flash, Compact

Flash

(CF) and CF Ultra

I & II, and CF form-

factor ATA hard drives to Hi-Speed USB

—

■

Datasheet

—

■

12K Bytes of internal SRAM for general purpose

scratchpad

768 Bytes of internal SRAM for general purpose scratchpad

or program execution while re-flashing external ROM

Two, Double Buffered Bulk Endpoints

Two, Bi-directional 512 Byte Buffers for Bulk Endpoints

64 Byte RX Control Endpoint Buffer

64 Byte TX Control Endpoint Buffer

76K Byte Internal Code Space or Optional 128K Byte

External Code Space using Flash, SRAM or EPROM

memory.

Internal or External Program Memory Interface

—

■

Supports USB Bulk Only Mass Storage Compliant Bootable

BIOS

■

Support for simultaneous operation of all above

devices. (only one at a time of each of the following

groups supported: CF or ATA drive, SM or XD or

NAND, SD or MMC)

On-Chip 4-Bit High Speed Memory Stick and MS

PRO Hardware Circuitry

On-Chip firmware reads and writes High Speed

Memory Stick and MS PRO

1-bit ECC correction performed in hardware for

maximum efficiency

Hardware support for SD Security Command

Extensions

On-chip power FETs with short circuit protection for

supplying flash media card power

USB Bus Power Certified

3.3 Volt I/O with 5V input tolerance on VBUS/GPIO3

Complete USB Specification 2.0 Compatibility for Bus

Powered Operation

—

Includes Hi-Speed USB Transceiver

A Bi-directional Control and two Bi-directional Bulk

Endpoints are provided.

Provides low speed control functions

30 Mhz execution speed at 1 clock per instruction cycle

average

On Board 24Mhz Crystal Driver Circuit

Can be clocked by 48MHz external source

On-Chip 1.8V Regulator for Low Power Core

Operation

Internal PLL for 480Mhz Hi-Speed USB Sampling,

Configurable MCU clock

Supports firmware upgrade via USB bus if “boot

block” Flash program memory is used

12 GPIOs for special function use: LED indicators,

button inputs, power control to memory devices, etc.

—

Inputs capable of generating interrupts with either edge

sensitivity

Activity LED polarity/operation/blink rate

Full or Partial Card compliance checking

Bus or Self Powered

LUN configuration and assignment

Write Protect Polarity

SmartDetach

- Detach from USB when no Card Inserted

for Notebook apps

Cover Switch operation for xD compliance

Inquiry Command operation

SD Write Protect operation

Older CF card support

Force USB 1.1 reporting

Internal or External Power FET operation

■

Attribute bit controlled features:

—

■

8051 8 bit microprocessor

—

■

Compatible with Microsoft WinXP, WinME, Win2K

SP3, Apple OS10, Softconnex, and Linux Multi-LUN

Mass Storage Class Drivers

Win2K, Win98/98SE and Apple OS8.6 and OS9

Multi-LUN Mass Storage Class Drivers available from

SMSC

128 Pin TQFP Package (1.0mm height, 14mmx14mm

footprint); green, lead-free package also available.

1.xD Picture Card not applicable to USB2231

SMSC USB2231/USB2232

DATASHEET

Revision 1.3 (07-12-05)

5th Generation Hi-Speed USB Flash Media and CIR Controller with Integrated Card Power FETs

Datasheet

ORDER NUMBER(S):

USB2231/USB2232-NE-03 FOR 128 PIN, TQFP PACKAGE; USB2231/USB2232-NU-03 FOR 128 PIN, TQFP

PACKAGE (GREEN LEAD-FREE) PACKAGE

80 Arkay Drive

Hauppauge, NY 11788

(631) 435-6000

FAX (631) 273-3123

Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently,

complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be

accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any

time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this

information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual

property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated

version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may

contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly

sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other

application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written

approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other

SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a

registered trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective

holders.

SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED

WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE,

AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE

LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA,

PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT;

NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY

OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE

POSSIBILITY OF SUCH DAMAGES.

Revision 1.3 (07-12-05)

DATASHEET

SMSC USB2231/USB2232

5th Generation Hi-Speed USB Flash Media and CIR Controller with Integrated Card Power FETs

Datasheet

Table of Contents

Chapter 1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Chapter 2 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Chapter 3 Pin Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1

3.2

128-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

128-Pin List Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chapter 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Chapter 5 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Chapter 6 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.1

6.2

PIN Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Chapter 7 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.1

7.2

7.3

Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Chapter 8 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Chapter 9 GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

SMSC USB2231/USB2232

DATASHEET

Revision 1.3 (07-12-05)

USB2231-NE-03 Related Products

	USB2231-NE-03	USB2232-NU-03	USB2232	USB2232-NE-03	USB2231-NU-03	USB2231
Description	5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs	5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs	5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs	5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs	5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs	5th GENERATION HI-SPEED USB FLASH MEDIA AND CIR CONTROLLER WITH INTEGRATED CARD POWER FETs
Maker	SMSC	SMSC	-	SMSC	SMSC	-
package instruction	TFQFP, TQFP128,.63SQ,16	TFQFP, TQFP128,.63SQ,16	-	TFQFP, TQFP128,.63SQ,16	TFQFP, TQFP128,.63SQ,16	-
Reach Compliance Code	compli	compli	-	compli	compli	-
Other features	ALSO OPERATES AT 3.3 V NOM	ALSO OPERATES AT 3.3 V NOM	-	ALSO OPERATES AT 3.3 V NOM	ALSO OPERATES AT 3.3 V NOM	-
maximum clock frequency	48 MHz	48 MHz	-	48 MHz	48 MHz	-
External data bus width	8	8	-	8	8	-
Host interface standard	USB	USB	-	USB	USB	-
JESD-30 code	S-PQFP-G128	S-PQFP-G128	-	S-PQFP-G128	S-PQFP-G128	-
length	14 mm	14 mm	-	14 mm	14 mm	-
Number of terminals	128	128	-	128	128	-
Maximum operating temperature	70 °C	70 °C	-	70 °C	70 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TFQFP	TFQFP	-	TFQFP	TFQFP	-
Encapsulate equivalent code	TQFP128,.63SQ,16	TQFP128,.63SQ,16	-	TQFP128,.63SQ,16	TQFP128,.63SQ,16	-
Package shape	SQUARE	SQUARE	-	SQUARE	SQUARE	-
Package form	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	-	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	-
Maximum seat height	1.2 mm	1.2 mm	-	1.2 mm	1.2 mm	-
Maximum slew rate	70 mA	70 mA	-	70 mA	70 mA	-
Maximum supply voltage	1.98 V	1.98 V	-	1.98 V	1.98 V	-
Minimum supply voltage	1.62 V	1.62 V	-	1.62 V	1.62 V	-
Nominal supply voltage	1.8 V	1.8 V	-	1.8 V	1.8 V	-
surface mount	YES	YES	-	YES	YES	-
technology	CMOS	CMOS	-	CMOS	CMOS	-
Temperature level	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	-
Terminal form	GULL WING	GULL WING	-	GULL WING	GULL WING	-
Terminal pitch	0.4 mm	0.4 mm	-	0.4 mm	0.4 mm	-
Terminal location	QUAD	QUAD	-	QUAD	QUAD	-
width	14 mm	14 mm	-	14 mm	14 mm	-
uPs/uCs/peripheral integrated circuit type	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	-	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	-

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