AM27LV010B-200LEB datasheet, PDF

AM27LV010B-200LEB: DescriptionUVPROM, 128KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32; Categorystorage storage; File Size466KB，20 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27LV010B-200LEB Overview

UVPROM, 128KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	QFJ
package instruction	WQCCN, LCC32,.45X.55
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	200 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	3.556 mm
Maximum standby current	0.000025 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm

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