WORLD-CHIP FSK Modem
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP28,.6 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| Other features | HALF DUPLEX; FULL DUPLEX |
| data rate | 1.2 Mbps |
| JESD-30 code | R-CDIP-T28 |
| JESD-609 code | e0 |
| length | 38.4302 mm |
| Negative supply voltage rating | -5 V |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.14 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | MOS |
| Telecom integrated circuit types | MODEM |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
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