IC LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, BGA6, DSBGA-6, Gate
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | VFBGA, BGA5,2X3,20 |
| Contacts | 6 |
| Reach Compliance Code | unknown |
| series | LVC/LCX/Z |
| JESD-30 code | R-XBGA-B6 |
| length | 1.4 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | INVERTER |
| MaximumI(ol) | 0.024 A |
| Number of functions | 2 |
| Number of entries | 1 |
| Number of terminals | 6 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA5,2X3,20 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing | TAPE AND REEL |
| power supply | 3.3 V |
| propagation delay (tpd) | 8 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 0.5 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| width | 0.9 mm |
| SN74LVC2G04MYEPREP | SN74LVC2G04MDBVREP | SN74LVC2G04MYZAREP | SN74LVC2G04MYZPREP | SN74LVC2G04MDRLREP | |
|---|---|---|---|---|---|
| Description | IC LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, BGA6, DSBGA-6, Gate | IC LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, PDSO6, SOT-23, 6 PIN, Gate | LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, BGA6, LEAD FREE, DSBGA-6 | IC LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, BGA6, LEAD FREE, DSBGA-6, Gate | LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, PDSO6, SOT-563, 6 PIN |
| Parts packaging code | BGA | SOT-23 | BGA | BGA | SOT |
| package instruction | VFBGA, BGA5,2X3,20 | LSSOP, TSOP6,.11,37 | VFBGA, BGA5,2X3,20 | VFBGA, BGA5,2X3,20 | VSOF, FL6,.047,20 |
| Contacts | 6 | 6 | 6 | 6 | 6 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown |
| series | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 code | R-XBGA-B6 | R-PDSO-G6 | R-XBGA-B6 | R-XBGA-B6 | R-PDSO-F6 |
| length | 1.4 mm | 2.9 mm | 1.4 mm | 1.4 mm | 1.6 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| Number of functions | 2 | 2 | 2 | 2 | 2 |
| Number of entries | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 6 | 6 | 6 | 6 | 6 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | VFBGA | LSSOP | VFBGA | VFBGA | VSOF |
| Encapsulate equivalent code | BGA5,2X3,20 | TSOP6,.11,37 | BGA5,2X3,20 | BGA5,2X3,20 | FL6,.047,20 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE |
| method of packing | TAPE AND REEL | TR | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| propagation delay (tpd) | 8 ns | 8 ns | 8 ns | 8 ns | 8 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO |
| Maximum seat height | 0.5 mm | 1.45 mm | 0.5 mm | 0.5 mm | 0.6 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | BALL | GULL WING | BALL | BALL | FLAT |
| Terminal pitch | 0.5 mm | 0.95 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | BOTTOM | DUAL | BOTTOM | BOTTOM | DUAL |
| width | 0.9 mm | 1.6 mm | 0.9 mm | 0.9 mm | 1.2 mm |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments |