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AM79C973KCW

Description
PCnet⑩-FAST III Single-Chip 10/100 Mbps PCI Ethernet Controller with Integrated PHY
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,304 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM79C973KCW Overview

PCnet⑩-FAST III Single-Chip 10/100 Mbps PCI Ethernet Controller with Integrated PHY

AM79C973KCW Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeQFP
package instructionQFP, QFP160,1.2SQ
Contacts16
Reach Compliance Codecompli
Address bus width32
boundary scanYES
Bus compatibilityPCI
maximum clock frequency33.33 MHz
Data encoding/decoding methodsNRZI; BIPH-LEVEL(MANCHESTER)
Maximum data transfer rate1.25 MBps
External data bus width32
JESD-30 codeS-PQFP-G16
JESD-609 codee0
length28 mm
low power modeYES
Humidity sensitivity level3
Number of serial I/Os5
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP160,1.2SQ
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.95 mm
Maximum slew rate210 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width28 mm
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, LAN
PRELIMINARY
Am79C973/Am79C975
PCnet™-FAST
III
Single-Chip 10/100 Mbps PCI Ethernet Controller with Integrated PHY
DISTINCTIVE CHARACTERISTICS
s
Single-chip PCI-to-Wire Fast Ethernet controller
— 32-bit glueless PCI host interface
— Supports PCI clock frequency from DC to
33 MHz independent of network clock
— Supports network operation with PCI clock
from 15 MHz to 33 MHz
— High performance bus mastering
architecture with integrated Direct Memory
Access (DMA) Buffer Management Unit for
low CPU and bus utilization
— PCI specification revision 2.2 compliant
— Supports PCI Subsystem/Subvendor ID/
Vendor ID programming through the
EEPROM interface
— Supports both PCI 5.0 V and 3.3 V signaling
environments
— Plug and Play compatible
— Big endian and little endian byte alignments
supported
s
Fully Integrated 10/100 Mbps Physical Layer
Interface (PHY)
— Conforms to IEEE 802.3 standard for
10BASE-T, 100BASE-TX, and 100BASE-FX
interfaces
— Integrated 10BASE-T transceiver with on-
chip filtering
— Fully integrated MLT-3 encoder/decoder for
100BASE-TX
— Provides a PECL interface for 100BASE-FX
fiber implementations
— Full-duplex capability for 10BASE-T and
100BASE-TX
— IEEE 802.3u Auto-Negotiation between 10
Mbps and 100 Mbps, half- and full-duplex op-
eration
s
Dual-speed CSMA/CD (10 Mbps and 100 Mbps)
Media Access Controller (MAC) compliant with
IEEE/ANSI 802.3 and Blue Book Ethernet
standards
s
Supports PC98/PC99 and Wired for
Management baseline specifications
— Full OnNow support including pattern
matching and link status wake-up events
— Implements AMD’s patented Magic Packet™
technology for remote wake-up & power-on
— Magic Packet mode and the physical address
loaded from EEPROM at power up without
requiring PCI clock
— Supports PCI Bus Power Management
Interface Specification Revision 1.1
— Supports Advanced Configuration and
Power Interface (ACPI) Specification Version
1.0
— Supports Network Device Class Power
Management Specification Version 1.0a
s
Serial Management Interface enables remote
alerting of system management events
— Inter-IC (I
2
C) compliant electrical interface
— System Management Bus (SMBus)
compliant signaling interface and register
access protocol
— Optional interrupt pin simplifies software
interface
s
Large independent internal TX and RX FIFOs
— Programmable FIFO watermarks for both TX
and RX operations
— RX frame queuing for high latency PCI bus
host operation
— Programmable allocation of buffer space
between RX and TX queues
s
EEPROM interface supports jumperless design
and provides through-chip programming
— Supports extensive programmability of
device operation through EEPROM mapping
s
Supports up to 1 megabyte (Mbyte) optional
Boot PROM and Flash for diskless node
application
s
Extensive programmable internal/external
loopback capabilities
s
Extensive programmable LED status support
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Publication#
21510
Rev:
E
Amendment/0
Issue Date:
August 2000
R f
t AMD’ W b it (
d
)f
th l t t i f
ti

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Is it lead-free? Contains lead - Contains lead - Contains lead Contains lead
Is it Rohs certified? incompatible - incompatible - incompatible incompatible
Maker AMD - AMD - AMD AMD
Parts packaging code QFP - QFP - QFP QFP
package instruction QFP, QFP160,1.2SQ - LFQFP, QFP176,1.0SQ,20 - QFP, QFP160,1.2SQ LFQFP, QFP176,1.0SQ,20
Contacts 16 - 176 - 16 176
Reach Compliance Code compli - compli - compli compli
Address bus width 32 - 32 - 32 32
boundary scan YES - YES - YES YES
Bus compatibility PCI - PCI - PCI PCI
maximum clock frequency 33.33 MHz - 33.33 MHz - 33.33 MHz 33.33 MHz
Data encoding/decoding methods NRZI; BIPH-LEVEL(MANCHESTER) - NRZI; BIPH-LEVEL(MANCHESTER) - NRZI; BIPH-LEVEL(MANCHESTER) NRZI; BIPH-LEVEL(MANCHESTER)
Maximum data transfer rate 1.25 MBps - 1.25 MBps - 12.5 MBps 12.5 MBps
External data bus width 32 - 32 - 32 32
JESD-30 code S-PQFP-G16 - S-PQFP-G176 - S-PQFP-G16 S-PQFP-G176
JESD-609 code e0 - e0 - e0 e0
length 28 mm - 24 mm - 28 mm 24 mm
low power mode YES - YES - YES YES
Number of serial I/Os 5 - 5 - 5 5
Number of terminals 16 - 176 - 16 176
Maximum operating temperature 70 °C - 70 °C - 70 °C 70 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP - LFQFP - QFP LFQFP
Encapsulate equivalent code QFP160,1.2SQ - QFP176,1.0SQ,20 - QFP160,1.2SQ QFP176,1.0SQ,20
Package shape SQUARE - SQUARE - SQUARE SQUARE
Package form FLATPACK - FLATPACK, LOW PROFILE, FINE PITCH - FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V - 3.3 V - 3.3 V 3.3 V
Certification status Not Qualified - Not Qualified - Not Qualified Not Qualified
Maximum seat height 3.95 mm - 1.6 mm - 3.95 mm 1.6 mm
Maximum slew rate 210 mA - 210 mA - 210 mA 210 mA
Maximum supply voltage 3.6 V - 3.6 V - 3.6 V 3.6 V
Minimum supply voltage 3 V - 3 V - 3 V 3 V
Nominal supply voltage 3.3 V - 3.3 V - 3.3 V 3.3 V
surface mount YES - YES - YES YES
technology CMOS - CMOS - CMOS CMOS
Temperature level COMMERCIAL - COMMERCIAL - COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING - GULL WING - GULL WING GULL WING
Terminal pitch 0.65 mm - 0.5 mm - 0.65 mm 0.5 mm
Terminal location QUAD - QUAD - QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 28 mm - 24 mm - 28 mm 24 mm
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, LAN - SERIAL IO/COMMUNICATION CONTROLLER, LAN - SERIAL IO/COMMUNICATION CONTROLLER, LAN SERIAL IO/COMMUNICATION CONTROLLER, LAN

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