EEWORLDEEWORLDEEWORLD

Part Number

Search

HB56A140BR-8CL

Description
Fast Page DRAM Module, 1MX40, 80ns, CMOS, SIP-72
Categorystorage    storage   
File Size57KB,7 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HB56A140BR-8CL Overview

Fast Page DRAM Module, 1MX40, 80ns, CMOS, SIP-72

HB56A140BR-8CL Parametric

Parameter NameAttribute value
MakerHitachi (Renesas )
Parts packaging codeMODULE
package instructionSIMM, SSIM72
Contacts72
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time80 ns
Other featuresRAS ONLY/CAS BEFORE RAS REFRESH
I/O typeCOMMON
JESD-30 codeR-XSMA-N72
memory density41943040 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width40
Number of functions1
Number of ports1
Number of terminals72
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX40
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeSIMM
Encapsulate equivalent codeSSIM72
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle1024
Maximum standby current0.001 A
Maximum slew rate0.9 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE
HB56A140BR Series
1,048,576-word
×
40-bit High Density Dynamic RAM Module
ADE-203-
Rev. 0.0
Dec. 1, 1995
Description
The HB56A140BR is a 1M
×
40 dynamic RAM module, mounted 10 pieces of 4-Mbit DRAM
(HM514400CS/CLS) sealed in SOJ package. An outline of the HB56A140BR is 72-pin single in-line
package. Therefore, the HB56A140BR makes high density mounting possible without surface mount
technology. The HB56A140BR provides common data inputs and outputs. Its module board has
decoupling capacitors beneath the each SOJ.
Features
72-pin single in-line package
— Lead pitch : 1.27 mm
Single 5 V (± 5%) supply
High speed
— Access time : 60 ns/70 ns/80 ns (max)
Low power dissipation
— Operating : 5.78 W/5.25 W/4.73 W (max)
— Standby : 105 mW (max)
5.25 mW (max) (L-version)
Fast page mode capability
1,024 refresh cycle : 16 ms
: 128 ms (L-version)
2 variations of refresh
RAS
-only refresh
CAS
-before-
RAS
refresh
TTL compatible

HB56A140BR-8CL Related Products

HB56A140BR-8CL HB56A140BR-7C HB56A140BR-7CL HB56A140BR-6C HB56A140BR-6CL HB56A140BR-8C
Description Fast Page DRAM Module, 1MX40, 80ns, CMOS, SIP-72 Fast Page DRAM Module, 1MX40, 70ns, CMOS, SIP-72 Fast Page DRAM Module, 1MX40, 70ns, CMOS, SIP-72 Fast Page DRAM Module, 1MX40, 60ns, CMOS, SIP-72 Fast Page DRAM Module, 1MX40, 60ns, CMOS, SIP-72 Fast Page DRAM Module, 1MX40, 80ns, CMOS, SIP-72
Maker Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
Parts packaging code MODULE MODULE MODULE MODULE MODULE MODULE
package instruction SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72
Contacts 72 72 72 72 72 72
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 80 ns 70 ns 70 ns 60 ns 60 ns 80 ns
Other features RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72
memory density 41943040 bit 41943040 bit 41943040 bit 41943040 bit 41943040 bit 41943040 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 40 40 40 40 40 40
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 72 72 72 72 72 72
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX40 1MX40 1MX40 1MX40 1MX40 1MX40
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code SIMM SIMM SIMM SIMM SIMM SIMM
Encapsulate equivalent code SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 1024 1024 1024 1024 1024 1024
Maximum standby current 0.001 A 0.01 A 0.001 A 0.01 A 0.001 A 0.01 A
Maximum slew rate 0.9 mA 1 mA 1 mA 1.1 mA 1.1 mA 0.9 mA
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Embedded C code optimization
[p=30, null, left][size=4][color=#000000][backcolor=white] When I first started working, I participated in embedded code optimization. In addition to the most basic function implementation detail algo...
Jacktang Microcontroller MCU
Coding and Debugging with MCUXpresso
[i=s]This post was last edited by freebsder on 2017-3-29 13:36[/i] [align=left][size=3] If it was 10 years ago, I would have no objection to people saying that eclipse was despised, slow and stuck. 10...
freebsder NXP MCU
Definition and difference of PCB/PWB/FPC
Definition and difference of PCB/PWB/FPC Author: AnonymousPCB is the abbreviation of Printed circuit board in English. The official translation is printed circuit board or printed circuit board, or pr...
fighting Analog electronics
100 Questions Chinese Engineers Ask about Analog-to-Digital Converter Applications
[font=Helvetica, Tahoma, Arial, sans-serif][size=5][color=#0000ff]Analog-to-Digital Converter Applications: 100 Questions for Chinese Engineers[/color][/size][/font] [size=3][color=#000080][font=Helve...
chen8710 ADI Reference Circuit
EEWORLD University ---- TINA-TI training course
TINA-TI training course : https://training.eeworld.com.cn/course/3976...
hi5 Talking
F7 Competition - Smart Community - System Interface
[align=center][b]Intelligent Community Control System Interface[/b][/align][size=6]Source Intelligent Community Team Member: [/size] [size=6] [/size] [size=6]There are still many areas that need to be...
fan5223 stm32/stm8

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2183  1408  913  2349  728  44  29  19  48  15 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号