Spark Gap Protectors (SPG)
UNB-SMD Series
Features
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Approximately zero leaking current before clamping voltage
Less decay at on/off state.
High capability to withstand repeated lightning strikes.
Low electrode capacitance (≤1.0pF) and high isolation
(≥100MΩ).
RoHS compliant.
Bilateral symmetrical.
Temperature, humidity and lightness insensitive.
Working temperature: -25℃~ +65
℃
Storage temperature: -25
℃
~ +85℃
Meets MSL level 1, per J-STD-020
Applications
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Power Supplies
Motor sparks eliminating
Relay switching spark absorbing
Data line pulse guarding
Electronic devices requiring UL497A and UL497B compliant
Telephone/Fax/Modem
High frequency signal transmitters/receivers
Satellite antenna
Radio amplifiers
Alarm systems
Cathode ray tubes in Monitors/TVs
Part Numbering
UNB -
(1)
(1)
(2)
(3)
(4)
201
(2)
M
(3)
- SMD
(4)
Series
1
V
S
Voltage, e.g. 201=20X10 =200V
V
S
Voltage tolerance: L -
±15%,
M -
±20%,
N -
±30%
Surface mount devices
Dimensions
Dimensions
L
D
d
Recommended Pad Size (mm)
T
Inches
0.197
0.106
0.102
0.016
Millimeters
5.0
2.7
2.6
0.4
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
1/4
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNB-SMD Series
Electrical Characteristics
DC Spark-over
Voltage
Vs(V)
140(98~182)
180(126~234)
200(160~240)
300(240~360)
400(320~480)
500(400~600)
Minimum
Insulation
Resistance
IR(OHM)/DC
100M / 50V
100M / 50V
100M /100V
100M /100V
100M / 250V
100M / 250V
Maximum
Capacitance
1KHZ-6Vmax
C (pF)
1.0
1.0
1.0
1.0
1.0
1.0
Surge Current
Capacity
8/20
μS
1000A
1000A
1000A
1000A
1000A
1000A
Part Number
Surge Life Test
UNB-141N-SMD
UNB-181N-SMD
UNB-201M-SMD
UNB-301M-SMD
UNB-401M-SMD
UNB-501M-SMD
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
Test Methods and Results
Items
Test Method
Measure starting discharge voltage (Vs) by gradually
increasing applied DC voltage. Test current is 0.5mA
max. And the DC voltage ascends up within
100V/s(Vs＜1000V) or 500V/s(Vs≥1000V).
Measure the insulation resistance across the terminal
at regular voltage. But the test voltage doesn’t over
the DC spark-over voltage.
Measure the electrostatic capacitance by applying a
voltage of less than 6V (at 1KHz) between terminals.
10KV with 1500pf condenser is discharged through
2KΩ resistor. 200 times at an interval of 10sec.
1.2/50μs & 8/20μs, 1000A, electrically connected with
a resistor (1~2
Ω), ±5
times, each time interval 60
seconds. Thereafter, outer appearance shall be
visually examined.
Measurement after -40
℃
/1000 HRS & normal
temperature/2 HRS.
Measurement after 125
℃
/1000 HRS & normal
temperature/2 HRS.
Measurement after humidity 90~95℃(45℃ ) /1000
HRS & normal temperature/2 HRS.
10 times repetition of cycle -40℃ /30min
→normal,
temp/2 min
→125
℃
/30min, measurement after
normal temp/2 HRS.
Apply flux and immerse in molten solder 230±5℃
for 3sec up to the point of 1.5mm from body. Check
for solder adhesion.
Measurement after lead wire is dipped up to the point
of 1.5mm from body into 260±5℃
solder for 10sec
Apply 0.5kg load for 10sec
Bend lead wire at the point of 2mm from body under
0.25 load and back to its original point. Repeat 1 time.
Standard
DC Spark-over Voltage
Insulation Resistance
Capacitance
Static Life
Rate-of-change, within±30%
insulation resistance & capacitance,
conformed to rated spec.
∣△
Vs/Vs
∣
≤30%
Characteristics of other items must meet
the specified value
Surge Current
Capacity
Cold Resistance
Heat Resistance
Humidity Resistance
Temperature Cycle
No crack and no failures
Features are conformed to rated spec
Solder Ability
Solder Heat
Pull Strength
Flexural Strength
Lead wire is evenly covered by solder
Conformed to rated spec
Lead shall not pull out to snap
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
2/4
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNB-SMD Series
Recommended Soldering Conditions
Flow Soldering Conditions
Air Preheat
Soldering
260℃
Temperature (℃)
250
Temperature (℃)
ΔT
200
150
100
50
0
60~120 sec
3~4 sec
Cooling
250
ΔT
200
150
100
50
0
60~120 sec
10 sec. or less
Reflow Soldering Conditions
Air Preheat
Soldering
260℃
Cooling
150~180℃
150~180℃
60 sec. or less
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110℃ .
3) After soldering, do not force cool, allow the parts to cool gradually.
Hand Soldering
Solder iron temperature: 350±5℃
Heating time: 3 seconds max.
General attention to soldering
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High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence
strength, and the change of characteristic may occur.
For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding
200℃ to fewer than 50 seconds.
Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash thoroughly to
remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or
a decrease in the adherence of the termination, we recommend that you use the conditions below:
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
3/4
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNB-SMD Series
Packaging
Tape
Symbol
W
E
F
D
P
P0
P2
A0
B0
K0
t
Inches
0.472±0.008
0.069±0.004
0.222±0.002
0.059±0.004
0.315±0.004
0.315±0.004
0.157±0.004
0.181±0.004
0.240±0.004
0.118±0.004
0.012±0.002
Millimeters
12.00±0.20
1.75±0.10
5.65±0.05
1.50±0.10
8.00±0.10
8.00±0.10
4.00±0.10
4.60±0.10
6.10±0.10
3.00±0.10
0.30±0.05
Reel
Symbol
D
D1
D2
W1
Inches
13.00±0.079
1.969 min
0.512±0.020
0.661±0.079
Millimeters
330.00±2.00
50 min
13.00±0.50
16.80±2.00
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
4/4
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
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