EEPROM, 2KX8, 150ns, Parallel, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24
| Parameter Name | Attribute value |
| Maker | Atmel (Microchip) |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 150 ns |
| Other features | AUTOMATIC WRITE |
| JESD-30 code | R-PDSO-G24 |
| length | 15.4 mm |
| memory density | 16384 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.65 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 7.5 mm |
| AT28C16-15SCT/R | AT28C16E-15SCT/R | AT28C16-15JIT/R | AT28C16-15JCT/R | AT28C16-15SIT/R | AT28C16E-15JIT/R | AT28C16E-15SIT/R | AT28C16E-15JCT/R | |
|---|---|---|---|---|---|---|---|---|
| Description | EEPROM, 2KX8, 150ns, Parallel, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | EEPROM, 2KX8, 150ns, Parallel, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | EEPROM, 2KX8, 150ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 | EEPROM, 2KX8, 150ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 | EEPROM, 2KX8, 150ns, Parallel, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | EEPROM, 2KX8, 150ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 | EEPROM, 2KX8, 150ns, Parallel, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | EEPROM, 2KX8, 150ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 |
| Parts packaging code | SOIC | SOIC | QFJ | QFJ | SOIC | QFJ | SOIC | QFJ |
| package instruction | SOP, | SOP, | QCCJ, | QCCJ, | SOP, | PLASTIC, LCC-32 | SOP, | QCCJ, |
| Contacts | 24 | 24 | 32 | 32 | 24 | 32 | 24 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns |
| Other features | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE |
| JESD-30 code | R-PDSO-G24 | R-PDSO-G24 | R-PQCC-J32 | R-PQCC-J32 | R-PDSO-G24 | R-PQCC-J32 | R-PDSO-G24 | R-PQCC-J32 |
| length | 15.4 mm | 15.4 mm | 13.97 mm | 13.97 mm | 15.4 mm | 13.97 mm | 15.4 mm | 13.97 mm |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 32 | 32 | 24 | 32 | 24 | 32 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | QCCJ | QCCJ | SOP | QCCJ | SOP | QCCJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.65 mm | 2.65 mm | 3.55 mm | 3.55 mm | 2.65 mm | 3.55 mm | 2.65 mm | 3.55 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal form | GULL WING | GULL WING | J BEND | J BEND | GULL WING | J BEND | GULL WING | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD |
| width | 7.5 mm | 7.5 mm | 11.43 mm | 11.43 mm | 7.5 mm | 11.43 mm | 7.5 mm | 11.43 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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