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UPD23C16080BLGY-XXX-MJH

Description
IC,ROM,1MX16/2MX8,CMOS,TSSOP,48PIN,PLASTIC
Categorystorage    storage   
File Size369KB,24 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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UPD23C16080BLGY-XXX-MJH Overview

IC,ROM,1MX16/2MX8,CMOS,TSSOP,48PIN,PLASTIC

UPD23C16080BLGY-XXX-MJH Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Reach Compliance Codecompliant
Maximum access time90 ns
Spare memory width8
JESD-30 codeR-PDSO-G48
memory density16777216 bit
Memory IC TypeMASK ROM
memory width16
Number of terminals48
word count1048576 words
character code1000000
Maximum operating temperature70 °C
Minimum operating temperature-10 °C
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP48,.71,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply3/3.3 V
Certification statusNot Qualified
Maximum standby current0.00003 A
Maximum slew rate0.055 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD23C16040BL, 23C16080BL
16M-BIT MASK-PROGRAMMABLE ROM
2M-WORD BY 8-BIT (BYTE MODE) / 1M-WORD BY 16-BIT (WORD MODE)
PAGE ACCESS MODE
Description
The
µ
PD23C16040BL and
µ
PD23C16080BL are 16,777,216 bits mask-programmable ROM. The word organization is
selectable (BYTE mode : 2,097,152 words by 8 bits, WORD mode : 1,048,576 words by 16 bits).
The active levels of OE (Output Enable Input) can be selected with mask-option.
The
µ
PD23C16040BL and
µ
PD23C16080BL are packed in 48-pin PLASTIC TSOP(I) and 44-pin PLASTIC SOP.
Features
Word organization
2,097,152 words by 8 bits (BYTE mode)
1,048,576 words by 16 bits (WORD mode)
Page access mode
BYTE mode : 8 byte random page access (
µ
PD23C16040BL)
16 byte random page access (
µ
PD23C16080BL)
WORD mode : 4 word random page access (
µ
PD23C16040BL)
8 word random page access (
µ
PD23C16080BL)
Operating supply voltage : V
CC
= 2.7 V to 3.6 V
Operating supply
voltage
V
CC
3.0 V
±
0.3 V
3.3 V
±
0.3 V
Access time /
Page access time
ns (MAX.)
90 / 25
85 / 25
Power supply current (Active mode)
mA (MAX.)
Standby current
(CMOS level input)
µ
PD23C16040BL
40
µ
PD23C16080BL
55
µ
A (MAX.)
30
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. M15720EJ3V0DS00 (3rd edition)
Date Published March 2003 NS CP(K)
Printed in Japan
The mark
shows major revised points.
2001

UPD23C16080BLGY-XXX-MJH Related Products

UPD23C16080BLGY-XXX-MJH UPD23C16080BLGY-XXX-MKH UPD23C16040BLGX-XXX
Description IC,ROM,1MX16/2MX8,CMOS,TSSOP,48PIN,PLASTIC IC,ROM,1MX16/2MX8,CMOS,TSSOP,48PIN,PLASTIC IC,ROM,1MX16/2MX8,CMOS,SOP,44PIN,PLASTIC
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Reach Compliance Code compliant compliant compliant
Maximum access time 90 ns 90 ns 90 ns
Spare memory width 8 8 8
JESD-30 code R-PDSO-G48 R-PDSO-G48 R-PDSO-G44
memory density 16777216 bit 16777216 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM MASK ROM
memory width 16 16 16
Number of terminals 48 48 44
word count 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000
Maximum operating temperature 70 °C 70 °C 70 °C
Minimum operating temperature -10 °C -10 °C -10 °C
organize 1MX16 1MX16 1MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP SOP
Encapsulate equivalent code TSSOP48,.71,20 TSSOP48,.71,20 SOP44,.63
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
power supply 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum standby current 0.00003 A 0.00003 A 0.00003 A
Maximum slew rate 0.055 mA 0.055 mA 0.04 mA
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 1.27 mm
Terminal location DUAL DUAL DUAL
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