5962-01-331-6394 datasheet, PDF

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5962-01-331-6394: DescriptionUVPROM, 2KX8, CMOS, CDIP24,; Categorystorage storage; File Size59KB，12 Pages; ManufacturerWaferscale Integration Inc.

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5962-01-331-6394 Overview

UVPROM, 2KX8, CMOS, CDIP24,

5962-01-331-6394 Parametric

Parameter Name	Attribute value
Maker	Waferscale Integration Inc.
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
I/O type	COMMON
JESD-30 code	R-XDIP-T24
memory density	16384 bit
Memory IC Type	UVPROM
memory width	8
Number of terminals	24
word count	2048 words
character code	2000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Output characteristics	REGISTERED
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum slew rate	0.12 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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REVISIONS

LTR

DESCRIPTION

DATE

APPROVED

Changes in accordance with NOR 5962-R008-91.

Changes in accordance with NOR 5962-R217-93.

Updated boilerplate. Removed programming specifics from drawing,

including table III. Separated source bulletin from body of drawing. -

glg

91-10-17

93-08-20

00-08-30

M. A. Frye

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

James E. Jamison

CHECKED BY

Ray Monnin

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY All DEPARTMENTS

APPROVED BY

Michael. A. Frye

MICROCIRCUITS, DIGITAL, CMOS, 2K X 8

REGISTERED UVEPROM, MONOLITHIC

SILICON

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DRAWING APPROVAL DATE

1988 Sep. 22

REVISION LEVEL

SIZE

SHEET

1 OF

5962-E526-00

CAGE CODE

67268

5962-87529

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the

issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-973 - Configuration Management.

MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-

38535 may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity

approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"

certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.2 Truth table. The truth table shall be as specified on figure 2.

3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing

shall be as specified on figure 2.

3.2.3.2 Programmed devices. The truth table for programmed devices shall be specified by an altered item drawing.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-87529

SHEET

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