BX80551PG3200FT datasheet, PDF

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BX80551PG3200FT: DescriptionMicroprocessor, 32-Bit, 3200MHz, CMOS, PBGA775, FLIP CHIP, LGA-775; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，106 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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BX80551PG3200FT Overview

Microprocessor, 32-Bit, 3200MHz, CMOS, PBGA775, FLIP CHIP, LGA-775

BX80551PG3200FT Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Intel
Parts packaging code	LGA
package instruction	LGA, LGA775,30X33,46/43
Contacts	775
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	36
bit size	32
boundary scan	YES
maximum clock frequency	200 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-N775
length	37.5 mm
low power mode	YES
Number of terminals	775
Package body material	PLASTIC/EPOXY
encapsulated code	LGA
Encapsulate equivalent code	LGA775,30X33,46/43
Package shape	SQUARE
Package form	GRID ARRAY
power supply	1.3 V
Certification status	Not Qualified
Maximum seat height	4.341 mm
speed	3200 MHz
Maximum slew rate	125000 mA
Maximum supply voltage	1.4 V
Minimum supply voltage	1.2 V
Nominal supply voltage	1.3 V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal pitch	1.1 mm
Terminal location	BOTTOM
width	37.5 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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Intel

Pentium

D Processor 800

Sequence

Datasheet

– On 90 nm Process in the 775-land LGA Package and supporting

Intel

Extended Memory 64 Technology

February 2006

Document Number: 307506-003

Contents

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

D processor may contain design defects or errors known as errata which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families. Over time processor numbers will increment based on changes in clock speed, cache, FSB, or other features, and

increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number

progression is not necessarily representative of future roadmaps. See

http://www.intel.com/products/processor_number

for details.

Intel

Extended Memory 64 Technology (Intel

EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device

drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.

Performance will vary depending on your hardware and software configurations. See

http://www.intel.com/info/em64t

for more information including

details on which processors support EM64T or consult with your system vendor for more information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.

Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Intel Xeon, Intel NetBurst, Intel SpeedStep and the Intel logo are trademarks or registered trademarks of Intel Corporation or its

subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction.................................................................................................................................... 11

1.1

1.2

2.1

2.2

Terminology ........................................................................................................................ 12

1.1.1 Processor Packaging Terminology ........................................................................ 12

References ......................................................................................................................... 13

Power and Ground Lands................................................................................................... 15

Decoupling Guidelines........................................................................................................ 15

2.2.1 VCC Decoupling .................................................................................................... 15

2.2.2 VTT Decoupling ..................................................................................................... 15

2.2.3 FSB Decoupling ..................................................................................................... 16

Voltage Identification .......................................................................................................... 16

Reserved, Unused, FC and TESTHI Signals...................................................................... 18

Voltage and Current Specifications .................................................................................... 19

2.5.1 Absolute Maximum and Minimum Ratings............................................................. 19

2.5.2 DC Voltage and Current Specifications .................................................................19

2.5.3 VCC Overshoot Specification ................................................................................ 25

2.5.4 Die Voltage Validation ........................................................................................... 26

Signaling Specifications...................................................................................................... 26

2.6.1 FSB Signal Groups ................................................................................................ 26

2.6.2 GTL+ Asynchronous Signals ................................................................................. 28

2.6.3 FSB DC Specifications .......................................................................................... 29

Clock Specifications............................................................................................................ 32

2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 32

2.7.2 FSB Frequency Select Signals .............................................................................. 32

2.7.3 Phase Lock Loop (PLL) and Filter ......................................................................... 33

Package Mechanical Drawing ............................................................................................ 35

Processor Component Keep-Out Zones............................................................................. 39

Package Loading Specifications......................................................................................... 39

Package Handling Guidelines............................................................................................. 39

Package Insertion Specifications........................................................................................ 40

Processor Mass Specification............................................................................................. 40

Processor Materials ............................................................................................................ 40

Processor Markings ............................................................................................................ 40

Processor Land Coordinates ..............................................................................................42

Processor Land Assignments ............................................................................................. 43

Alphabetical Signals Reference .......................................................................................... 66

Processor Thermal Specifications ...................................................................................... 75

5.1.1 Thermal Specifications .......................................................................................... 75

5.1.2 Thermal Metrology ................................................................................................. 79

Electrical Specifications ................................................................................................................. 15

2.3

2.4

2.5

2.6

2.7

Package Mechanical Specifications ..............................................................................................35

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

Land Listing and Signal Descriptions ............................................................................................ 43

4.1

4.2

Thermal Specifications and Design Considerations ...................................................................... 75

5.1

Datasheet

Contents

5.2

Processor Thermal Features .............................................................................................. 79

5.2.1 Thermal Monitor..................................................................................................... 79

5.2.2 On-Demand Mode ................................................................................................. 80

5.2.3 PROCHOT# Signal................................................................................................ 80

5.2.4 FORCEPR# Signal Pin .......................................................................................... 81

5.2.5 THERMTRIP# Signal............................................................................................. 82

5.2.6 T

CONTROL

and Fan Speed Reduction.................................................................... 82

5.2.7 Thermal Diode ....................................................................................................... 82

Power-On Configuration Options........................................................................................ 85

Clock Control and Low Power States ................................................................................. 85

6.2.1 Normal State.......................................................................................................... 86

6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 86

6.2.3 Stop-Grant State.................................................................................................... 87

6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88

6.2.5 Enhanced Intel SpeedStep

Technology .............................................................. 88

Mechanical Specifications .................................................................................................. 90

7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 90

7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 91

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly....... 91

Electrical Requirements...................................................................................................... 91

7.2.1 Fan Heatsink Power Supply .................................................................................. 91

Thermal Specifications ....................................................................................................... 93

7.3.1 Boxed Processor Cooling Requirements............................................................... 93

7.3.2 Variable Speed Fan ............................................................................................... 95

Mechanical Specifications .................................................................................................. 98

8.1.1 Cooling Solution Dimensions................................................................................. 98

8.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 98

8.1.3 Boxed Processor Support and Retention Module (SRM) ...................................... 99

Electrical Requirements...................................................................................................... 99

8.2.1 Fan Heatsink Power Supply .................................................................................. 99

Thermal Specifications ..................................................................................................... 101

8.3.1 Boxed Processor Cooling Requirements............................................................. 101

8.3.2 Variable Speed Fan ............................................................................................. 102

Logic Analyzer Interface (LAI) .......................................................................................... 105

9.1.1 Mechanical Considerations.................................................................................. 105

9.1.2 Electrical Considerations ..................................................................................... 105

Features ........................................................................................................................................ 85

6.1

6.2

Boxed Processor Specifications .................................................................................................... 89

7.1

7.2

7.3

Balanced Technology Extended (BTX) Type I Boxed Processor Specifications........................... 97

8.1

8.2

8.3

Debug Tools Specifications ......................................................................................................... 105

9.1

Datasheet

Contents

Figures

2-1

2-2

2-3

2-4

3-1

3-2

3-3

3-4

3-5

3-6

3-7

4-1

4-2

5-1

5-2

5-3

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

7-9

8-1

8-2

8-3

8-4

8-5

8-6

VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor............ 22

VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor............ 24

VCC Overshoot Example Waveform .......................................................................................... 25

Phase Lock Loop (PLL) Filter Requirements.............................................................................. 34

Processor Package Assembly Sketch ........................................................................................ 35

Processor Package Drawing 1 ................................................................................................... 36

Processor Package Drawing 2 ................................................................................................... 37

Processor Package Drawing 3 ................................................................................................... 38

Processor Top-Side Marking Example (Intel

Pentium

D Processors 840, 830, 820) ............. 40

Processor Top-Side Marking Example (Intel

Pentium

D Processor 805)............................... 41

Processor Land Coordinates, Top View ..................................................................................... 42

Landout Diagram (Top View – Left Side).................................................................................... 44

Landout Diagram (Top View – Right Side) ................................................................................. 45

Thermal Profile for the Pentium D Processor with PRB=1 ......................................................... 77

Thermal Profile for the Pentium D Processor with PRB=0 ......................................................... 78

Case Temperature (TC) Measurement Location ........................................................................ 79

Processor Low Power State Machine......................................................................................... 86

Mechanical Representation of the Boxed Processor.................................................................. 89

Side View Space Requirements for the Boxed Processor (Applies to all four side views) ......... 90

Top View Space Requirements for the Boxed Processor........................................................... 90

Overall View Space Requirements for the Boxed Processor ..................................................... 91

Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92

Baseboard Power Header Placement Relative to Processor Socket ......................................... 93

Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ........................ 94

Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ........................ 94

Boxed Processor Fan Heatsink Set Points................................................................................. 95

Mechanical Representation of the Boxed Processor.................................................................. 97

Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes .......... 98

Assembly Stack Including the Support and Retention Module ................................................... 99

Boxed Processor Fan Heatsink Power Cable Connector .........................................................100

Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) 101

Boxed Processor TMA Set Points ............................................................................................102

Datasheet

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