64MB, 128MB, 256MB Unbuffered DIMM
Synchronous DRAM
SDRAM Unbuffered Module
168pin Unbuffered Module based on 128Mb I-die
64/72-bit Non ECC/ECC
Revision 1.0
February 2006
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
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Rev. 1.0 February 2006
64MB, 128MB, 256MB Unbuffered DIMM
Revision History
Revision
1.0
Month
February
Year
2006
- First release
History
Synchronous DRAM
2 of 26
Rev. 1.0 February 2006
64MB, 128MB, 256MB Unbuffered DIMM
168Pin Unbuffered DIMM based on 128Mb I-die (x8, x16)
Ordering Information
Part Number
M366S0924ITS-C7A
M366S1723ITS-C7A
M366S1723ITU-C7A
M374S1723ITS-C7A
M374S1723ITU-C7A
M366S3323ITS-C7A
M366S3323ITU-C7A
M374S3323ITS-C7A
M374S3323ITU-C7A
Density
64MB
128MB
128MB
128MB
128MB
256MB
256MB
256MB
256MB
Organization
8M x 64
16M x 64
16M x 64
16M x 72
16M x 72
32M x 64
32M x 64
32M x 72
32M x 72
Synchronous DRAM
Component Composition
8Mx16(K4S281632I) * 4EA
16Mx8(K4S280832I) * 8EA
16Mx8(K4S280832I) * 8EA
16Mx8(K4S280832I) * 9EA
16Mx8(K4S280832I) * 9EA
16Mx8(K4S280832I)*16EA
16Mx8(K4S280832I)*16EA
16Mx8(K4S280832I)*18EA
16Mx8(K4S280832I)*18EA
Component
Package
Height
1,000mil
1,375mil
1,125mil
1,375mil
54-TSOPII
1,125mil
1,375mil
1,125mil
1,375mil
1,125mil
Operating Frequencies
-7A
@CL3
Maximum Clock Frequency
CL-tRCD-tRP(clock)
133MHz(7.5ns)
3-3-3
@CL2
100MHz(10ns)
2-2-2
Feature
Burst mode operation
Auto & self refresh capability (4096 Cycles/64ms)
LVTTL compatible inputs and outputs
Single 3.3V
±
0.3V power supply
MRS cycle with address key programs Latency (Access from column address)
Burst length (1, 2, 4, 8 & Full page)
Data scramble (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system clock
• Serial presence detect with EEPROM
•
•
•
•
•
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Rev. 1.0 February 2006
64MB, 128MB, 256MB Unbuffered DIMM
PIN CONFIGURATIONS (Front side/back side)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Front
VSS
DQ0
DQ1
DQ2
DQ3
VDD
DQ4
DQ5
DQ6
DQ7
DQ8
VSS
DQ9
DQ10
DQ11
DQ12
DQ13
VDD
DQ14
DQ15
CB0
CB1
VSS
NC
NC
VDD
WE
DQM0
Pin
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
Front
DQM1
**CS0
DU
VSS
A0
A2
A4
A6
A8
A10/AP
BA1
VDD
VDD
**CLK0
VSS
DU
**CS2
DQM2
DQM3
DU
VDD
NC
NC
CB2
CB3
VSS
DQ16
DQ17
Pin
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
Front
DQ18
DQ19
VDD
DQ20
NC
*VREF
**CKE1
VSS
DQ21
DQ22
DQ23
VSS
DQ24
DQ25
DQ26
DQ27
VDD
DQ28
DQ29
DQ30
DQ31
VSS
**CLK2
NC
NC
SDA
SCL
VDD
Pin
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
Back
VSS
DQ32
DQ33
DQ34
DQ35
VDD
DQ36
DQ37
DQ38
DQ39
DQ40
VSS
DQ41
DQ42
DQ43
DQ44
DQ45
VDD
DQ46
DQ47
CB4
CB5
VSS
NC
NC
VDD
CAS
DQM4
Pin
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
Synchronous DRAM
Back
DQM5
**CS1
RAS
VSS
A1
A3
A5
A7
A9
BA0
A11
VDD
**CLK1
*A12
VSS
**CKE0
**CS3
DQM6
DQM7
*A13
VDD
NC
NC
CB6
CB7
VSS
DQ48
DQ49
Pin
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
Back
DQ50
DQ51
VDD
DQ52
NC
*VREF
NC
VSS
DQ53
DQ54
DQ55
VSS
DQ56
DQ57
DQ58
DQ59
VDD
DQ60
DQ61
DQ62
DQ63
VSS
**CLK3
NC
SA0
SA1
SA2
VDD
Note :
1. * These pins are not used in this module.
2.
Pins 82,83,165,166,167 should be NC in the system which does not support SPD.
3. Pins 21,22,52,53,105,106,136,137are used only ECC(x72) Module.
4. ** About these pins, Refer to the Block Diagram of each.
Pin Description
Pin Name
A0 ~ A11
BA0 ~ BA1
DQ0 ~ DQ63
CB0 ~ CB7
CLK0 ~ 3
CKE0, CKE1
CS0 ~ CS3
RAS
CAS
WE
Select bank
Data input/output
Check bit (Data-in/data-out)
Clock input
Clock enable input
Chip select input
Row address strobe
Colume address strobe
Write enable
Function
Address input (Multiplexed)
V
DD
V
SS
V
REF
REGE
SDA
SCL
SA0 ~ 2
DU
NC
Pin Name
DQM0 ~ 7
DQM
Power supply (3.3V)
Ground
Power supply for reference
Register enable
Serial data I/O
Serial clock
Address in EEPROM
Don′t use
No connection
Function
* SAMSUNG ELECTRONICS CO., Ltd. reserves the right to change products and specifications without notice.
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Rev. 1.0 February 2006
64MB, 128MB, 256MB Unbuffered DIMM
PIN CONFIGURATION DESCRIPTION
Pin
CLK
CS
Name
System clock
Chip select
Synchronous DRAM
Input Function
Active on the positive going edge to sample all inputs.
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
CKE should be enabled 1CLK+tss prior to valid command.
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA11
Column address : (x8 : CA0 ~ CA9), (x16 : CA0 ~ CA8)
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
Makes data output Hi-Z, t
SHZ
after the clock and masks the output.
Blocks data input when DQM active. (Byte masking)
The device operates in the transparent mode when REGE is low. When REGE is high,
the device operates in the registered mode. In registered mode, the Address and con-
trol inputs are latched if CLK is held at a high or low logic level. the inputs are stored in
the latch/flip-flop on the rising edge of CLK. REGE is tied to V
DD
through 10K ohm
Resistor on PCB. So if REGE of module is floating, this module will be operated as reg-
istered mode.
Data inputs/outputs are multiplexed on the same pins.
Check bits for ECC.
Power and ground for the input buffers and the core logic.
CKE
Clock enable
A0 ~ A11
Address
BA0 ~ BA1
RAS
CAS
WE
DQM0 ~ 7
Bank select address
Row address strobe
Column address strobe
Write enable
Data input/output mask
REGE
Register enable
DQ0 ~ 63
CB0 ~ 7
V
DD
/V
SS
Data input/output
Check bit
Power supply/ground
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Rev. 1.0 February 2006