metal packages and T410 attaches to plastic packages.
100
90
80
70
60
50
40
30
20
10
0
C A S E T E M P E R AT U R E
R I S E A B OV E A M B I E N T -
°
C
35 x 35 mm OptiPin
THERMAL PERFORMANCE
S I N K M O U N T I N G S U R FA C E T E M P E R AT U R E
R I S E A B OV E A M B I E N T -
°
C
0
100
500
600
20
18
16
14
12
10
8
6
4
2
0
3
4
5
6
THERMAL RESISTANCE FROM SINK
MOUNTING SURFACE TO AMBIENT -
°C/W
T H E R M A L R E S I S TA N C E C - A -
°
C / W
AIR VELOCITY FT/MIN
200
300
400
3718
3719
3720
100
90
80
70
60
50
40
30
20
10
0
0
1
2
H E AT D I S S I PAT E D ( WAT T S )
40 x 40 mm OptiPin
THERMAL PERFORMANCE
0
A I R F L OW ( F T / M I N )
200
400
600
9
8
7
6
5
4
3
2
1
0
8
POWER (WATTS)
10
3644
0
4
ORDERING INFORMATION
SIZE
L xW
(mm)
35 X 35
35 X 35
35 X 35
40 X 40
HEIGHT
(mm)
7.0
14.0
27.9
11.4
FOR EPOXY
ATTACHMENT
371824B00000
371924B00000
372024B00000
364424B00000
1070* TWO-SIDED,
PRE-APPLIED
THERMAL TAPE
371824B00032
371924B00032
372024B00032
364424B00032
T410* TWO-SIDED,
PRE-APPLIED
THERMAL TAPE
371824B00034
371924B00034
372024B00034
364424B00034
NOTE:
1070 tape is for attachment to ceramic or metal packages; and T410 is for attachment to plastic packages.
STANDARD HEAT SINKS FOR BALL GRID ARRAY APPLICATIONS
ORDERING INFORMATION FOR OTHER POPULAR BGA HEAT SINKS:
Aavid Part Number
335114B00000
335124B00032
335214B00000
335214B00032
335224B00032
335314B00000
335314B00032
373024B00000
335514B00000
335714B00000
335714B00032
335724B00000
335724B00032
335814B00000
335814B00032
335824B00032
373114B00032
336314B00000
336314B00032
336614B00000
336614B00032
336714B00000
362914B00000
363014B00000
W
24.1
24.1
25.0
25.0
25.0
27.0
27.0
27.9
28.4
30.1
30.1
30.1
30.1
30.1
30.1
30.1
33.0
36.1
36.1
38.1
38.1
40.0
49.8
49.8
L
24.1
24.1
25.0
25.0
25.0
27.0
27.0
27.9
28.4
30.1
30.1
30.1
30.1
30.1
30.1
30.1
33.0
36.1
36.1
38.1
38.1
40.0
49.8
49.8
H
23.7
23.7
10.0
10.0
10.0
11.4
11.4
8.9
15.2
7.0
7.0
7.0
7.0
9.4
9.4
9.4
12.7
17.0
17.0
16.0
16.0
19.1
25.4
30.5
θsa@
200
˚C/W LFM
8.8
7.9
18.0
18.0
16.5
9.0
9.0
12.1
7.9
15.0
15.0
13.6
13.6
10.5
10.5
9.0
8.1
7.3
7.3
5.1
5.1
7.6
2.6
2.4
Fig. #
1
2
1
1
2
1
1
2
1
1
1
2
2
1
1
2
1
1
1
1
1
1
1
1
Added Features*
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
1070 tape pre-installed
All
part numbers shown specify anodized finish. All dimensions are nominal and shown in millimeters.
*1070 tape recommended for ceramic or metal packages. Use epoxy or T410 for plastic packages.
Figure 1: Straight-Fin Heat Sink
Figure 2: Cross-Cut Heat Sink
Assembly Time
Pressure
Temperature
22˚C
50˚C
10 psi
15 sec 5 sec
30 psi
5 sec
3 sec
INSTALLATION PROCEDURE FOR THER-A-GRIP 1070:
Step 1
:
Make sure the chip surface is clean and free from any possible contaminants.
Wipe surface with industrial solvent, e.g., isopropyl alcohol, acetone.
Step 2:
Peel off the blue mylar embossed liner from the tape. Center the heat sink on the chip
and apply one of the following recommended temperature/pressure options:
TWO-PIN HEAT SINKS FOR BALL GRID ARRAY APPLICATIONS
Aavid’s two-pin heat sink is designed for IC’s in
Ball Grid Array packages, and incorporates two
captive spring-loaded pins.Two-pin heat sinks
are ideal for applications that require robust
attachment for vertical-mounted boards, such
as in telecommunications, automotive, and
computer systems,
Aavid’s design breakthrough saves approximately
40% of the board space compared to four-pin
versions.The two-pin heat sinks fit standard
motherboard hole pattern for the AGP and PCI
chip sets.
THERMAL PERFORMANCE
S I N K M O U N T I N G S U R FA C E T E M P E R AT U R E
R I S E A B OV E A M B I E N T -
°
C
S I N K M O U N T I N G S U R FA C E T E M P E R AT U R E
R I S E A B OV E A M B I E N T -
°
C
0
100
AIR VELOCITY - LFM
300
400
200
500
600
20
18
16
14
12
10
8
6
4
2
0
4
5
6
0
100
THERMAL PERFORMANCE
500
600
20
18
16
14
12
10
8
6
4
2
0
4
5
6
THERMAL RESISTANCE FROM SINK
MOUNTING SURFACE TO AMBIENT -
°C/W
AIR VELOCITY - LFM
300
400
200
100
90
80
70
60
50
40
30
20
10
0
T H E R M A L R E S I S TA N C E C - A -
°
C / W
3353
3727/3732
3728
0
1
2
3
100
90
80
70
60
50
40
30
20
10
0
3365
3730
3729/3733
0
1
2
3
H E AT D I S S I PAT E D ( WAT T S )
H E AT D I S S I PAT E D ( WAT T S )
Two-pin BGA heat
sinks use approxi-
mately 40% less
space (white area)
than comparable
four-pin heat sinks
(gray area).
TWO-PIN BGA HEAT SINK P/N
372724M02000
R 3.25
±
0.
Ø 3.0
46
.6
2
28.0
±
0.2
28.0
±
0.2
6.5
±
0.2
Theta @200LFM:13.30˚ C/W
Dimensions in mm
ORDERING INFORMATION
AAVID PART NUMBER
372724M02000
373224M00000
372824M00000
372924M02000
373324M00000
THETA @ 200 LFM
13.3˚ C/W
13.3˚ C/W
10.7˚ C/W
11.0˚ C/W
11.0˚ C/W
FIG. #
1
2
3
4
5
DESCRIPTION
Two-Pin BGA Heat Sink
BGA Heat SInk
BGA Heat Sink
Two-Pin BGA Heat Sink
BGA Heat Sink
NOTE:
All dimensions are nominal and shown in millimeters.
TWO-PIN HEAT SINKS FOR BALL GRID ARRAY APPLICATIONS
BGA HEAT SINK P/N 373224M00000
BGA HEAT SINK P/N 372824M00000
28.0
±
0.2
35.0
35.0
28.0
±
0.2
15.0
5.6
±
0.2
5.8
±
0.2
Theta @200LFM:13.3˚ C/W
Dimensions in mm
Theta @200LFM:10.7˚ C/W
Dimensions in mm
TWO-PIN BGA HEAT SINK P/N
372924M02000
BGA HEAT SINK P/N 373324M00000
37.4
±
0.4
59
.0
±
6.0
±
0.2
48.8
±
0.4
37.4
±
0.4
0.
1
6.0
±
0.3
Theta @200LFM:11.0˚ C/W
Dimensions in mm
Theta @200LFM:11.0˚ C/W
Dimensions in mm
AA
VID
THERMALLOY
This data sheet represents only one of a broad range of products we make to cool electronics. Our representatives can help you configure a
complete cooling solution for your individual applications. For assistance, contact any one of them from our web site or at the locations below.
Aavid Thermalloy, along with Fluent Inc.’s Icepak thermal design software and Applied Thermal Technologies, Inc. thermal design and validation services, make up
The Total Integrated Solution for Cooling Electronics™. For more information on how to put our strengths to work for you, visit our web site at: http://www.aavidthermalloy.com;
TEL: (603) 224-9988, or contact Fluent at: http://www.icepak.com;TEL: (603) 643-2600, or Applied at: http://www.thermalcooling.com;TEL: (603) 225-6523.
For technical assistance, or placing an order, please visit our web site for the local sales representative:
Unit C Hillbottom Road • Sands Industrial Estate • High Wycombe, Bucks, England HP12 4HS • TEL: (44) 1494-474747 • FAX: (44) 1494-474748
PLEASE NOTE: Our customers are reminded that they bear the responsibility for testing Aavid Thermalloy, products for proposed use. Any information furnished by AAVID is believed to be
accurate and reliable, but our customers must bear all responsibility for use and applications of Aavid Thermalloy products since Aavid Thermalloy cannot be aware of all potential uses. AAVID THERMALLOY
MAKES NO WARRANTIES AS TO THE FITNESS, MERCHANTABILITY, OR SUITABILITY OF ANY AAVID PRODUCTS FOR ANY SPECIFIC OR GENERAL USES. AAVID SHALL NOT BE LIABLE FOR INCI-
DENTAL OR CONSEQUENTIAL DAMAGES OF ANY KIND. All AAVID THERMALLOY products are sold pursuant to the AAVID THERMALLOY Domestic Terms and Conditions of Sale in effect from time
to time, a copy of which shall be furnished upon request (8911A).
All icons, drawings, illustrations, and trademarks are the property of Aavid Thermalloy, LLC. and may not be reproduced without express written permission. All rights reserved.
My platform is PXA270+Wince5.0. I have a small problem. Please help me. After the system is started, if it is not used for a period of time, the backlight will automatically turn off, and after a peri...
[STM32F429Discovery Oscilloscope DIY]-Charge and discharge DIY A note, please pay attention: I DIYed a battery power supply before. The specific post is here: [url]https://bbs.eeworld.com.cn/thread-45...
Hello everyone, I am working on an embedded linux jffs2 file system, but I have a question that I don't understand. I use mkfs.jffs2 -d /floder -o file.img. What is this floder? Any file, if it is an ...
Responsible for embedded product software and hardware development.Job requirements:1. Bachelor degree or above in computer, communication, electronics, automation and related majors;2. Proficient in ...
This paper designs a dot matrix LED text display screen that is easy to update, expandable, and low-cost. The way to reduce costs is
① Use the Bluetooth data transmission function of mobile ph...[Details]
PV inverter manufacturer SMA has launched its first DC arc fault circuit interrupter (AFCI) PV inverter and has received UL certification.
The new SunnyBoy AFCI inverter models include 3000-US...[Details]
Spatial Division Multiplexing (SDM) MIMO processing can significantly improve spectrum efficiency and thus greatly increase the capacity of wireless communication systems. Spatial Division Multip...[Details]
LED light sources have many environmental advantages, but early products still have certain technical bottlenecks in heat dissipation and high brightness design that cannot be broken through....[Details]
introduction
At present, the research on micron and nanotechnology is very active, which has led to the rapid development of microtechnology and micro-mechanical electronic system (MEMS) t...[Details]
0 Introduction
In the design and construction of communication systems,
communication power supply
is called the heart of the communication system. The power supply system will dire...[Details]
As a type of iron battery, lithium iron phosphate battery (hereinafter referred to as lithium iron battery) has always been widely concerned by industry friends (some people say that lithium iron b...[Details]
Improving the coordination of material handling and internal transportation between departments in modern factories is an important measure to achieve full automation of production. Traditional mat...[Details]
1. Introduction
Due to the good programmability and superior performance of FPGA, the number of embedded systems using FPGA chips in LCD splicing screens is increasing rapidly, especially in t...[Details]
Inverter supplier Santerno has been awarded a contract to supply 155MW of sliding inverters to a solar farm in California’s Imperial Valley. The company did not disclose further details about the p...[Details]
0 Introduction
In microwave, radar, radio and television, and communication systems, the problem of coupling RF power is often encountered. A directional coupler is a directional power divide...[Details]
The performance of most portable products depends on the quality of the batteries that power them. In recent years, as battery performance has improved, portable products are moving towards smaller...[Details]
During the operation of electronic equipment,
memory
failure or failure will not only lead to economic losses, but also may lead to catastrophic consequences. Therefore, memory testing has ...[Details]
When programming in C and assembly, there are interface issues between variables and functions in C and assembly.
Variables defined in a C program are put into the .bss area after being compile...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
