NAND Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDIP14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Signetics |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| series | TTL/H/L |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 25 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.02 A |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Maximum supply current (ICC) | 20 mA |
| Prop。Delay @ Nom-Sup | 10 ns |
| propagation delay (tpd) | 10 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| S54H20F | S54H20W | S54S20W | N74LS20F | N74S20F | S54LS20F | N7420F | S5420W | |
|---|---|---|---|---|---|---|---|---|
| Description | NAND Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDIP14 | NAND Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDFP14 | NAND Gate, S Series, 2-Func, 4-Input, TTL, CDFP14 | NAND Gate, LS Series, 2-Func, 4-Input, TTL, CDIP14 | NAND Gate, S Series, 2-Func, 4-Input, TTL, CDIP14 | NAND Gate, LS Series, 2-Func, 4-Input, TTL, CDIP14 | NAND Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDIP14 | NAND Gate, TTL/H/L Series, 2-Func, 4-Input, TTL, CDFP14 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Signetics | Signetics | Signetics | Signetics | Signetics | Signetics | Signetics | Signetics |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| series | TTL/H/L | TTL/H/L | S | LS | S | LS | TTL/H/L | TTL/H/L |
| JESD-30 code | R-GDIP-T14 | R-CDFP-F14 | R-CDFP-F14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-CDFP-F14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 25 pF | 25 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.02 A | 0.02 A | 0.02 A | 0.008 A | 0.02 A | 0.004 A | 0.016 A | 0.016 A |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of entries | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | - | -55 °C | - | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DFP | DFP | DIP | DIP | DIP | DIP | DFP |
| Encapsulate equivalent code | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum supply current (ICC) | 20 mA | 20 mA | 9 mA | 2.2 mA | 9 mA | 2.2 mA | 11 mA | 11 mA |
| propagation delay (tpd) | 10 ns | 10 ns | 5 ns | 15 ns | 5 ns | 15 ns | 15 ns | 15 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | NO | NO | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| package instruction | DIP, DIP14,.3 | - | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
| Prop。Delay @ Nom-Sup | 10 ns | 10 ns | 5 ns | 15 ns | 5 ns | 15 ns | - | - |
| power supply | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
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