Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 0.75 MM PITCH, BGA-48
| Parameter Name | Attribute value |
| Maker | SAMSUNG |
| Parts packaging code | BGA |
| package instruction | TFBGA, |
| Contacts | 48 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 10 ns |
| Other features | TTL COMPATIBLE INPUTS AND OUTPUTS |
| JESD-30 code | S-PBGA-B48 |
| length | 9 mm |
| memory density | 4194304 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 48 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | BALL |
| Terminal pitch | 0.75 mm |
| Terminal location | BOTTOM |
| width | 9 mm |
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