Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Micron Technology |
| Parts packaging code | TSOP |
| package instruction | 0.300 INCH, PLASTIC, TSOP-26/20 |
| Contacts | 20 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| access mode | FAST PAGE |
| Maximum access time | 70 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e0 |
| length | 17.14 mm |
| memory density | 4194304 bit |
| Memory IC Type | FAST PAGE DRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 20 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX4 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP2 |
| Encapsulate equivalent code | TSSOP20/26,.36 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 1024 |
| Maximum seat height | 1.2 mm |
| self refresh | NO |
| Maximum standby current | 0.0002 A |
| Maximum slew rate | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MT4C4001JTG-7L | MT4C4001JDJ-7L | MT4C4001JTG-6L | MT4C4001JDJ-6L | MT4C4001JZ-6L | MT4C4001JDJ-8L | MT4C4001JZ-7L | MT4C4001JTG-8L | MT4C4001JZ-8L | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX4, 60ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 | Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 | Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 1MX4, 80ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | TSOP | SOJ | TSOP | SOJ | ZIP | SOJ | ZIP | TSOP | ZIP |
| package instruction | 0.300 INCH, PLASTIC, TSOP-26/20 | 0.300 INCH, PLASTIC, SOJ-26/20 | 0.300 INCH, PLASTIC, TSOP-26/20 | 0.300 INCH, PLASTIC, SOJ-26/20 | 0.400 INCH, PLASTIC, ZIP-20 | 0.300 INCH, PLASTIC, SOJ-26/20 | 0.400 INCH, PLASTIC, ZIP-20 | 0.300 INCH, PLASTIC, TSOP-26/20 | 0.400 INCH, PLASTIC, ZIP-20 |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | unknown | unknown | unknown | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| Maximum access time | 70 ns | 70 ns | 60 ns | 60 ns | 60 ns | 80 ns | 70 ns | 80 ns | 80 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-G20 | R-PDSO-J20 | R-PDSO-G20 | R-PDSO-J20 | R-PZIP-T20 | R-PDSO-J20 | R-PZIP-T20 | R-PDSO-G20 | R-PZIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 17.14 mm | 17.17 mm | 17.14 mm | 17.17 mm | 25.295 mm | 17.17 mm | 25.295 mm | 17.14 mm | 25.295 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP2 | SOJ | TSOP2 | SOJ | ZIP | SOJ | ZIP | TSOP2 | ZIP |
| Encapsulate equivalent code | TSSOP20/26,.36 | SOJ20/26,.34 | TSSOP20/26,.36 | SOJ20/26,.34 | ZIP20,.1 | SOJ20/26,.34 | ZIP20,.1 | TSSOP20/26,.36 | ZIP20,.1 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| Maximum seat height | 1.2 mm | 3.61 mm | 1.2 mm | 3.61 mm | 10.41 mm | 3.61 mm | 10.41 mm | 1.2 mm | 10.41 mm |
| self refresh | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Maximum standby current | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A |
| Maximum slew rate | 0.1 mA | 0.1 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.09 mA | 0.1 mA | 0.09 mA | 0.09 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | NO | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | J BEND | GULL WING | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.67 mm | 7.62 mm | 7.67 mm | 2.795 mm | 7.67 mm | 2.795 mm | 7.62 mm | 2.795 mm |
| Is it lead-free? | Contains lead | Contains lead | - | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Maker | Micron Technology | - | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
Embedded System
FPGA/CPLD
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