MT4C4001JDJ-8L datasheet, PDF - EEWORLD Datasheet

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MT4C4001JDJ-8L: DescriptionFast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20; Categorystorage storage; File Size882KB，14 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT4C4001JDJ-8L Overview

Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20

MT4C4001JDJ-8L Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	SOJ
package instruction	0.300 INCH, PLASTIC, SOJ-26/20
Contacts	20
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	80 ns
Other features	RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH
I/O type	COMMON
JESD-30 code	R-PDSO-J20
JESD-609 code	e0
length	17.17 mm
memory density	4194304 bit
Memory IC Type	FAST PAGE DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	20
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOJ
Encapsulate equivalent code	SOJ20/26,.34
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	3.61 mm
self refresh	NO
Maximum standby current	0.0002 A
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.67 mm

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MT4C4001JDJ-8L Related Products

	MT4C4001JDJ-8L	MT4C4001JDJ-7L	MT4C4001JTG-6L	MT4C4001JDJ-6L	MT4C4001JZ-6L	MT4C4001JZ-7L	MT4C4001JTG-8L	MT4C4001JZ-8L	MT4C4001JTG-7L
Description	Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20	Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20	Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20	Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20	Fast Page DRAM, 1MX4, 60ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20	Fast Page DRAM, 1MX4, 70ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20	Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20	Fast Page DRAM, 1MX4, 80ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20	Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	SOJ	SOJ	TSOP	SOJ	ZIP	ZIP	TSOP	ZIP	TSOP
package instruction	0.300 INCH, PLASTIC, SOJ-26/20	0.300 INCH, PLASTIC, SOJ-26/20	0.300 INCH, PLASTIC, TSOP-26/20	0.300 INCH, PLASTIC, SOJ-26/20	0.400 INCH, PLASTIC, ZIP-20	0.400 INCH, PLASTIC, ZIP-20	0.300 INCH, PLASTIC, TSOP-26/20	0.400 INCH, PLASTIC, ZIP-20	0.300 INCH, PLASTIC, TSOP-26/20
Contacts	20	20	20	20	20	20	20	20	20
Reach Compliance Code	unknown	not_compliant	not_compliant	not_compliant	unknown	unknown	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	80 ns	70 ns	60 ns	60 ns	60 ns	70 ns	80 ns	80 ns	70 ns
Other features	RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-J20	R-PDSO-J20	R-PDSO-G20	R-PDSO-J20	R-PZIP-T20	R-PZIP-T20	R-PDSO-G20	R-PZIP-T20	R-PDSO-G20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	17.17 mm	17.17 mm	17.14 mm	17.17 mm	25.295 mm	25.295 mm	17.14 mm	25.295 mm	17.14 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	4	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20	20	20
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX4	1MX4	1MX4	1MX4	1MX4	1MX4	1MX4	1MX4	1MX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOJ	SOJ	TSOP2	SOJ	ZIP	ZIP	TSOP2	ZIP	TSOP2
Encapsulate equivalent code	SOJ20/26,.34	SOJ20/26,.34	TSSOP20/26,.36	SOJ20/26,.34	ZIP20,.1	ZIP20,.1	TSSOP20/26,.36	ZIP20,.1	TSSOP20/26,.36
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE, THIN PROFILE	IN-LINE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	1024	1024	1024	1024	1024	1024	1024	1024	1024
Maximum seat height	3.61 mm	3.61 mm	1.2 mm	3.61 mm	10.41 mm	10.41 mm	1.2 mm	10.41 mm	1.2 mm
self refresh	NO	NO	NO	NO	NO	NO	NO	NO	NO
Maximum standby current	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A	0.0002 A
Maximum slew rate	0.09 mA	0.1 mA	0.11 mA	0.11 mA	0.11 mA	0.1 mA	0.09 mA	0.09 mA	0.1 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	NO	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	GULL WING	J BEND	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	ZIG-ZAG	ZIG-ZAG	DUAL	ZIG-ZAG	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.67 mm	7.67 mm	7.62 mm	7.67 mm	2.795 mm	2.795 mm	7.62 mm	2.795 mm	7.62 mm
Is it lead-free?	Contains lead	Contains lead	-	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Maker	Micron Technology	-	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology

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