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Z87L0016FSC

Description
Support Circuit, CMOS, PQFP100, QFP-100
CategoryWireless rf/communication    Telecom circuit   
File Size199KB,50 Pages
ManufacturerZilog, Inc.
Websitehttps://www.zilog.com/
Download Datasheet Parametric Compare View All

Z87L0016FSC Overview

Support Circuit, CMOS, PQFP100, QFP-100

Z87L0016FSC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZilog, Inc.
Parts packaging codeQFP
package instructionQFP, QFP100(UNSPEC)
Contacts100
Reach Compliance Codeunknown
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
Number of functions1
Number of terminals100
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP100(UNSPEC)
Package shapeRECTANGULAR
Package formFLATPACK
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.1 mm
Maximum slew rate0.055 mA
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesCORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
P
RELIMINARY
P
RODUCT
S
PECIFICATION
1
Z87000/Z87L00
S
PREAD
S
PECTRUM
C
ONTROLLERS
FEATURES
Device
Z87000
Z87L00
ROM
(KWords)
12
12
RAM*
I/O
(Words) Lines
512
512
32
32
Package
Information
84-Pin PLCC
100-Pin QFP
100-Pin QFP
s
1
Transceiver Circuitry Provides Primary Cordless Phone
Communications Functions
– Digital Downconversion with Automatic Frequency
Control (AFC) Loop
– FSK Demodulator
FSK Modulator
Symbol Synchronizer
Time Division Duplex (TDD) Transmit and Receive
Buffers
Note:
*General-Purpose
s
Transceiver/Controller Chip Optimized for Implement-
ation of 900 MHz Spread Spectrum Cordless Phone
– Adaptive Frequency Hopping
– Transmit Power Control
– Error Control Signaling
– Handset Power Management
– Support of 32 kbps ADPCM Speech Coding for
High Voice Quality
DSP Core Acts as Phone Controller
– Zilog-Provided Embedded Transceiver Software to
Control Transceiver Operation and Base Station-
Handset Communications Protocol
– User-Modifiable Software Governs Phone
Features
s
s
s
s
On-Chip A/D and D/A to Support 10.7 MHz IF Interface
Bus Interface to Z87010 ADPCM Processor
Static CMOS for Low Power Consumption
3.0V to 3.6V, -20
°
C to +70
°
C, Z87L00
4.5V to 5.5V, -20
°
C to +70
°
C, Z87000
16.384 MHz Base Clock
s
s
GENERAL DESCRIPTION
The Z87000/Z87L00 FHSS Cordless Telephone Trans-
ceiver/Controllers are expressly designed to implement a
900 MHz frequency hopping spread spectrum cordless
telephone compliant with United States FCC regulations
for unlicensed operation. The Z87000 and Z87L00 are dis-
tinct 5V and 3.3V versions, respectively, of the device. For
the sake of brevity, all subsequent references to the
Z87000 in this document also apply to the Z87L00, unless
specifically noted.
The Z87000 supports a specific cordless phone system
design that uses frequency hopping and digital modulation
to provide extended range, high voice quality, and low sys-
tem costs.The Z87000 uses a Zilog 16-bit fixed-point two’s
complement static CMOS Digital Signal Processor core as
the phone and RF section controller. The Z87000’s DSP
core processor further supports control of the RF section’s
frequency synthesizer for frequency hopping and the gen-
eration of the control messages needed to coordinate in-
corporation of the phone’s handset and base station.
DS96WRL0501
PRELIMINARY
1-1

Z87L0016FSC Related Products

Z87L0016FSC Z8700016FSC Z8700016VSC
Description Support Circuit, CMOS, PQFP100, QFP-100 Support Circuit, CMOS, PQFP100, QFP-100 Support Circuit, CMOS, PQCC84, PLASTIC, LCC-84
Is it Rohs certified? incompatible incompatible incompatible
Maker Zilog, Inc. Zilog, Inc. Zilog, Inc.
Parts packaging code QFP QFP LCC
package instruction QFP, QFP100(UNSPEC) QFP, QFP100(UNSPEC) QCCJ, LDCC84,1.2SQ
Contacts 100 100 84
Reach Compliance Code unknown unknown unknown
JESD-30 code R-PQFP-G100 R-PQFP-G100 S-PQCC-J84
JESD-609 code e0 e0 e0
length 20 mm 20 mm 29.3116 mm
Number of functions 1 1 1
Number of terminals 100 100 84
Maximum operating temperature 70 °C 70 °C 70 °C
Minimum operating temperature -20 °C -20 °C -20 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP QCCJ
Encapsulate equivalent code QFP100(UNSPEC) QFP100(UNSPEC) LDCC84,1.2SQ
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form FLATPACK FLATPACK CHIP CARRIER
power supply 3.3 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 3.1 mm 3.1 mm 4.57 mm
Maximum slew rate 0.055 mA 0.08 mA 0.08 mA
Nominal supply voltage 3.3 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Telecom integrated circuit types CORDLESS TELEPHONE SUPPORT CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING J BEND
Terminal pitch 0.65 mm 0.65 mm 1.27 mm
Terminal location QUAD QUAD QUAD
width 14 mm 14 mm 29.3116 mm
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