UM7102SM datasheet, PDF - EEWORLD Datasheet

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UM7102SM: DescriptionPin Diode, 200V V(BR), Silicon, SURFACE MOUNT PACKAGE-2; CategoryDiscrete semiconductor diode; File Size306KB，11 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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UM7102SM Overview

Pin Diode, 200V V(BR), Silicon, SURFACE MOUNT PACKAGE-2

UM7102SM Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	SURFACE MOUNT PACKAGE-2
Contacts	2
Reach Compliance Code	unknown
ECCN code	EAR99
application	ATTENUATOR; SWITCHING
Minimum breakdown voltage	200 V
Shell connection	ISOLATED
Configuration	SINGLE
Maximum diode capacitance	1.2 pF
Nominal diode capacitance	1.2 pF
Diode component materials	SILICON
Maximum diode forward resistance	0.6 Ω
Diode resistance test current	100 mA
Diode resistance test frequency	100 MHz
Diode type	PIN DIODE
JESD-30 code	O-LELF-R2
JESD-609 code	e0
Minority carrier nominal lifetime	2 µs
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum power dissipation	8 W
Certification status	Not Qualified
Reverse test voltage	100 V
surface mount	YES
technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal surface	TIN LEAD
Terminal form	WRAP AROUND
Terminal location	END
Maximum time at peak reflow temperature	NOT SPECIFIED

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UM7000 / UM7100/UM7200

HIGH POWER PIN DIODES

DESCRIPTION

The UM7000 and UM7100 series offer

moderately high power handling in

combination with reasonably low levels of

both series resistance and capacitance. The

UM7200 series offers the lowest series

resistance, but the highest capacitance

of the group. The differences in specified

performance, for each of the series, results from

different I-region thickness. The three series

have broad applicability in many RF and

microwave switch and attenuator circuits.

Additionally, the UM7100 in leaded versions is

usually the most cost-effective diode choice in

high volume usage.

KEY FEATURES

WWW .

Microsemi

Voltage ratings to 1000V (UM7000)

Average power dissipation to 10 W

Series resistance as low as 0.25

Ω

Carrier lifetime greater than 2.5 µs

Non cavity design

Thermally matched configuration

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

Low capacitance at 0 V bias

Low conductance at 0 V bias

ABSOLUTE MAXIMUM RATINGS AT 25º C

(UNLESS OTHERWISE SPECIFIED)

Package

B&E

All

Condition

25 C Pin Temperature

10 W

5.5 W

1.5 W

10 W

7.5 W

UM7000

UM7100

UM7200

C/W

27.5

C/W

20 C/W

C/W

60 kW

35 kW

20 kW

Compatible with automatic insertion

equipment

½ in. total length to 25

C Contact

Free Air

25 C Stud Temperature

25 C End Cap Temperature

APPLICATIONS/BENEFITS

Isolated stud package available

Surface mount package available

1 us pulse (Single)

VOLTAGE RATINGS

Reverse Voltage @ 10 uA

100

200

400

600

800

1000

UM7001

UM7002

UM7006

UM7010

UM7101

UM7102

UM7104

UM7108

UM7201

UM7202

UM7204

UM7000 SERIES

Style “B”

Style “SM”



2005

Rev. 0, 2005-09-08

Microsemi

Page 1

UM7102SM Related Products

	UM7102SM	UM7201SM	UM7001SM	UM7108SM	UM7104SM	UM7006SM	UM7202SM	UM7204SM	UM7002SM	UM7101SM
Description	Pin Diode, 200V V(BR), Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, 100V V(BR), Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, 100V V(BR), Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, 800V V(BR), Silicon,	Pin Diode, 400V V(BR), Silicon,	Pin Diode, 600V V(BR), Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, 200V V(BR), Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, 400V V(BR), Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, 200V V(BR), Silicon, SURFACE MOUNT PACKAGE-2	Pin Diode, 100V V(BR), Silicon, SURFACE MOUNT PACKAGE-2
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	compliant	compliant	unknown	unknown	unknown	unknown	unknow	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
application	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING
Minimum breakdown voltage	200 V	100 V	100 V	800 V	400 V	600 V	200 V	400 V	200 V	100 V
Shell connection	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED
Configuration	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Maximum diode capacitance	1.2 pF	2.2 pF	0.9 pF	1.2 pF	1.2 pF	0.9 pF	2.2 pF	2.2 pF	0.9 pF	1.2 pF
Nominal diode capacitance	1.2 pF	2.2 pF	0.9 pF	1.2 pF	1.2 pF	0.9 pF	2.2 pF	2.2 pF	0.9 pF	1.2 pF
Diode component materials	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON
Maximum diode forward resistance	0.6 Ω	0.25 Ω	1 Ω	0.6 Ω	0.6 Ω	1 Ω	0.25 Ω	0.25 Ω	1 Ω	0.6 Ω
Diode resistance test current	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA
Diode resistance test frequency	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
Diode type	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE
JESD-30 code	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Minority carrier nominal lifetime	2 µs	1.5 µs	2.5 µs	2 µs	2 µs	2.5 µs	1.5 µs	1.5 µs	2.5 µs	2 µs
Number of components	1	1	1	1	1	1	1	1	1	1
Number of terminals	2	2	2	2	2	2	2	2	2	2
Maximum operating temperature	175 °C	175 °C	175 °C	175 °C	175 °C	175 °C	175 °C	175 °C	175 °C	175 °C
Package body material	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS
Package shape	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND
Package form	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum power dissipation	8 W	8 W	8 W	8 W	8 W	8 W	8 W	8 W	8 W	8 W
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Reverse test voltage	100 V	100 V	100 V	100 V	100 V	100 V	100 V	100 V	100 V	100 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND
Terminal location	END	END	END	END	END	END	END	END	END	END
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	Microsemi	-	-	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi
package instruction	SURFACE MOUNT PACKAGE-2	O-LELF-R2	O-LELF-R2	-	-	SURFACE MOUNT PACKAGE-2	SURFACE MOUNT PACKAGE-2	SURFACE MOUNT PACKAGE-2	SURFACE MOUNT PACKAGE-2	SURFACE MOUNT PACKAGE-2
Contacts	2	-	-	2	2	2	2	2	2	2

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