UVPROM, 8KX8, 15ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | DIP |
| package instruction | 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 |
| Contacts | 28 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 15 ns |
| Other features | DIAGNOSTIC PROM |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e0 |
| memory density | 65536 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.12 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| CY7C269-25WC | CY7C269-25JC | CY7C269-40WC | CY7C269-15WMB | |
|---|---|---|---|---|
| Description | UVPROM, 8KX8, 15ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 | OTP ROM, 8KX8, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 | UVPROM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 | UVPROM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
| Parts packaging code | DIP | QLCC | DIP | DIP |
| package instruction | 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 | PLASTIC, LCC-28 | 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 | 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 |
| Contacts | 28 | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 15 ns | 15 ns | 20 ns | 12 ns |
| Other features | DIAGNOSTIC PROM | DIAGNOSTIC PROM | DIAGNOSTIC PROM | DIAGNOSTIC PROM |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-GDIP-T28 | S-PQCC-J28 | R-GDIP-T28 | R-GDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| Memory IC Type | UVPROM | OTP ROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 125 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | QCCJ | DIP | DIP |
| Encapsulate equivalent code | DIP28,.3 | LDCC28,.5SQ | DIP28,.3 | DIP28,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.12 A | 0.12 A | 0.1 A | 0.14 A |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.1 mA | 0.14 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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