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CY7C269-25JC

Description
OTP ROM, 8KX8, 15ns, CMOS, PQCC28, PLASTIC, LCC-28
Categorystorage    storage   
File Size320KB,11 Pages
ManufacturerCypress Semiconductor
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CY7C269-25JC Overview

OTP ROM, 8KX8, 15ns, CMOS, PQCC28, PLASTIC, LCC-28

CY7C269-25JC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeQLCC
package instructionPLASTIC, LCC-28
Contacts28
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time15 ns
Other featuresDIAGNOSTIC PROM
I/O typeCOMMON
JESD-30 codeS-PQCC-J28
JESD-609 codee0
memory density65536 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals28
word count8192 words
character code8000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC28,.5SQ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum standby current0.12 A
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED

CY7C269-25JC Preview

This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer

CY7C269-25JC Related Products

CY7C269-25JC CY7C269-40WC CY7C269-15WMB CY7C269-25WC
Description OTP ROM, 8KX8, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 UVPROM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 UVPROM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 UVPROM, 8KX8, 15ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Parts packaging code QLCC DIP DIP DIP
package instruction PLASTIC, LCC-28 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28
Contacts 28 28 28 28
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 15 ns 20 ns 12 ns 15 ns
Other features DIAGNOSTIC PROM DIAGNOSTIC PROM DIAGNOSTIC PROM DIAGNOSTIC PROM
I/O type COMMON COMMON COMMON COMMON
JESD-30 code S-PQCC-J28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28
JESD-609 code e0 e0 e0 e0
memory density 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type OTP ROM UVPROM UVPROM UVPROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 28 28 28 28
word count 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 125 °C 70 °C
organize 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code QCCJ DIP DIP DIP
Encapsulate equivalent code LDCC28,.5SQ DIP28,.3 DIP28,.3 DIP28,.3
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.12 A 0.1 A 0.14 A 0.12 A
Maximum slew rate 0.12 mA 0.1 mA 0.14 mA 0.12 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location QUAD DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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