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DPS1MK32MKV3-35M

Description
SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size655KB,6 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS1MK32MKV3-35M Overview

SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DPS1MK32MKV3-35M Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerB&B Electronics Manufacturing Company
Parts packaging codePGA
package instructionPGA, PGA66,11X11
Contacts66
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time35 ns
Other featuresUSER CONFIGURABLE AS 4M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CPGA-P66
JESD-609 codee0
memory density33554432 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals66
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize1MX32
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
Maximum seat height9.144 mm
Maximum standby current0.0144 A
Minimum standby current2 V
Maximum slew rate0.96 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
4Mx8/2Mx16/1Mx32, 20 - 45ns, PGA
30A128-14
B
32 Megabit High Speed CMOS SRAM
DPS1MK32MKV3
DESCRIPTION:
The DPS1MK32MKV3 ‘’VERSA-STACK’’ module is a
revolutionary new high speed memory subsystem using
Dense-Pac Microsystems’ ceramic Stackable Leadless Chip
Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers
32 Megabits of SRAM in a package envelope of 1.190 x 1.190 x
0.360 inches.
The DPS1MK32MKV3 contains eight individual 512K x 8 SRAMs,
packaged in their own hermetically sealed SLCCs making the
module suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a
higher board density of memory than available with conventional
through-hole, surface mount, module, or hybrid techniques.
FEATURES:
Organizations Available:
READ:
1Meg x 32
WRITE:
1Meg x 32, 2 Meg x 16
or 4 Meg x 8
Access Times:
20, 25, 35, 45ns
Fully Static Operation
- No clock or refresh required
Low Power Dissipation
Single +5V Power Supply,
±10%
Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Current
66-Pin PGA Special ‘’VERSA-STACK’’
Package with Compatable Footprint
FUNCTIONAL BLOCK DIAGRAM
PIN-OUT DIAGRAM
PIN NAMES
A0 - A18
I/O0 - I/O31
CE0, CE1
WE0 - WE3
OE
V
DD
V
SS
N.C.
Address Inputs
Data Input/Output
Low Chip Enables
Write Enables
Output Enable
Power (+5V)
Ground
No Connect
30A128-14
REV. B
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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