SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
| Parameter Name | Attribute value |
| Maker | B&B Electronics Manufacturing Company |
| Parts packaging code | PGA |
| package instruction | PGA, |
| Contacts | 66 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 30 ns |
| JESD-30 code | S-CPGA-P66 |
| memory density | 33554432 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 66 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX32 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 9.144 mm |
| Minimum standby current | 2 V |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |





| DPS1MK32MKV3-30C | DPS1MK32MKV3-30B | DPS1MK32MKV3-30M | DPS1MK32MKV3-30I | |
|---|---|---|---|---|
| Description | SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 |
| Maker | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company |
| Parts packaging code | PGA | PGA | PGA | PGA |
| package instruction | PGA, | 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | PGA, | PGA, |
| Contacts | 66 | 66 | 66 | 66 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.A | 3A001.A.2.C | 3A001.A.2.C | 3A991.B.2.A |
| Maximum access time | 30 ns | 30 ns | 30 ns | 30 ns |
| JESD-30 code | S-CPGA-P66 | S-CPGA-P66 | S-CPGA-P66 | S-CPGA-P66 |
| memory density | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 32 | 32 | 32 | 32 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 66 | 66 | 66 | 66 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 85 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -40 °C |
| organize | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA | PGA | PGA | PGA |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 9.144 mm | 9.144 mm | 9.144 mm | 9.144 mm |
| Minimum standby current | 2 V | 2 V | 2 V | 2 V |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | INDUSTRIAL |
| Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |