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DPS1MK32MKV3-30C

Description
SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size213KB,6 Pages
ManufacturerB&B Electronics Manufacturing Company
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DPS1MK32MKV3-30C Overview

SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DPS1MK32MKV3-30C Parametric

Parameter NameAttribute value
MakerB&B Electronics Manufacturing Company
Parts packaging codePGA
package instructionPGA,
Contacts66
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time30 ns
JESD-30 codeS-CPGA-P66
memory density33554432 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals66
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX32
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height9.144 mm
Minimum standby current2 V
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR

DPS1MK32MKV3-30C Related Products

DPS1MK32MKV3-30C DPS1MK32MKV3-30B DPS1MK32MKV3-30M DPS1MK32MKV3-30I
Description SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Maker B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company
Parts packaging code PGA PGA PGA PGA
package instruction PGA, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 PGA, PGA,
Contacts 66 66 66 66
Reach Compliance Code unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A001.A.2.C 3A001.A.2.C 3A991.B.2.A
Maximum access time 30 ns 30 ns 30 ns 30 ns
JESD-30 code S-CPGA-P66 S-CPGA-P66 S-CPGA-P66 S-CPGA-P66
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 66 66 66 66
word count 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 125 °C 125 °C 85 °C
Minimum operating temperature - -55 °C -55 °C -40 °C
organize 1MX32 1MX32 1MX32 1MX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code PGA PGA PGA PGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 9.144 mm 9.144 mm 9.144 mm 9.144 mm
Minimum standby current 2 V 2 V 2 V 2 V
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL MILITARY MILITARY INDUSTRIAL
Terminal form PIN/PEG PIN/PEG PIN/PEG PIN/PEG
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR
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