DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD753012A, 753016A, 753017A
4-BIT SINGLE-CHIP MICROCONTROLLER
DESCRIPTION
The
µ
PD753017A is one of the 75XL series 4-bit single-chip microcontroller chips and has a data processing
capability comparable to that of an 8-bit microcontroller.
It has an on-chip LCD controller/driver with a larger ROM capacity and extended CPU functions compared with
the conventional
µ
PD75316B, and can provide high-speed operation at a low supply voltage of 1.8 V. It can be
supplied in a small plastic TQFP package (12
×
12 mm) and is suitable for small sets using LCD panels.
Detailed descriptions of functions are provided in the following document. Be sure to
read the document before designing.
µ
PD753017 User’s Manual : U11282E
FEATURES
• Low voltage operation: V
DD
= 1.8 to 5.5 V
· Can be driven by two 1.5 V batteries
• On-chip memory
· Program memory (ROM):
12288
×
8 bits (
µ
PD753012A)
16384
×
8 bits (
µ
PD753016A)
24576
×
8 bits (
µ
PD753017A)
· Data memory (RAM):
1024
×
4 bits
• Capable of high-speed operation and variable instruction
execution time for power saving
· 0.95, 1.91, 3.81, 15.3
µ
s (at 4.19 MHz operation)
· 0.67, 1.33, 2.67, 10.7
µ
s (at 6.0 MHz operation)
· 122
µ
s (at 32.768 kHz operation)
• Internal programmable LCD controller/driver
• Small plastic TQFP (12
×
12 mm)
· Suitable for small sets such as cameras
• One-time PROM:
µ
PD75P3018A
APPLICATION
Remote controllers, camera-integrated VCRs, cameras, gas meters, etc.
In this document, unless otherwise specified, the description is made based on
µ
PD753017A as typical
product.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. U11662EJ2V0DS00 (2nd edition)
Date Published July 2000 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1996, 2000
µ
PD753012A, 753016A, 753017A
ORDERING INFORMATION
Part number
Package
80-pin plastic QFP (14
×
14 mm, resin thickness 2.7 mm)
80-pin plastic QFP (14
×
14 mm, resin thickness 1.4 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
80-pin plastic QFP (14
×
14 mm, resin thickness 2.7 mm)
80-pin plastic QFP (14
×
14 mm, resin thickness 1.4 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
80-pin plastic QFP (14
×
14 mm, resin thickness 2.7 mm)
80-pin plastic QFP (14
×
14 mm, resin thickness 1.4 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
µ
PD753012AGC-XXX-3B9
µ
PD753012AGC-XXX-8BT
µ
PD753012AGK-XXX-BE9
µ
PD753012AGK-XXX-9EU
µ
PD753016AGC-XXX-3B9
µ
PD753016AGC-XXX-8BT
µ
PD753016AGK-XXX-BE9
µ
PD753016AGK-XXX-9EU
µ
PD753017AGC-XXX-3B9
µ
PD753017AGC-XXX-8BT
µ
PD753017AGK-XXX-BE9
µ
PD753017AGK-XXX-9EU
Remark
XXX indicates ROM code suffix.
2
Data Sheet U11662EJ2V0DS00
µ
PD753012A, 753016A, 753017A
FUNCTION OUTLINE
Parameter
Instruction execution time
Function
• 0.95, 1.91, 3.81, 15.3
µ
s (main system clock: at 4.19 MHz operation)
• 0.67, 1.33, 2.67, 10.7
µ
s (main system clock: at 6.0 MHz operation)
• 122
µ
s (subsystem clock: at 32.768 kHz operation)
ROM
12288
×
8 bits (
µ
PD753012A)
16384
×
8 bits (
µ
PD753016A)
24576
×
8 bits (
µ
PD753017A)
RAM
General purpose register
1024
×
4 bits
• 4-bit operation: 8
×
4 banks
• 8-bit operation: 4
×
4 banks
8
16
8
8
On-chip pull-up resistors can be specified by using
software: 23
Also used for segment pins
Withstands 13 V, on-chip pull-up resistors can be specified by using mask
option
Internal memory
Input/
output
port
CMOS input
CMOS input/output
CMOS output
N-ch open-drain
input/output
Total
40
• Segment number selection
• Display mode selection
: 24/28/32 segments (can be changed to CMOS
output port in 4 time-unit; max. 8)
: Static, 1/2 duty (1/2 bias), 1/3 duty (1/2 bias),
1/3 duty (1/3 bias), 1/4 duty (1/3 bias)
LCD controller/driver
On-chip split resistor for LCD drive can be specified by using mask option
Timer
5 channels
• 8-bit timer/event counter: 3 channels (can be used for 16-bit timer/event counter, carrier
generator, timer with gate)
• Basic interval timer/watchdog timer: 1 channel
• Watch timer: 1 channel
Serial interface
• 3-wire serial I/O mode ... MSB or LSB can be selected for transferring first bit
• 2-wire serial I/O mode
• SBI mode
Bit sequential buffer
Clock output (PCL)
16 bits
•
Φ,
524, 262, 65.5 kHz (main system clock: at 4.19 MHz operation)
•
Φ,
750, 375, 93.8 kHz (main system clock: at 6.0 MHz operation)
Buzzer output (BUZ)
• 2, 4, 32 kHz
(main system clock: at 4.19 MHz operation
or subsystem clock: at 32.768 kHz operation)
• 2.93, 5.86, 46.9 kHz (main system clock: at 6.0 MHz operation)
External: 3, Internal: 5
External: 1, Internal: 1
• Ceramic or crystal oscillator for main system clock oscillation
• Crystal oscillator for subsystem clock oscillation
STOP/HALT mode
V
DD
= 1.8 to 5.5 V
• 80-pin plastic QFP (14
×
14 mm)
• 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
Vectored interrupt
Test input
System clock oscillator
Standby function
Power supply voltage
Package
Data Sheet U11662EJ2V0DS00
3
µ
PD753012A, 753016A, 753017A
CONTENTS
1. PIN CONFIGURATION (Top View) ..................................................................................................... 6
2. BLOCK DIAGRAM ............................................................................................................................... 8
3. PIN
3.1
3.2
3.3
3.4
FUNCTION .................................................................................................................................... 9
Port Pins ...................................................................................................................................... 9
Non-port Pins ............................................................................................................................ 11
Pin Input/Output Circuits ......................................................................................................... 13
Recommended Connection for Unused Pins ......................................................................... 15
4. SWITCHING FUNCTION BETWEEN Mk I MODE AND Mk II MODE ......................................... 16
4.1 Differences between Mk I Mode and Mk II Mode .................................................................... 16
4.2 Setting Method of Stack Bank Select Register (SBS) ........................................................... 17
5. MEMORY CONFIGURATION ............................................................................................................18
6. PERIPHERAL HARDWARE FUNCTIONS ....................................................................................... 23
6.1 Digital Input/Output Ports ........................................................................................................ 23
6.2 Clock Generator ........................................................................................................................24
6.3 Subsystem Clock Oscillator Control Functions .................................................................... 25
6.4 Clock Output Circuit .................................................................................................................26
6.5 Basic Interval Timer/Watchdog Timer ..................................................................................... 27
6.6 Watch Timer ..............................................................................................................................28
6.7 Timer/Event Counter .................................................................................................................29
6.8 Serial Interface .......................................................................................................................... 33
6.9 LCD Controller/Driver ............................................................................................................... 35
6.10 Bit Sequential Buffer ................................................................................................................ 37
7. INTERRUPT FUNCTION AND TEST FUNCTION .......................................................................... 38
8. STANDBY FUNCTION .......................................................................................................................40
9. RESET FUNCTION ............................................................................................................................ 41
10. MASK OPTION .................................................................................................................................. 44
11. INSTRUCTION SET ........................................................................................................................... 45
12. ELECTRICAL SPECIFICATIONS ...................................................................................................... 57
13. CHARACTERISTICS CURVES (REFERENCE VALUES) .............................................................. 71
14. PACKAGE DRAWINGS ..................................................................................................................... 73
15. RECOMMENDED SOLDERING CONDITIONS ................................................................................ 77
4
Data Sheet U11662EJ2V0DS00
µ
PD753012A, 753016A, 753017A
APPENDIX A.
µ
PD75316B, 753017A AND 75P3018A FUNCTION LIST ........................................... 79
APPENDIX B. DEVELOPMENT TOOLS ................................................................................................ 81
APPENDIX C. RELATED DOCUMENTS ................................................................................................ 85
Data Sheet U11662EJ2V0DS00
5
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