Z0803806CME datasheet, PDF - EEWORLD Datasheet

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Z0803806CME: DescriptionFIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，40 Pages; ManufacturerZilog, Inc.; Websitehttps://www.zilog.com/

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Z0803806CME Overview

FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40

Z0803806CME Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Zilog, Inc.
Parts packaging code	DIP
package instruction	DIP,
Contacts	40
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Address bus width	8
boundary scan	NO
Bus compatibility	Z8001; Z8002; Z8
External data bus width	8
JESD-30 code	R-CDIP-T40
JESD-609 code	e0
low power mode	NO
Number of terminals	40
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	4.699 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MEMORY CONTROLLER, FIFO

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Z0803806CME Related Products

	Z0803806CME	Z0803804CMB	Z0803806CMB	Z0853806CMB	Z0853806CME	Z0853806LME	Z0853806LMB	Z0803806LME	Z0803806LMB
Description	FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40	FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40	FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40	FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40	FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40	FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44	FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44	FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44	FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44
Maker	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.
Parts packaging code	DIP	DIP	DIP	DIP	DIP	LCC	LCC	LCC	LCC
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	QCCN,	QCCN,	QCCN,	QCCN,
Contacts	40	40	40	40	40	44	44	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
boundary scan	NO	NO	NO	NO	NO	NO	NO	NO	NO
Bus compatibility	Z8001; Z8002; Z8	Z8001; Z8002; Z8	Z8001; Z8002; Z8	8080; Z80	8080; Z80	8080; Z80	8080; Z80	Z8001; Z8002; Z8	Z8001; Z8002; Z8
External data bus width	8	8	8	8	8	8	8	8	8
JESD-30 code	R-CDIP-T40	R-CDIP-T40	R-CDIP-T40	R-CDIP-T40	R-CDIP-T40	S-CQCC-N44	S-CQCC-N44	S-CQCC-N44	S-CQCC-N44
low power mode	NO	NO	NO	NO	NO	NO	NO	NO	NO
Number of terminals	40	40	40	40	40	44	44	44	44
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	QCCN	QCCN	QCCN	QCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.699 mm	4.699 mm	4.699 mm	4.699 mm	4.699 mm	2.286 mm	2.286 mm	2.286 mm	2.286 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	QUAD
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	16.51 mm	16.51 mm	16.51 mm	16.51 mm
uPs/uCs/peripheral integrated circuit type	MEMORY CONTROLLER, FIFO	MEMORY CONTROLLER, FIFO	MEMORY CONTROLLER, FIFO	MEMORY CONTROLLER, FIFO	MEMORY CONTROLLER, FIFO	MEMORY CONTROLLER, FIFO	MEMORY CONTROLLER, FIFO	MEMORY CONTROLLER, FIFO	MEMORY CONTROLLER, FIFO
Is it Rohs certified?	incompatible	incompatible	incompatible	-	-	-	-	incompatible	incompatible
Address bus width	8	8	8	-	-	-	-	8	8
JESD-609 code	e0	e0	e0	-	-	-	-	e0	e0
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Filter level	-	MIL-STD-883 Class B	MIL-STD-883 Class B	MIL-STD-883 Class B	-	-	MIL-STD-883 Class B	-	MIL-STD-883 Class B

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