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Z0853806LME

Description
FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,40 Pages
ManufacturerZilog, Inc.
Websitehttps://www.zilog.com/
Download Datasheet Parametric Compare View All

Z0853806LME Overview

FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44

Z0853806LME Parametric

Parameter NameAttribute value
MakerZilog, Inc.
Parts packaging codeLCC
package instructionQCCN,
Contacts44
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
boundary scanNO
Bus compatibility8080; Z80
External data bus width8
JESD-30 codeS-CQCC-N44
length16.51 mm
low power modeNO
Number of terminals44
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeSQUARE
Package formCHIP CARRIER
Certification statusNot Qualified
Maximum seat height2.286 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width16.51 mm
uPs/uCs/peripheral integrated circuit typeMEMORY CONTROLLER, FIFO

Z0853806LME Related Products

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Description FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44
Maker Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc.
Parts packaging code LCC DIP DIP DIP DIP DIP LCC LCC LCC
package instruction QCCN, DIP, DIP, DIP, DIP, DIP, QCCN, QCCN, QCCN,
Contacts 44 40 40 40 40 40 44 44 44
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
boundary scan NO NO NO NO NO NO NO NO NO
Bus compatibility 8080; Z80 Z8001; Z8002; Z8 Z8001; Z8002; Z8 8080; Z80 Z8001; Z8002; Z8 8080; Z80 8080; Z80 Z8001; Z8002; Z8 Z8001; Z8002; Z8
External data bus width 8 8 8 8 8 8 8 8 8
JESD-30 code S-CQCC-N44 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 S-CQCC-N44 S-CQCC-N44 S-CQCC-N44
low power mode NO NO NO NO NO NO NO NO NO
Number of terminals 44 40 40 40 40 40 44 44 44
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN DIP DIP DIP DIP DIP QCCN QCCN QCCN
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE
Package form CHIP CARRIER IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.286 mm 4.699 mm 4.699 mm 4.699 mm 4.699 mm 4.699 mm 2.286 mm 2.286 mm 2.286 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO NO NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD DUAL DUAL DUAL DUAL DUAL QUAD QUAD QUAD
width 16.51 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 16.51 mm 16.51 mm 16.51 mm
uPs/uCs/peripheral integrated circuit type MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO
Is it Rohs certified? - incompatible incompatible - incompatible - - incompatible incompatible
Address bus width - 8 8 - 8 - - 8 8
JESD-609 code - e0 e0 - e0 - - e0 e0
Filter level - MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B - - MIL-STD-883 Class B - MIL-STD-883 Class B
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)

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