REVISIONS
LTR
DESCRIPTION
DATE
(YR-MO-DA)
APPROVED
PRELIMINARY
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
15
REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Jeff Bowling
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
APPROVED BY
Raymond Monnin
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FIELD
PROGRAMMABLE GATE ARRAY 2000 GATES,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
SIZE
REVISION LEVEL
CAGE CODE
A
SHEET
1
67268
OF
16
5962-96836
AMSC N/A
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is be as shown in the following example:
5962
*
*
*
*
*
*
-
96836
01
*
*
*
Federal
stock class
designator
\
RHA
designator
(1.2.1)
/
Device
type
(See 1.2.2)
Device
Case
class
outline
designator (See 1.2.4)
(See 1.2.3)
*
*
*
M
*
*
*
X
Lead
finish
(See 1.2.5)
*
*
*
X
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified
RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
Generic number
QL12X16B-0
QL12X16B-1
Circuit function
2000 Gate CMOS FPGA
2000 Gate CMOS FPGA
Delay Factor (K)
Min
Max
0.39
1.82
0.39
1.56
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B
microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
CMGA15-PN
Terminals
84
Package style
Pin grid array 1/
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A
for device class M.
1.3 Absolute maximum ratings. 2/
Supply voltage range (VCC) - - - - - - - - - - - - - - - - - -
Programming supply voltage range (VPP) - - - - - - - -
DC input voltage range - - - - - - - - - - - - - - - - - - - - - -
Maximum power dissipation - - - - - - - - - - - - - - - - - -
Lead temperature (soldering, 10 seconds) - - - - - - -
Thermal resistance, junction-to-case ( JC):
Case outline X - - - - - - - - - - - - - - - - - - - - - - - - - - -
Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - -
Storage temperature range - - - - - - - - - - - - - - - - - -
Data retention - - - - - - - - - - - - - - - - - - - - - - - - - - - -
-2.0 V dc to +7.0 V dc
-2.0 V dc to +13.5 V dc
-2.0 V dc to +7.0 V dc
2.5 W 3/
+300 C
5.3 C/W
+175 C 4/
-65 C to +150 C
10 years (minimum)
1/ Actual number of pins is 85, including one index or orientation pin (C3).
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum
levels may degrade performance and affect reliability.
3/ Must withstand the added PD due to short circuit test (e.g., IOS).
4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-96836
SHEET
2
1.4 Recommended operating conditions. 5/
Case operating temperature Range(TC) - - - - - - - - - -
Supply voltage relative to ground(VCC) - - - - - - - - - -
Ground voltage (GND) - - - - - - - - - - - - - - - - - - - - - -
Input high voltage (VIH) - - - - - - - - - - - - - - - - - - - - - -
Input low voltage (VIL) - - - - - - - - - - - - - - - - - - - - - -
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) - - - - -
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless
otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cited in the
solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in
the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-88
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
6/ percent
-55 C to +125 C
+4.5 V dc minimum to +5.5 V dc maximum
0 V dc
2.0 V dc minimum
0.8 V dc maximum
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials, 1916 Race
Street, Philadelphia, PA 19103.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard No. 17
-
A Standardized Test Procedure for the Characterization of
Latch-up in CMOS Integrated Circuits.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Blvd., Arlington, VA 22201.
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents also may be available in or through libraries or other informational services.)
5/
6/
All voltage values in this drawing are with respect to VSS.
Values will be added when they become available.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-96836
SHEET
3
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535
and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in
accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit will be provided when RHA product becomes available.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating
temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests
for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall
still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall
be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed
manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance
shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein).
The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that
the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class
M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in
MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this
drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)
involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available
onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit
group number 42 (see MIL-PRF-38535, appendix A).
3.11 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in
a wide variety of configurations, two processing options are provided for selection in the contract.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-96836
SHEET
4
3.11.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in table IIA.
It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration.
3.11.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein,
including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery.
3.12 Data Retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design or process changes which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the
acquiring or preparing activity, along with the test data.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-
PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance
with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance
with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Delete the sequence specified as initial (pre-burn-in) electrical parameters through interim (post-burn-in)
electrical parameters of method 5004 and substitute lines 1 through 5 of table IIA herein.
The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available
to the preparing or acquiring activity upon request. Test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015. Use of built-in test circuitry testing
the entire lot to verify programmability and AC performance without programming the user array is an option the
manufacturer may use.
Interim and final electrical test parameters shall be as specified in table IIA herein.
b.
c.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device
manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-
PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table IIA herein.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-
38535, appendix B.
b.
c.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-
38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of MIL-PRF-38535 permits
alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535,
appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of
MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-96836
SHEET
5
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