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7188S45EB

Description
CPACK-24, Tube
Categorystorage    storage   
File Size364KB,7 Pages
ManufacturerIDT (Integrated Device Technology)
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7188S45EB Overview

CPACK-24, Tube

7188S45EB Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeCPACK
package instruction0.300 INCH, CERAMIC, PACKAGE-24
Contacts24
Manufacturer packaging codeCP24
Reach Compliance Codenot_compliant
Maximum access time45 ns
I/O typeCOMMON
JESD-30 codeR-CDFP-F24
JESD-609 codee0
memory density65536 bit
Memory IC TypeSTANDARD SRAM
memory width4
Humidity sensitivity level1
Number of functions1
Number of terminals24
word count16384 words
character code16000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16KX4
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Encapsulate equivalent codeFL24,.4
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B
Maximum standby current0.02 A
Minimum standby current4.5 V
Maximum slew rate0.14 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

7188S45EB Related Products

7188S45EB 7188S20P
Description CPACK-24, Tube PDIP-22, Tube
Brand Name Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code CPACK PDIP
package instruction 0.300 INCH, CERAMIC, PACKAGE-24 DIP, DIP22,.3
Contacts 24 22
Manufacturer packaging code CP24 PD22
Reach Compliance Code not_compliant not_compliant
Maximum access time 45 ns 20 ns
I/O type COMMON COMMON
JESD-30 code R-CDFP-F24 R-PDIP-T22
JESD-609 code e0 e0
memory density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 4 4
Humidity sensitivity level 1 1
Number of functions 1 1
Number of terminals 24 22
word count 16384 words 16384 words
character code 16000 16000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 70 °C
organize 16KX4 16KX4
Output characteristics 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
encapsulated code DFP DIP
Encapsulate equivalent code FL24,.4 DIP22,.3
Package shape RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 245
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum standby current 0.02 A 0.015 A
Minimum standby current 4.5 V 4.5 V
Maximum slew rate 0.14 mA 0.125 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES NO
technology CMOS CMOS
Temperature level MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
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