7188S20P datasheet, PDF - EEWORLD Datasheet

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7188S20P: DescriptionPDIP-22, Tube; Categorystorage storage; File Size364KB，7 Pages; ManufacturerIDT (Integrated Device Technology)

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7188S20P Overview

PDIP-22, Tube

7188S20P Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	PDIP
package instruction	DIP, DIP22,.3
Contacts	22
Manufacturer packaging code	PD22
Reach Compliance Code	not_compliant
Maximum access time	20 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T22
JESD-609 code	e0
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Humidity sensitivity level	1
Number of functions	1
Number of terminals	22
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP22,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	245
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.015 A
Minimum standby current	4.5 V
Maximum slew rate	0.125 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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7188S20P Related Products

	7188S20P	7188S45EB
Description	PDIP-22, Tube	CPACK-24, Tube
Brand Name	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	PDIP	CPACK
package instruction	DIP, DIP22,.3	0.300 INCH, CERAMIC, PACKAGE-24
Contacts	22	24
Manufacturer packaging code	PD22	CP24
Reach Compliance Code	not_compliant	not_compliant
Maximum access time	20 ns	45 ns
I/O type	COMMON	COMMON
JESD-30 code	R-PDIP-T22	R-CDFP-F24
JESD-609 code	e0	e0
memory density	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	4	4
Humidity sensitivity level	1	1
Number of functions	1	1
Number of terminals	22	24
word count	16384 words	16384 words
character code	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C
organize	16KX4	16KX4
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DFP
Encapsulate equivalent code	DIP22,.3	FL24,.4
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	245	260
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum standby current	0.015 A	0.02 A
Minimum standby current	4.5 V	4.5 V
Maximum slew rate	0.125 mA	0.14 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED

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