EEPROM, 128X8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Catalyst |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | 3 WIRE INTERFACE |
| Spare memory width | 16 |
| Maximum clock frequency (fCLK) | 1 MHz |
| Data retention time - minimum | 100 |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| length | 4.9 mm |
| memory density | 1024 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 128 words |
| character code | 128 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Serial bus type | MICROWIRE |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.9 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | SOFTWARE |
| CAT93C46BJ | CAT93C46BS | CAT93C46BSI | CAT93C46BPI | CAT93C46BP | CAT93C46BJI | CAT93C46BK | |
|---|---|---|---|---|---|---|---|
| Description | EEPROM, 128X8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, 0.210 INCH, EIAJ, SOIC-8 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
| Parts packaging code | SOIC | SOIC | SOIC | DIP | DIP | SOIC | SOIC |
| package instruction | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.3 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | 3 WIRE INTERFACE | 3 WIRE INTERFACE | 3 WIRE INTERFACE | 3 WIRE INTERFACE | 3 WIRE INTERFACE | 3 WIRE INTERFACE | 3 WIRE INTERFACE |
| Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum clock frequency (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| Data retention time - minimum | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 4.9 mm | 4.9 mm | 4.9 mm | 9.27 mm | 9.27 mm | 4.9 mm | 5.3 mm |
| memory density | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| character code | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| organize | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | DIP | DIP | SOP | SOP |
| Encapsulate equivalent code | SOP8,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 4.57 mm | 4.57 mm | 1.75 mm | 2.03 mm |
| Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 5.25 mm |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| write protect | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |