
128K X 8 SPI BUS SERIAL EEPROM, PDSO8
| Parameter Name | Attribute value |
| Brand Name | ON Semiconduc |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, TSSOP8,.25 |
| Contacts | 8 |
| Manufacturer packaging code | 948AL |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 1 MHz |
| Data retention time - minimum | 100 |
| Durability | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DDMR |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e4 |
| length | 4.4 mm |
| memory density | 1048576 bi |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 128KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.000005 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | HARDWARE |
| Base Number Matches | 1 |

| CAT24M01YE-GT3 | CAT24M01LE-G | CAT24M01WE-GT3 | CAT24M01XE-T2 | |
|---|---|---|---|---|
| Description | 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to |
| Parts packaging code | TSSOP | DIP | SOIC | SOIC |
| package instruction | TSSOP, TSSOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | 0.208 INCH, HALOGEN FREE AND ROHS COMPLIANT, SOIC-8 |
| Contacts | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| Data retention time - minimum | 100 | 100 | 100 | 100 |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DDMR | 1010DDMR | 1010DDMR | 1010DDMR |
| JESD-30 code | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e4 | e4 | e4 | e3 |
| length | 4.4 mm | 9.27 mm | 4.9 mm | 5.255 mm |
| memory density | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | DIP | SOP | SOP |
| Encapsulate equivalent code | TSSOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED |
| power supply | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 5.33 mm | 1.75 mm | 2.03 mm |
| Serial bus type | SPI | SPI | SPI | SPI |
| Maximum standby current | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
| Maximum slew rate | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | MATTE TIN |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | 40 | NOT SPECIFIED |
| width | 3 mm | 7.62 mm | 3.9 mm | 5.23 mm |
| Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms |
| write protect | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| Maker | - | ON Semiconductor | ON Semiconductor | ON Semiconductor |