FIFO, 64X8, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | DIP, DIP28,.3 |
| Contacts | 28 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 40 ns |
| Maximum clock frequency (fCLK) | 15 MHz |
| period time | 66.67 ns |
| JESD-30 code | R-GDIP-T28 |
| length | 37.0205 mm |
| memory density | 512 bi |
| Memory IC Type | OTHER FIFO |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 64X8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.125 A |
| Maximum slew rate | 0.173 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8966401XX | 5962-8966402XX | CY7C408A-25LMBR | CY7C409A-25LMBR | CY7C408A-25VCR | CY7C408A-15VCR | CY7C408A-15LMBR | CY7C409A-35VCR | CY7C409A-25VCR | |
|---|---|---|---|---|---|---|---|---|---|
| Description | FIFO, 64X8, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | FIFO, 64X8, 23ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | FIFO, 64X8, 23ns, Asynchronous, CMOS, CQCC28, CERAMIC, LCC-28 | FIFO, 64X9, 23ns, Asynchronous, CMOS, CQCC28, CERAMIC, LCC-28 | FIFO, 64X8, 23ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | FIFO, 64X8, 40ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | FIFO, 64X8, 40ns, Asynchronous, CMOS, CQCC28, CERAMIC, LCC-28 | FIFO, 64X9, 16ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | FIFO, 64X9, 23ns, Asynchronous, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 |
| Parts packaging code | DIP | DIP | QLCC | QLCC | SOJ | SOJ | QLCC | SOJ | SOJ |
| package instruction | DIP, DIP28,.3 | DIP, | QCCN, | QCCN, | SOJ, | SOJ, | QCCN, | SOJ, | SOJ, |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 40 ns | 23 ns | 23 ns | 23 ns | 23 ns | 40 ns | 40 ns | 16 ns | 23 ns |
| period time | 66.67 ns | 40 ns | 40 ns | 40 ns | 40 ns | 66.67 ns | 66.67 ns | 28.57 ns | 40 ns |
| JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | S-CQCC-N28 | S-CQCC-N28 | R-PDSO-J28 | R-PDSO-J28 | S-CQCC-N28 | R-PDSO-J28 | R-PDSO-J28 |
| length | 37.0205 mm | 37.0205 mm | 11.43 mm | 11.43 mm | 17.91 mm | 17.91 mm | 11.43 mm | 17.91 mm | 17.91 mm |
| memory density | 512 bi | 512 bit | 512 bit | 576 bit | 512 bit | 512 bit | 512 bit | 576 bit | 576 bit |
| memory width | 8 | 8 | 8 | 9 | 8 | 8 | 8 | 9 | 9 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
| character code | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | - | - | -55 °C | - | - |
| organize | 64X8 | 64X8 | 64X8 | 64X9 | 64X8 | 64X8 | 64X8 | 64X9 | 64X9 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | TOTEM POLE | 3-STATE | 3-STATE | 3-STATE | TOTEM POLE | TOTEM POLE |
| Exportable | YES | YES | YES | NO | YES | YES | YES | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | QCCN | QCCN | SOJ | SOJ | QCCN | SOJ | SOJ |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 1.9812 mm | 1.9812 mm | 3.56 mm | 3.56 mm | 1.9812 mm | 3.56 mm | 3.56 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | J BEND | J BEND | NO LEAD | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm | 11.43 mm | 11.43 mm | 7.5 mm | 7.5 mm | 11.43 mm | 7.5 mm | 7.5 mm |
| Maker | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |