iC-NZN
N-TYPE LASER DIODE DRIVER
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APPLICATIONS
o
Pulsed and CW laser diode
modules
o
Laser diode pointers
o
Laser levels
o
Bar-code readers
o
Distance measurement
o
Blue laser diodes
FEATURES
o
Peak value controlled laser diode driver for operation from CW
up to 155 MHz
o
Spike-free switching of laser currents of up to 300 mA
o
Setting of laser power (APC) via external resistor
o
Optional current control (ACC)
o
Laser current limitation
o
LVDS/TTL switching input with TTL monitor output
o
Low current consumption sleep-mode < 50 µA
o
Safety shutdown with overtemperature
o
Error signal output with overtemperature, undervoltage and
overcurrent
o
All current LD types can be used (N/P/M configurations)
o
Blue laser diodes supported
o
Fast soft-start
o
Strong suppression of transients with small external capacitors
PACKAGES
QFN24
4 mm x 4 mm
BLOCK DIAGRAM
RVDD
+3..+5.5V
VDD
i(RSI)x540
LDA MONITOR
LDA
CVDD
100 nF..
RSI
0.68.. 9kΩ
RSI
NSLP
VDD
iC-NZN
&
1
CLDA
IMON
LDK
N
..300mA
100 nF..
REGE
AVG
VSY
SYN
EP
EN
VDD
&
REF
LVDS/TTL
+
-
+
x240
CI
-
ECI
CI
CIS
..10 nF..
TTL
CID
INPUT INTERFACE
NERR
OverTemp.
1
OverCurrent
Low V(LDA)
Bandgap, Reference, Overtemp
OUTPUT MONITOR
T.PAD
GND
ECI
OUTPUT DRIVER
AGND
MD
RMD
GND
PMD
RGND
suitable laser diode configurations
N
M
P
Copyright © 2012 iC-Haus
http://www.ichaus.com
iC-NZN
N-TYPE LASER DIODE DRIVER
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Rev B2, Page 2/17
DESCRIPTION
Laser diode pulse driver iC-NZN allows CW opera-
tion of laser diodes and spike-free switching with de-
fined current pulses up to 155 MHz. The optical out-
put power of the laser diode is set-up by means of an
external resistor (RMD/PMD). For laser current con-
trol without a monitor diode, the laser current moni-
tor at pin IMON is utilised. For high pulse frequen-
cies the device can be switched into controlled
burst
mode.
A previously settled operating point is main-
tained throughout the burst phase.
An averaging current monitor can be set by means of
an external resistor at pin RSI. When the current limit
is reached, overcurrent is signalled at NERR and the
current from pin LDA is limited to the pre-set value
but the iC is not shut down. There is an additional
current limitation in pin LDK that prevents the iC from
overpowering the laser diode.
Setting pin NSLP low, the iC enters a low consump-
tion sleep-mode (< 50 µA typ.).
PACKAGES QFN24 4 mm x 4 mm to JEDEC
PIN CONFIGURATION
PIN FUNCTIONS
No. Name Function
22
21
20
19
24
23
1
2
3
4
5
6
18
17
16
NZN
code...
...
15
14
13
7
8
9
10
11
12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
VDD
AVG
MD
IMON
CID
EP
EN
TTL
VSY
SYN
RGND
RVDD
LDK
AGND
CIS
CI
LDA
Power Supply
Enable Averaging Control
APC setup, monitor input
Laser Current Monitor
Enable Pulldown Current at CI
Positive LVDS/TTL switching input
Negative LVDS switching input
Enable TTL input
Sync Output Supply Voltage
Sync Output
Reference Ground
Reference (P-type laser diodes)
Laser Diode Cathode
Analog ground
Power Control Capacitor sense
Power Control Capacitor
Laser Diode Anode
n/c
RSI
Current Monitor Setup
REGE Control Enable
GND Ground
NSLP Not Sleep-Mode
NERR Error Output
n/c
The
Thermal Pad
is to be connected to a Ground Plane (GND) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation ( NZN label and coding is subject
to change).
iC-NZN
N-TYPE LASER DIODE DRIVER
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Rev B2, Page 3/17
PACKAGE DIMENSIONS
RECOMMENDED PCB-FOOTPRINT
3.80
2.49
15
R0.
SIDE
2.49
0.50
0.30
0.90
3.80
TOP
4
BOTTOM
2.45
0.70
0.40
dra_qfn24-1_pack_1, 10:1
0.50
0.25
All dimensions given in mm.
2.45
4
iC-NZN
N-TYPE LASER DIODE DRIVER
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Rev B2, Page 4/17
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item
No.
Symbol
Parameter
Voltage at VDD
Current in VDD
Current in CI
Current in NERR
Current in MD
Current in EP, EN, TTL, REGE, NSLP,
AVG, CID
Current in LDK
Current in LDA
Current in RSI
Current in VSYNC
Current in SYNC
Current in IMON
Voltage at RSI, VSY, SYN, EP, EN,
TTL, REGE, AVG, CID, RGND, MD, CI,
IMON, RVDD, LDA, NERR, NSLP
Voltage at LDK
ESD Susceptibility at all pins
Operating Junction Temperature
Storage Temperature Range
HBM, 100 pF discharged through 1.5 kΩ
-40
-40
DC current
DC current
DC current
V(LDA) = 0
Conditions
Min.
-0.7
-2
-2
-2
-2
-2
-2
-2
-2
-2
-2
-2
-0.7
Max.
6
1200
5
20
20
20
1200
1200
20
50
50
20
6
V
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
V
Unit
G001 VDD
G002 I(VDD)
G003 I(CI)
G004 I(NERR)
G005 I(MD)
G006 I()dig
G007 I(LDK)
G008 I(LDA)
G009 I(RSI)
G010 I(VSY)
G011 I(SYN)
G012 I(IMON)
G013 V()c
G014 V()h
G015 Vd()
G016 Tj
G017 Ts
-0.7
15
2
190
190
V
kV
°C
°C
THERMAL DATA
Operating Conditions: VDD = 3...5.5 V
Item
No.
T01
T02
Symbol
Ta
Rthja
Parameter
Operating Ambient Temperature Range
Thermal Resistance Chip/Ambient
surface mounted, thermal pad soldered to ca.
2 cm² heat sink
Conditions
Min.
-20
30
Typ.
Max.
85
40
°C
K/W
Unit
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.
iC-NZN
N-TYPE LASER DIODE DRIVER
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Rev B2, Page 5/17
ELECTRICAL CHARACTERISTICS
Operating Conditions: VDD = 3...5.5 V, VSY = 0 V...VDD, Tj = -20...125 °C, NSLP = hi, CID = lo; unless otherwise stated
Item
No.
001
002
003
004
005
006
007
008
Symbol
Parameter
Conditions
Min.
VDD
VSY
Ioff(VDD)
Idc(VDD)
I(VSY)
Tab
VDDon
Vc()hi
Permissible Supply Voltage
Permissible Supply Voltage at
VSY
Supply Current in VDD
Supply Current in VDD
Supply Current in VSY
Thermal Shutdown Threshold
Power-On Threshold
Clamp Voltage hi at RSI, TTL,
REGE, MD, CI, LDA, NSLP,
IMON
Clamp Voltage hi at LDK
Clamp Voltage lo at VDD, AVG,
MD, IMON, CID, EP, EN, TTL,
VSY, SYN, RGND, RVDD, LDK,
AGND, CI, LDA, RSI, REGE,
NSLP, NERR
I() = 0.1 mA, other pins open, VDD = 0
VSY
≤
VDD
NSLP = lo, all other input pins set to lo
RSI
≥
680
Ω
SYN pin open
130
1.7
0.3
3
3
5
10
Typ.
Max.
5.5
5.5
50
15
10
196
2.8
1.5
V
V
µA
mA
µA
°C
V
V
Unit
Total Device
009
010
011
Vc()hi
Vc()hi
Vc()lo
Clamp Voltage hi to VSY at SYN I() = 1 mA, other pins open, VSY = 0
I() = 1 mA, other pins open
I() = 1 mA, other pins open
0.3
12
-1.5
-0.65
1.5
-0.3
V
V
V
012
101
102
103
104
Vc()hi
V(RSI)
RSI
VLDA
Ierr(LDA)
Clamp Voltage hi at VSY, EP, EN I() = 1 mA, other pins open, VDD = 0
Voltage at RSI
Permissable Resistor at RSI
LDA Voltage Monitor Threshold
VDD = 3...3.5 V
VDD = 4.5...5.5 V
VDD
−
V(LDA), V(RSI) = VDD
430
2.5
0.68
400
400
260
100
V(LDA) = 0 V
VDD = 4.5...5.5 V
VDD = 3...3.5 V
V(LDK) = V(REGE) = V(TTL) = V(EP) = VDD,
V(MD) = 0 V
VDD = 4.5...5.5 V
VDD = 3...3.5 V
RSI = 0.68 KΩ VDD = 5.5 V
NSLP = lo, V(LDA) = VDD
1
460
510
500
520
6
580
9
9
630
880
630
V
mV
kΩ
kΩ
mV
mA
mA
nF
Current Monitor RSI, LDA
Maximum Unlimited current from V(RSI) = VDD;
VDD = 4.5...5.5 V
LDA without error signaling
VDD = 3...3.5 V
105
106
Cmin(LDA) Minimum capacitor needed at
LDA
rILDA
Current Ratio I(LDA)max / I(RSI)
470
430
610
610
107
rILDK
Current Ratio I(LDK)max / I(RSI)
400
480
960
870
630
20
560
mA
kΩ
mV
108
109
201
i(ldk)
Maximum limited current
Rdis(LDA) Discharge Resistor at LDA
V(MD)
Reference
V(MD)
−
V(RGND),
closed control loop
V(RVDD)
−
V(MD) for P-type LD
or ACC
Temperature Drift of Voltage at
MD
V(MD)
−
V(RGND)
Input Voltage Range at EP, EN
Input Differential Voltage at EP,
EN
Differential Input Impedance at
EP, EN
closed control loop
V(EP) = 0 V, V(AVG) = 0 V, N-type LD
TTL = lo, VDD = 3.0...5.5 V
TTL = lo, Vd() = |V(EP)
−
V(EN)|
TTL = lo
V(EP), V(EN) < VDD
−
1.5 V
460
0.6
200
0.6
3
2
0.8
202
203
301
302
303
304
305
dV(MD)
V(MD)
Vin()
Vd()
R()
Vt(EP)hi
Vt(EP)lo
120
510
560
VDD
−
1.4
µV/°C
mV
V
mV
kΩ
V
V
Digital Inputs/Outputs
Input Threshold Voltage hi at EP TTL = hi, EN = open
Input Threshold Voltage lo at EP TTL = hi, EN = open
Embedded System
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