M372V1680DT0-C50 datasheet, PDF

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M372V1680DT0-C50: DescriptionFast Page DRAM Module, 16MX72, 50ns, CMOS, DIMM-168; Categorystorage storage; File Size426KB，18 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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M372V1680DT0-C50 Overview

Fast Page DRAM Module, 16MX72, 50ns, CMOS, DIMM-168

M372V1680DT0-C50 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	DIMM
package instruction	DIMM, DIMM168
Contacts	168
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	50 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	1207959552 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	31.75 mm
Maximum standby current	0.03 A
Maximum slew rate	1.98 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

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DRAM MODULE

M372V160(8)0DJ(T)0-C

M372V160(8)0DJ(T)0-C Fast Page Mode

16M x 72 DRAM DIMM with ECC Using 16Mx4, 4K & 8K Refresh, 3.3V

GENERAL DESCRIPTION

The Samsung M372V160(8)0DJ(T)0-C is a 16Mx72bits

Dynamic RAM high density memory module. The Samsung

M372V160(8)0DJ(T)0-C consists of eighteen CMOS

16Mx4bits DRAMs in SOJ/TSOP-II 400mil packages and two

16 bits driver IC in TSSOP package mounted on a 168-pin

glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor

is mounted on the printed circuit board for each DRAM. The

M372V160(8)0DJ(T)0-C is a Dual In-line Memory Module and

is intended for mounting into 168 pin edge connector sockets.

FEATURES

• Part Identification

Part number

M372V1600DJ0-C

M372V1600DT0-C

M372V1680DJ0-C

M372V1680DT0-C

•

PKG

SOJ

TSOP

SOJ

TSOP

4K/64ms

8K/64ms

Ref. CBR Ref.

ROR

4K/64ms

PERFORMANCE RANGE

Speed

-C50

-C60

RAC

50ns

60ns

CAC

18ns

20ns

90ns

110ns

35ns

40ns

Fast Page Mode Operation

CAS-before-RAS Refresh capability

RAS-only and Hidden refresh capability

LVTTL compatible inputs and outputs

Single3.3V±0.3V power supply

JEDEC standard pinout & Buffered PDpin

Buffered input except RAS and DQ

PCB : Height(1250mil), double sided component

PIN CONFIGURATIONS

Pin Front Pin Front Pin Front

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

DQ16

DQ17

RSVD

CAS0

29 *CAS2 57

30 RAS0 58

OE0 59

A10

A12

41 RFU 69

42 RFU 70

OE2 72

45 RAS2 73

46 CAS4 74

47 *CAS6 75

50 RSVD 78

51 RSVD 79

52 DQ18 80

53 DQ19 81

55 DQ20 83

56 DQ21 84

DQ22

DQ23

DQ24

RFU

DQ25

DQ26

DQ27

DQ28

DQ29

DQ30

DQ31

DQ32

DQ33

DQ34

RSVD

PD1

PD3

PD5

PD7

ID0

100

101

102

103

104

105

106

107

108

109

110

111

112

Back

DQ36

DQ37

DQ38

DQ39

DQ40

DQ41

DQ42

DQ43

DQ44

DQ45

DQ46

DQ47

DQ48

DQ49

DQ50

DQ51

DQ52

RSVD

RFU

*CAS1

113

114

115

116

117

118

119

120

121

122

123

124

125

126

127

128

129

130

131

132

133

134

135

136

137

138

139

140

Back

*CAS3

*RAS1

RFU

A11

*A13

RFU

*RAS3

*CAS5

*CAS7

PDE

RSVD

DQ54

DQ55

DQ56

DQ57

141

142

143

144

145

146

147

148

149

150

151

152

153

154

155

156

157

158

159

160

161

162

163

164

165

166

167

168

Back

DQ58

DQ59

DQ60

RFU

DQ61

RSVD

DQ63

DQ64

DQ65

DQ66

DQ67

DQ68

DQ69

DQ70

DQ71

PD2

PD4

PD6

PD8

ID1

PIN NAMES

Pin Names

A0, B0, A1 - A11

A0, B0, A1 - A12

DQ0 - DQ71

W0, W2

OE0, OE2

RAS0, RAS2

CAS0, CAS4

PDE

PD1 - 8

ID0 - 1

RSVD

RFU

Function

Address Input(4K ref)

Address Input(8K ref)

Data In/Out

Read/Write Enable

Output Enable

Row Address Strobe

Column Address Strobe

Power(+3.3V)

Ground

No Connection

Presence Detect Enable

Presence Detect

ID bit

Reserved Use

Reserved for Future Use

Pins marked

′

are not used in this module.

PD & ID Table

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PD8

ID0

ID1

50NS

60NS

NOTE : A12 is used for only M372V1680DJ0/DT0-C (8K Ref.)

PD Note :PD & ID Terminals must each be pulled up through a register to V

at the next higher

level assembly. PDs will be either open (NC) or driven to V

via on-board buffer circuits.

PD : 0 for Vol of Drive IC & 1 for N.C

ID Note : IDs will be either open (NC) or connected directly to V

without a buffer.

ID : 0 for Vss & 1 for N.C

REV. 0.1 Oct. 2000

M372V1680DT0-C50 Related Products

	M372V1680DT0-C50	M372V1600DJ0-C50	M372V1680DJ0-C60	M372V1680DT0-C60	M372V1680DJ0-C50	M372V1600DT0-C50	M372V1600DT0-C60	M372V1600DJ0-C60
Description	Fast Page DRAM Module, 16MX72, 50ns, CMOS, DIMM-168	Fast Page DRAM Module, 16MX72, 50ns, CMOS, DIMM-168	Fast Page DRAM Module, 16MX72, 60ns, CMOS, DIMM-168	Fast Page DRAM Module, 16MX72, 60ns, CMOS, DIMM-168	Fast Page DRAM Module, 16MX72, 50ns, CMOS, DIMM-168	Fast Page DRAM Module, 16MX72, 50ns, CMOS, DIMM-168	Fast Page DRAM Module, 16MX72, 60ns, CMOS, DIMM-168	Fast Page DRAM Module, 16MX72, 60ns, CMOS, DIMM-168
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
Contacts	168	168	168	168	168	168	168	168
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	50 ns	50 ns	60 ns	60 ns	50 ns	50 ns	60 ns	60 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168
memory density	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit
Memory IC Type	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
memory width	72	72	72	72	72	72	72	72
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	168	168	168	168	168	168	168	168
word count	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	4096	8192	8192	8192	4096	4096	4096
Maximum seat height	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm
Maximum standby current	0.03 A	0.03 A	0.03 A	0.03 A	0.03 A	0.03 A	0.03 A	0.03 A
Maximum slew rate	1.98 mA	1.98 mA	1.8 mA	1.8 mA	1.98 mA	1.98 mA	1.8 mA	1.8 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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