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Z8060DC

Description
Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Categorystorage    storage   
File Size208KB,7 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

Z8060DC Overview

Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

Z8060DC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeDIP
package instructionDIP, DIP28,.6
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
period time250 ns
JESD-30 codeR-GDIP-T28
JESD-609 codee0
length37.1475 mm
memory density1024 bit
Memory IC TypeBI-DIRECTIONAL FIFO
memory width8
Number of functions1
Number of terminals28
word count128 words
character code128
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128X8
ExportableYES
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height5.715 mm
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
This Material Copyrighted By Its Respective Manufacturer

Z8060DC Related Products

Z8060DC Z8060DCB Z8060DI Z8060DIB
Description Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker AMD AMD AMD AMD
Parts packaging code DIP DIP DIP DIP
package instruction DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6
Contacts 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
period time 250 ns 250 ns 250 ns 250 ns
JESD-30 code R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28
JESD-609 code e0 e0 e0 e0
length 37.1475 mm 37.1475 mm 37.1475 mm 37.1475 mm
memory density 1024 bit 1024 bit 1024 bit 1024 bit
Memory IC Type BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 28 28 28 28
word count 128 words 128 words 128 words 128 words
character code 128 128 128 128
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C
organize 128X8 128X8 128X8 128X8
Exportable YES YES YES YES
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.715 mm 5.715 mm 5.715 mm 5.715 mm
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm
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