Z8060DI datasheet, PDF - EEWORLD Datasheet

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Z8060DI: DescriptionBi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28; Categorystorage storage; File Size208KB，7 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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Z8060DI Overview

Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

Z8060DI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
period time	250 ns
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.1475 mm
memory density	1024 bit
Memory IC Type	BI-DIRECTIONAL FIFO
memory width	8
Number of functions	1
Number of terminals	28
word count	128 words
character code	128
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128X8
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.715 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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Z8060DI Related Products

	Z8060DI	Z8060DC	Z8060DCB	Z8060DIB
Description	Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28	Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28	Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28	Bi-Directional FIFO, 128X8, Asynchronous, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	AMD	AMD	AMD	AMD
Parts packaging code	DIP	DIP	DIP	DIP
package instruction	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6
Contacts	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
period time	250 ns	250 ns	250 ns	250 ns
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0
length	37.1475 mm	37.1475 mm	37.1475 mm	37.1475 mm
memory density	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	28	28	28	28
word count	128 words	128 words	128 words	128 words
character code	128	128	128	128
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C
organize	128X8	128X8	128X8	128X8
Exportable	YES	YES	YES	YES
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	5.715 mm	5.715 mm	5.715 mm
Maximum supply voltage (Vsup)	5.5 V	5.25 V	5.25 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.75 V	4.75 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm

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