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IS64C1024L-15TA2

Description
Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP1-32
Categorystorage    storage   
File Size47KB,10 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS64C1024L-15TA2 Overview

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP1-32

IS64C1024L-15TA2 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP1
package instructionTSOP1-32
Contacts32
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time15 ns
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length18.4 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width8 mm
IS64C1024L
128K x 8 HIGH-SPEED
CMOS STATIC RAM
FEATURES
• High-speed access time: 15 ns
Low active and standby power
• Output Enable (OE) and two Chip Enable
(CE1 and CE2) inputs for ease in applications
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single 5V (±10%) power supply
• Temperature offerings:
Option A1: -40
o
C to +85
o
C
Option A2: -40
o
C to +105
o
C
Option A3: -40
o
C to +125
o
C
ISSI
DESCRIPTION
®
ADVANCED INFORMATION
JANUARY 2003
The
ISSI
IS64C1024L is a very high-speed, low power,
131,072-word by 8-bit CMOS static RAMs. It is fabricated
using
ISSI's
high-performance CMOS technology. This
highly reliable process coupled with innovative circuit
design techniques, yields higher performance and low
power consumption devices.
When
CE1
is HIGH or CE2 is LOW (deselected), the device
assumes a standby mode at which the power dissipation
can be reduced by using CMOS input levels.
Easy memory expansion is provided by using two Chip
Enable inputs,
CE1
and CE2. The active LOW Write Enable
(WE) controls both writing and reading of the memory.
The IS64C1024L is available in the following 32-pin
packages: 300-mil and 400-mil SOJ, and TSOP (Type I,
8x20).
FUNCTIONAL BLOCK DIAGRAM
A0-A16
DECODER
512 x 2048
MEMORY ARRAY
V
DD
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE1
CE2
OE
WE
CONTROL
CIRCUIT
1024 BLK.eps
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Advanced Information Rev. 00A
01/22/03
1

IS64C1024L-15TA2 Related Products

IS64C1024L-15TA2 IS64C1024L-15JA2 IS64C1024L-15KA2 IS64C1024L-15TA1 IS64C1024L-15KA1 IS64C1024L-15JA3 IS64C1024L-15TA3 IS64C1024L-15JA1 IS64C1024L-15KA3
Description Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP1-32 Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP1-32 Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP1-32 Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code TSOP1 SOJ SOJ TSOP1 SOJ SOJ TSOP1 SOJ SOJ
package instruction TSOP1-32 0.300 INCH, PLASTIC, SOJ-32 0.400 INCH, PLASTIC, SOJ-32 TSOP1-32 0.400 INCH, PLASTIC, SOJ-32 0.300 INCH, PLASTIC, SOJ-32 TSOP1-32 0.300 INCH, PLASTIC, SOJ-32 0.400 INCH, PLASTIC, SOJ-32
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compli compli
ECCN code 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time 15 ns 15 ns 15 ns 15 ns 15 ns 15 ns 15 ns 15 ns 15 ns
JESD-30 code R-PDSO-G32 R-PDSO-J32 R-PDSO-J32 R-PDSO-G32 R-PDSO-J32 R-PDSO-J32 R-PDSO-G32 R-PDSO-J32 R-PDSO-J32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bi 1048576 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8 8 8
Humidity sensitivity level 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 105 °C 105 °C 105 °C 85 °C 85 °C 125 °C 125 °C 85 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 SOJ SOJ TSOP1 SOJ SOJ TSOP1 SOJ SOJ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 NOT SPECIFIED NOT SPECIFIED 240 NOT SPECIFIED NOT SPECIFIED 240 NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE AUTOMOTIVE INDUSTRIAL AUTOMOTIVE
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING J BEND J BEND GULL WING J BEND J BEND GULL WING J BEND J BEND
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
Maker Integrated Silicon Solution ( ISSI ) - - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
length 18.4 mm 20.955 mm - 18.4 mm - 20.955 mm 18.4 mm 20.955 mm -
Maximum seat height 1.2 mm 3.556 mm - 1.2 mm - 3.556 mm 1.2 mm 3.556 mm -
Terminal pitch 0.5 mm 1.27 mm - 0.5 mm - 1.27 mm 0.5 mm 1.27 mm -
width 8 mm 7.62 mm - 8 mm - 7.62 mm 8 mm 7.62 mm -

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