M27C1024-80XF6 datasheet, PDF - EEWORLD Datasheet

M27C1024-80XF6: Description64KX16 UVPROM, 80ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40; Categorystorage storage; File Size279KB，15 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M27C1024-80XF6 Overview

64KX16 UVPROM, 80ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	WINDOWED, FRIT SEALED, CERAMIC, DIP-40
Contacts	40
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	80 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T40
JESD-609 code	e3
length	52.195 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	16
Number of functions	1
Number of terminals	40
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX16
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.97 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.035 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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