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UPD4482163GF-A50

Description
8M-BIT CMOS SYNCHRONOUS FAST SRAM PIPELINED OPERATION DOUBLE CYCLE DESELECT
File Size286KB,28 Pages
ManufacturerNEC ( Renesas )
Websitehttps://www2.renesas.cn/zh-cn/
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UPD4482163GF-A50 Overview

8M-BIT CMOS SYNCHRONOUS FAST SRAM PIPELINED OPERATION DOUBLE CYCLE DESELECT

DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD4482163, 4482183, 4482323, 4482363
8M-BIT CMOS SYNCHRONOUS FAST SRAM
PIPELINED OPERATION
DOUBLE CYCLE DESELECT
Description
The
µ
PD4482163 is a 524,288-word by 16-bit, the
µ
PD4482183 is a 524,288-word by 18-bit,
µ
PD4482323 is a 262,144-
word by 32-bit and the
µ
PD4482363 is a 262,144-word by 36-bit synchronous static RAM fabricated with advanced CMOS
technology using Full-CMOS six-transistor memory cell.
The
µ
PD4482163,
µ
PD4482183,
µ
PD4482323 and
µ
PD4482363 integrates unique synchronous peripheral circuitry, 2-
bit burst counter and output buffer as well as SRAM core. All input registers are controlled by a positive edge of the single
clock input (CLK).
The
µ
PD4482163,
µ
PD4482183,
µ
PD4482323 and
µ
PD4482363 are suitable for applications which require synchronous
operation, high speed, low voltage, high density and wide bit configuration, such as cache and buffer memory.
ZZ has to be set LOW at the normal operation. When ZZ is set HIGH, the SRAM enters Power Down State (“Sleep”). In
the “Sleep” state, the SRAM internal state is preserved. When ZZ is set LOW again, the SRAM resumes normal operation.
The
µ
PD4482163,
µ
PD4482183,
µ
PD4482323 and
µ
PD4482363 are packaged in 100-pin PLASTIC LQFP with a 1.4
mm package thickness for high density and low capacitive loading.
Features
Single 3.3 V power supply
Synchronous operation
Operating temperature : T
A
= 0 to 70
°C
(-A44, -A50, -A60)
T
A
=
−40
to
+85 °C
(-A44Y, -A50Y, -A60Y)
Internally self-timed write control
Burst read / write : Interleaved burst and linear burst sequence
Fully registered inputs and outputs for pipelined operation
Double-Cycle deselect timing
All registers triggered off positive clock edge
3.3 V LVTTL Compatible : All inputs and outputs
Fast clock access time : 2.8 ns (225 MHz), 3.1 ns (200 MHz), 3.5 ns (167 MHz)
Asynchronous output enable : /G
Burst sequence selectable : MODE
Sleep mode : ZZ (ZZ = Open or Low : Normal operation)
Separate byte write enable : /BW1 to /BW4, /BWE (
µ
PD4482323,
µ
PD4482363)
/BW1, /BW2, /BWE (
µ
PD4482163,
µ
PD4482183)
Global write enable : /GW
Three chip enables for easy depth expansion
Common I/O using three state outputs
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. M14904EJ3V0DS00 (3rd edition)
Date Published December 2002 NS CP(K)
Printed in Japan
The mark shows major revised points.
The mark
#
shows major revised points.
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