Low
Low Value Flat
Low
Value Flat
Value Flat
Chip
Chip Resistor
Chip
Resistor
Resistor
LRC/LRF Series
LRC/LRF Series
LRC/LRF Series
Standard
Standard 2512, 2010 and 1206 sizes
2512, 2010 and 1206 sizes
Standard
Resistance values
1206 sizes
2512, 2010 and
down to 0.003
Resistance values down to 0.003 ohms
ohms
Leach resistant
resistant solder-plated copper
Resistance values down to 0.003 ohms
Leach
solder-plated copper
wrap-around termination
wrap-around termination
Leach resistant solder-plated copper
AEC-Q200 Qualified
Low
termination
wrap-around
inductance - less than 0.2nH
Welwyn Components
Welwyn Components
·
·
·
·
AEC-Q200 Qualified
Low inductance - less than 0.2nH
AEC-Q200 Qualified
Electrical Data
Electrical
er r
Data
0°C
Pow ating at 7
Resistance range
LR1206
watts
0.5
ohms
LR1206
010 to 1R
0R
LR2010
1.0
LR2512
1.5/2.0*
LR2010
03 to 1R
0R0
1.0
200
LR2512
3 to 1R
0R00
2
1.5/2.0*
00
Power rating
Die
70°
ric withstanding voltage
at
lect
C
TCR
Resistance range
Re
an
a
in
e t
o tage
Dielectric withst
sist
d
nc
g v
ol
l
erance
watts
volts
ppm/°C
%
2
volts
0.5
200
t
R0
fa
ohms
ppm/°C
010 to 1R
±100 (Con
0
act
03
c
to
ry
R
or value below
00
05
t
0 ohms)
0R
1
f
0R
0.
3 o 1R
%
200
≤R005
00
>R005 1, 2, 5%
200
2
5%,
°C
±100 (Contact factory for value below 0.050 ohms)
90
40
80
2
mm
30
≤R005
5%, >R005 1, 2, 5%
30
100
TCR
Temperature rise at rated power
Resistance tol
Pad
nce
trace area for max power rating @ 70°C
era
and
Pad and trace area for max power rating @ 70°C
*2
e at ra ed p
total
Temperature ris
Watts
t
with
ower
solder pad and trace size of 300
°
mm
C
40
30
80
30
90
100
*2 Watts with total solder pad and trace size of 300 mm
Siz
Physical
e
Data
LR1206
LR2512
Dimensions (mm)
L
3.20±0.305
5.23±0.38
Physical Data
mm
2
2
W
1.63±0.203
2.64±0.25
H (max)
0.8
0.8
D
0.48±0.25
0.48±0.25
D1
0.48±0.25
0.48±0.25
Dimensions
LR2010
(mm)
Size
LR1206
LR2010
LR2512
L
3.20±0.305
5.23±0.38
6.50±0.38
6.50±0.38
W
3.25±0.25
H (max)
0.8
0.8
0.8
1.63±0.203
2.64±0.25
3.25±0.25
LR 1206 / 2010 / 2512
D
0.48±0.25
0.48±0.25
D1
0.48±0.25
0.48±0.25
0.48±0.25
0.48±0.25
W
L
0.8
LR 1206 / 2010 / 2512
0.48±0.25
0.48±0.25
H
W
D
L
Solder Plating
Nickel Barrier Layer
Copper Wraparound
Termination
Alumina Substrate
H
D
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Protective Overcoat
Resistive Element
Copper Termination
Nickel Barrier Layer
Copper Wraparound
Termination
Alumina Substrate
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
04.10
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
General Note
General Note
TT electronics reserves the right
the right
changes in product specification without notice or liability.
or liability.
Welwyn Components reserves
to make
to make changes in product specification without notice
All information is
is
subject to TT electronics’ own data and is considered accurate
time of going to print.
All information subject to Welwyn’s own data and is considered accurate at
at time of going to print.
23
A subsidiary of
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
TT electronics plc
04.10
03.13
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
© TT electronics plc
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Low Value Flat
Flat
Low Value
Chip Resistor
Chip Resistor
LRC/LRF
Series
LRC/LRF
Series
Welwyn Components
Dimensions (mm)
A
LR1206
LR2010
LR2512
2.0
3.05
3.7
B
4.0
6.5
7.75
C
1.25
B
A
1.5
C
1.5
4
6
7
14
16
18
21
22
Temperature Cycling
JESD22 Method JA-104
R% 0.25
R% 0.5
R% 0.5
R%
1
R% 0.5
R% 0.25
R% 0.5
R% 0.25
R% 0.5
R% 0.5
0.1
0.2
0.2
0.5
0.05
0.1
0.2
0.1
Power Rating
ref
3
AEC-Q200 Table 7
Method
Test
High Temp. Exposure MIL-STD-202 Method 108
Moisture Resistance MIL-STD-202 Method 106
Biased Humidity MIL-STD-202 Method 103
Vibration MIL-STD-202 Method 204
Thermal Shock MIL-STD-202 Method 107
Solderability
Board Flex
Terminal Strength
Short Term Overload
Low Temperature Storage
Leach Resistance
J-STD-002
AEC-Q200-005
AEC-Q200-006
6.25 x Pr for 2s
-65°C for 100 hours
Solder dip at 250°C
(add R05)
Max.
(@1R0)
Typ.
0.2
(%)
100
80
60
40
20
0
25
70
Ambient temperature
150 (°C)
R% 0.5
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108
15 Resistance to Soldering Heat MIL-STD-202 Method 210
R% 0.25 0.05
>95% coverage
LRC 25
12 1 w
2
att
LRC 20
10 0.5
1 watt
watt
LRC 12
06 0.25
.5 wa
a
w
tt
tt
90s minimum
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies to ohmic values
≥
R01.
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
LRF2512–R01GW
Type
Mounting
F
Conventional (element up)
Flip-chip (element down)
Values > R025
Values < R025
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
F
G
J
1%
2%
5%
Packing
W
T1
Tape
1206 or 2010
2512
All sizes
3000/reel
1800/reel
1000/reel
Standard
© Welwyn Components Limited
Bedlington, Northumberland NE22 7AA, UK
General
+44 (0)
Telephone:
Note
1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
04.10
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
03.13
PCB Design
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