UPD23C2000C datasheet, PDF - EEWORLD Datasheet

UPD23C2000C: DescriptionIC,ROM,2MX1,CMOS,DIP,40PIN,PLASTIC; Categorystorage storage; File Size83KB，4 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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UPD23C2000C Overview

IC,ROM,2MX1,CMOS,DIP,40PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	DIP
Contacts	40
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	250 ns
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
memory density	2097152 bit
Memory IC Type	MASK ROM
memory width	1
Number of terminals	40
word count	2097152 words
character code	2000000
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
organize	2MX1
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum slew rate	0.04 mA
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	UPD23C2000C
Description	IC,ROM,2MX1,CMOS,DIP,40PIN,PLASTIC
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	DIP
Contacts	40
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	250 ns
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
memory density	2097152 bit
Memory IC Type	MASK ROM
memory width	1
Number of terminals	40
word count	2097152 words
character code	2000000
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
organize	2MX1
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum slew rate	0.04 mA
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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